NXP Semiconductors
SL3S4011_4021
UCODE I²C
SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product data sheet Rev. 3.5 — 18 September 2018
COMPANY PUBLIC 204935 25 / 30
16 Abbreviations
Table 19. Abbreviations
Acronym Description
CRC Cyclic Redundancy Check
CW Continuous Wave
EEPROM Electrically Erasable Programmable Read Only Memory
EPC Electronic Product Code (containing Header, Domain Manager, Object Class
and Serial Number)
FM0 Bhi phase space modulation
HBM Human Body Model
IC Integrated Circuit
LSB Least Significant Byte/Bit
MSB Most Significant Byte/Bit
NRZ Non-Return to Zero coding
RF Radio Frequency
RTF Reader Talks First
Tari Type A Reference Interval (ISO 18000-6)
UHF Ultra High Frequency
X
xb
Value in binary notation
XX
hex
Value in hexadecimal notation
17 References
1. I
2
C-bus specification and user manual (NXP standard UM10204.pdf / Rev. 03 - 19
June 2007)
2. EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF RFID Protocol for
Communications at 860 MHz - 960 MHz Version 1.2.0
3. EPC Conformance Standard Version 1.0.5
4. ESD Method SNW -FQ-302A
5. ISO/IEC 18000-1: Information technology - Radio frequency identification for item
management - Part 1: Reference architecture and definition of parameters to be
standardized
6. Errata Sheet UCODE I²C (NXP document ES3715.pdf)
NXP Semiconductors
SL3S4011_4021
UCODE I²C
SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product data sheet Rev. 3.5 — 18 September 2018
COMPANY PUBLIC 204935 26 / 30
18 Revision history
Table 20. Revision history
Document ID Release date Data sheet status Change notice Supersedes
SL3S4011_4021 v. 3.5 20180918 Product data sheet - SL3S4011_4021 v. 3.4
Modifications: Table 18: Unit of V
DD
corrected
Section 2.4: Bullet "Encoding speed one word 5 ms" added
SL3S4011_4021 v. 3.4 20170524 Product data sheet - SL3S4011_4021 v. 3.3
Modifications: Write endurance updated into 100 kcycles
SL3S4011_4021 v. 3.3 20170215 Product data sheet - SL3S4011_4021 v. 3.2
Modifications: Table 2 Marking added
Table 18: Impedances for all frequencies added
References to errata sheet added
Minor editorial updates
SL3S4011_4021 v. 3.2 20151012 Product data sheet - SL3S4011_4021 v. 3.1
Modifications: Section 10.1 "UCODE I
2
C special feature": "RF - I
2
C Bridge feature" updated
Minor editorial updates
SL3S4011_4021 v. 3.1 20130703 Product data sheet - SL3S4011_4021 v. 3.0
Modifications: General update
SL3S4011_4021 v. 3.0 20130416 Product data sheet - SL3S4011_4021 v. 2.3
Modifications: Data sheet status changed to Product data sheet
SL3S4011_4021 v. 2.3 20130305 Preliminary data sheet - SL3S4011_4021 v. 2.2
Modifications: General update
Security status changed into COMPANY PUBLIC
SL3S4011_4021 v. 2.2 20121127 Preliminary data sheet SL3S4011_4021 v. 2.1
Modifications: General update
SL3S4011_4021 v. 2.1 20120726 Preliminary data sheet - SL3S4001FHK v. 2.0
Modifications: General update
SL3S4011_4021 v. 2.0 20120627 Preliminary data sheet - SL3S4001FHK v. 1.2
Modifications: General update
SL3S4001FHK v. 1.2 20111004 Objective data sheet - SL3S4001FHK v. 1.1
Modifications: Table 1 "Ordering information": updated
Figure 3 "UCODE I2C wafer layout": values updated
SL3S4001FHK v. 1.1 20110707 Objective data sheet - SL3S4001FHK v. 1.0
Modifications: Table 3 "Mechanical properties XQFN8": updated
Section 10.6 "Addressing": updated
SL3S4001FHK v. 1.0 20110609 Objective data sheet - -
NXP Semiconductors
SL3S4011_4021
UCODE I²C
SL3S4011_4021 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product data sheet Rev. 3.5 — 18 September 2018
COMPANY PUBLIC 204935 27 / 30
19 Legal information
19.1 Data sheet status
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet Development This document contains data from the objective specification for product
development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple
devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
19.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not
give any representations or warranties, expressed or implied, as to the
accuracy or completeness of such information and shall have no liability
for the consequences of use of such information. NXP Semiconductors
takes no responsibility for the content in this document if provided by an
information source outside of NXP Semiconductors. In no event shall NXP
Semiconductors be liable for any indirect, incidental, punitive, special or
consequential damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the removal or replacement
of any products or rework charges) whether or not such damages are based
on tort (including negligence), warranty, breach of contract or any other
legal theory. Notwithstanding any damages that customer might incur for
any reason whatsoever, NXP Semiconductors’ aggregate and cumulative
liability towards customer for the products described herein shall be limited
in accordance with the Terms and conditions of commercial sale of NXP
Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes
no representation or warranty that such applications will be suitable
for the specified use without further testing or modification. Customers
are responsible for the design and operation of their applications and
products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications
and products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with
their applications and products. NXP Semiconductors does not accept any
liability related to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications or products, or
the application or use by customer’s third party customer(s). Customer is
responsible for doing all necessary testing for the customer’s applications
and products using NXP Semiconductors products in order to avoid a
default of the applications and the products or of the application or use by
customer’s third party customer(s). NXP does not accept any liability in this
respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.

SL3S4011FHK,125

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
RFID Transponders SL3S4011FHK/XQFN8(U)///REEL 7 Q3 NDP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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