MT18HVS25672PKZ-80EH2

Table 11: DDR2 I
DD
Specifications and Conditions – 4GB (Die Revision C)
Values are shown for the MT47H512M8 DDR2 SDRAM only and are computed from values specified in the 4Gb TwinDie
(512 Meg x 8) component data sheet
Parameter Symbol
-80E/
-800 -667 Units
Operating one bank active-precharge current:
t
CK =
t
CK (I
DD
),
t
RC =
t
RC (I
DD
),
t
RAS =
t
RAS MIN (I
DD
); CKE is HIGH, S# is HIGH between valid commands; Address
bus inputs are switching; Data bus inputs are switching
I
CDD0
783 738 mA
Operating one bank active-read-precharge current: I
OUT
= 0mA; BL = 4, CL =
CL (I
DD
), AL = 0;
t
CK =
t
CK (I
DD
),
t
RC =
t
RC (I
DD
),
t
RAS =
t
RAS MIN (I
DD
),
t
RCD =
t
RCD
(I
DD
); CKE is HIGH, S# is HIGH between valid commands; Address bus inputs are
switching; Data pattern is same as I
DD4W
I
CDD1
882 828 mA
Precharge power-down current: All device banks idle;
t
CK =
t
CK (I
DD
); CKE is
LOW; Other control and address bus inputs are stable; Data bus inputs are floating
I
CDD2P
216 216 mA
Precharge quiet standby current: All device banks idle;
t
CK =
t
CK (I
DD
); CKE is
HIGH, S# is HIGH; Other control and address bus inputs are stable; Data bus inputs
are floating
I
CDD2Q
378 333 mA
Precharge standby current: All device banks idle;
t
CK =
t
CK (I
DD
); CKE is HIGH, S#
is HIGH; Other control and address bus inputs are switching; Data bus inputs are
switching
I
CDD2N
423 378 mA
Active power-down current: All device banks open;
t
CK =
t
CK
(I
DD
); CKE is LOW; Other control and address bus inputs are stable;
Data bus inputs are floating
Fast PDN exit
MR[12] = 0
I
CDD3P
333 333 mA
Slow PDN exit
MR[12] = 1
234 234
Active standby current: All device banks open;
t
CK =
t
CK (I
DD
),
t
RAS =
t
RAS MAX
(I
DD
),
t
RP =
t
RP (I
DD
); CKE is HIGH, S# is HIGH between valid commands; Other con-
trol and address bus inputs are switching; Data bus inputs are switching
I
CDD3N
558 513 mA
Operating burst write current: All device banks open; Continuous burst writes;
BL = 4, CL = CL (I
DD
), AL = 0;
t
CK =
t
CK (I
DD
),
t
RAS =
t
RAS MAX (I
DD
),
t
RP =
t
RP (I
DD
);
CKE is HIGH, S# is HIGH between valid commands; Address bus inputs are switch-
ing; Data bus inputs are switching
I
CDD4W
1278 1098 mA
Operating burst read current: All device banks open; Continuous burst read,
I
OUT
= 0mA; BL = 4, CL = CL (I
DD
), AL = 0;
t
CK =
t
CK (I
DD
),
t
RAS =
t
RAS MAX (I
DD
),
t
RP
=
t
RP (I
DD
); CKE is HIGH, S# is HIGH between valid commands; Address bus inputs
are switching; Data bus inputs are switching
I
CDD4R
1278 1098 mA
Burst refresh current:
t
CK =
t
CK (I
DD
); REFRESH command at every
t
RFC (I
DD
) inter-
val; CKE is HIGH, S# is HIGH between valid commands; Other control and address
bus inputs are switching; Data bus inputs are switching
I
CDD5
1638 1593 mA
Self refresh current: CK and CK# at 0V; CKE 0.2V; Other control and address bus
inputs are floating; Data bus inputs are floating
I
CDD6
216 216 mA
Operating bank interleave read current: All device banks interleaving reads,
I
OUT
= 0mA; BL = 4, CL = CL (I
DD
), AL =
t
RCD (I
DD
) - 1 ×
t
CK (I
DD
);
t
CK =
t
CK (I
DD
),
t
RC =
t
RC (I
DD
),
t
RRD =
t
RRD (I
DD
),
t
RCD =
t
RCD (I
DD
); CKE is HIGH, S# is HIGH between val-
id commands; Address bus inputs are stable during deselects; Data bus inputs are
switching
I
CDD7
2088 1908 mA
2GB, 4GB (x72, ECC, DR) 244-Pin DDR2 VLP Mini-RDIMM
I
DD
Specifications
PDF: 09005aef83d94997
hvs18c256_512x72pkz.pdf - Rev. E 4/14 EN
13
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2010 Micron Technology, Inc. All rights reserved.
Register and PLL Specifications
Table 12: Register Specifications
SSTU32866 devices or equivalent
Parameter Symbol Pins Condition Min Max Units
DC high-level
input voltage
V
IH(DC)
Control, command,
address
SSTL_18 V
REF(DC)
+ 125 V
DDQ
+ 250 mV
DC low-level
input voltage
V
IL(DC)
Control, command,
address
SSTL_18 0 V
REF(DC)
- 125 mV
AC high-level
input voltage
V
IH(AC)
Control, command,
address
SSTL_18 V
REF(DC)
+ 250 mV
AC low-level
input voltage
V
IL(AC)
Control, command,
address
SSTL_18 V
REF(DC)
- 250 mV
Output high
voltage
V
OH
Parity output LVCMOS 1.2 V
Output low voltage V
OL
Parity output LVCMOS 0.5 V
Input current I
I
All pins V
I
= V
DD
or V
SS
±0.5 µA
Static standby I
DD
All pins RESET# = V
SSQ
(I
O
= 0) 100 µA
Static operating I
DD
All pins RESET# = V
SS
; V
I
= V
IH(AC)
or V
IL(DC)
I
O
= 0
40 mA
Dynamic operating
(clock tree)
I
DDD
N/A RESET# = V
DD
;
V
I
= V
IH(DC)
or V
IL(AC)
,
I
O
= 0; CK and CK#
switching 50% duty cy-
cle
Varies by
manufacturer
µA
Dynamic operating
(per each input)
I
DDD
N/A RESET# = V
DD
;
V
I
= V
IH(AC)
or V
IL(DC)
,
I
O
= 0; CK and CK#
switching 50% duty
cycle; One data in/out
switching at
t
CK/2,
50% duty cycle
Varies by
manufacturer
µA
Input capacitance
(per device, per pin)
C
IN
All inputs except
RESET#
V
I
= V
REF
±250mV;
V
DD
= 1.8V
2.5 3.5 pF
Input capacitance
(per device, per pin)
C
IN
RESET# V
I
= V
DD
or V
SS
Varies by
manufacturer
Varies by
manufacturer
pF
Note:
1. Timing and switching specifications for the register listed are critical for proper opera-
tion of the DDR2 SDRAM RDIMMs. These are meant to be a subset of the parameters for
the specific device used on the module. Detailed information for this register is available
in JEDEC standard JESD82.
2GB, 4GB (x72, ECC, DR) 244-Pin DDR2 VLP Mini-RDIMM
Register and PLL Specifications
PDF: 09005aef83d94997
hvs18c256_512x72pkz.pdf - Rev. E 4/14 EN
14
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2010 Micron Technology, Inc. All rights reserved.
Table 13: PLL Specifications
CU877 device or equivalent
Parameter Symbol Pins Condition Min Max Units
DC high-level
input voltage
V
IH
RESET# LVCMOS 0.65 × V
DD
V
DC low-level
input voltage
V
IL
RESET# LVCMOS 0.35 × V
DD
V
Input voltage (limits) V
IN
RESET#, CK,
CK#
- 0.3 V
DD
+ 0.3 V
DC high-level
input voltage
V
IH
CK, CK# Differential input 0.65 × V
DD
V
DC low-level
input voltage
V
IL
CK, CK# Differential input 0.35 × V
DD
V
Input differential-pair
cross voltage
V
IX
CK, CK# Differential input (V
DDQ
/2) - 0.15 (V
DD
/2) + 0.15 V
Input differential
voltage
V
ID(DC)
CK, CK# Differential input 0.3 V
DD
+ 0.4 V
Input differential
voltage
V
ID(AC)
CK, CK# Differential input 0.6 V
DD
+ 0.4 V
Input current I
I
RESET# V
I
= V
DD
or V
SS
–10 10 µA
CK, CK# V
I
= V
DD
or V
SS
–250 250 µA
Output disabled
current
I
ODL
RESET# = V
SS
; V
I
= V
IH(AC)
or V
IL(DC)
100 µA
Static supply current I
DDLD
CK = CK# = LOW 500 µA
Dynamic supply I
DD
N/A CK, CK# = 270 MHz, all
outputs open (not con-
nected to PCB)
300 mA
Input capacitance C
IN
Each input V
I
= V
DD
or V
SS
2 3 pF
Table 14: PLL Clock Driver Timing Requirements and Switching Characteristics
Parameter Symbol Min Max Units
Stabilization time
t
L 15 μs
Input clock slew rate slr(i) 1.0 4.0 V/ns
SSC modulation frequency 30 33 kHz
SSC clock input frequency deviation 0.0 –0.5 %
PLL loop bandwidth (–3dB from unity gain) 2.0 MHz
Note:
1. PLL timing and switching specifications are critical for proper operation of the DDR2
DIMM. This is a subset of parameters for the specific PLL used. Detailed PLL information
is available in JEDEC standard JESD82.
2GB, 4GB (x72, ECC, DR) 244-Pin DDR2 VLP Mini-RDIMM
Register and PLL Specifications
PDF: 09005aef83d94997
hvs18c256_512x72pkz.pdf - Rev. E 4/14 EN
15
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2010 Micron Technology, Inc. All rights reserved.

MT18HVS25672PKZ-80EH2

Mfr. #:
Manufacturer:
Micron
Description:
MODULE DDR2 SDRAM 2GB 244MRDIMM
Lifecycle:
New from this manufacturer.
Delivery:
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