µ
PD70F3003A, 70F3025A, 70F3003A(A)
41
Data Sheet U13189EJ5V1DS
5. RECOMMENDED SOLDERING CONDITIONS
The
µ
PD70F3003A, 70F3025A, and 70F3003A(A) should be soldered and mounted under the following
recommended conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Table 5-1. Surface Mounting Type Soldering Conditions
(1)
µ
PD70F3003AGC-33-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14)
µ
PD70F3025AGC-33-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14)
Soldering Method Soldering Conditions Recommended
Condition Symbol
Infrared reflow Package peak temperature: 235°C, Time: 30 seconds max. IR35-103-3
(at 210°C or higher), Count: Three times or less, Exposure
limit: 3 days
Note
(after that, prebake at 125°C for 10 to 72 hours)
VPS Package peak temperature: 215°C, Time: 25 to 40 seconds VP15-103-3
(at 200°C or higher), Count: Three times or less, Exposure
limit: 3 days
Note
(after that, prebake at 125°C for 10 to 72 hours)
Partial heating Pin temperature: 300°C max., Time 3 seconds max.
(per pin row)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remark For soldering methods and conditions other than those recommended above, consult an NEC Electronics
sales representative.
(2)
µ
PD70F3003AGC-33-8EU-A: 100-pin plastic LQFP (fine pitch) (14 × 14)
µ
PD70F3025AGC-33-8EU-A: 100-pin plastic LQFP (fine pitch) (14 × 14)
Soldering Method Soldering Conditions Recommended
Condition Symbol
Infrared reflow Package peak temperature: 260°C, Time: 60 seconds max. IR60-207-3
(at 220°C or higher), Count: Three times or less, Exposure
limit: 7 days
Note
(after that, prebake at 125°C for 20 to 72 hours)
Wave soldering For details,consult an NEC Electronics sales representative.
Partial heating Pin temperature: 350°C max., Time: 3 seconds max.
(per pin row)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remarks 1. Products with -A at the end of the part number are lead-free products.
2. For soldering methods and conditions other than those recommended above, consult an NEC
Electronics sales representative.
µ
PD70F3003A, 70F3025A, 70F3003A(A)
42
Data Sheet U13189EJ5V1DS
(3)
µ
PD70F3003AGC(A)-33-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14)
Soldering Method Soldering Conditions Recommended
Condition Symbol
Infrared reflow Package peak temperature: 235°C, Time: 30 seconds max. IR35-103-2
(at 210°C or higher), Count: Two times or less, Exposure
limit: 3 days
Note
(after that, prebake at 125°C for 10 to 72
hours)
VPS Package peak temperature: 215°C, Time: 25 to 40 seconds VP15-103-2
(at 200°C or higher), Count: Two times or less, Exposure
limit: 3 days
Note
(after that, prebake at 125°C for 10 to 72
hours)
Partial heating Pin temperature: 300°C max., Time 3 seconds max.
(per pin row)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remark For soldering methods and conditions other than those recommended above, consult an NEC Electronics
sales representative.
µ
PD70F3003A, 70F3025A, 70F3003A(A)
43
Data Sheet U13189EJ5V1DS
APPENDIX NOTES ON TARGET SYSTEM DESIGN
The following shows a diagram of the connection conditions between the in-circuit emulator option board
and conversion connector. Design your system making allowances for conditions such as the form of parts
mounted on the target system as shown below.
Target system
Note YQSOCKET100SDN (included with IE-703002-MC) can be inserted here to adjust the height (height: 3.2 mm).
NQPACK100SD
YQPACK100SD
132.24 mm
Note
In-circuit emulator option board
Conversion connector
IE-703003-MC-EM1
Side view
Top view
Connection
condition diagram
In-circuit emulator
IE-703002-MC
YQGUIDE
Target system
YQPACK100SD, NQPACK100SD,
YQGUIDE
IE-703003-MC-EM1
IE-703002-MC
Pin 1 position
13.3 mm
24 mm
21.58 mm
15.24 mm
75 mm
31.84 mm
Target system
NQPACK100SD
YQPACK100SD
IE-703003-MC-EM1
Connect to
IE-703002-MC.
YQGUIDE
Pin 1 position

UPD70F3025AGC-33-8EU-A

Mfr. #:
Manufacturer:
Renesas Electronics
Description:
32-bit Microcontrollers - MCU 32BIT V853A FLASH 256K/8K
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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