NXP Semiconductors
TFA9872_SDS
High Efficiency Class-D Audio Amplifier with Speaker-as-Microphone
TFA9872_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product short data sheet Rev. 1 — 12 April 2017
COMPANY PUBLIC 22 / 32
l
2
C
SPK
l
2
S
SDA
CTRL (I
2
C)
AUDIO IN (TDM)
SPKBST (TDM)
SCL
DATAIN
FS
BCK
DATAO
RST
INT
BASEBAND
PROCESSOR
TFA9872
PDMCLK
PDMDAT
SDA
ADS1
SCL
DATAIN
FS
BCK
DATAO
RST
INT
1.8 V
TFA9872
PDMCLK
PDMDAT
aaa-026445
1.8 V
C
VDDD
100 nF
V
DD
D/
V
DD
E
1 µH
V
B
A
T
I
NB
1 nF
22 µF
C
VBAT
L
BST
C
BST
R
FVBAT
5.1 Ω
1 µF
C
FVBAT
1.8 V
C
VDDD
100 nF
VDDD/
VDDE
VBAT
INB
R
FVBAT
5.1 Ω
1 µF
C
FVBAT
AUXSAMP
TRSTN
AUXSAMN
TEST2
GNDD
GNDP
GNDB
ADS2
TEST1
AUX
SA
MP
TRSTN
AUXSAMN
TEST
2
GNDD
GN
DP
GN
DB
AD
S2
AD
S1
TEST
1
+
-
speaker
OUTA
OUTB
C
VDDP
33 µF
VBST
+
-
speaker
OUTA
OUTB
C
VDDP
33 µF
VBST
V
DDP
V
DDP
R
HVBAT
1 MΩ
Figure 9. Typical stereo application (using a single coil)
NXP Semiconductors
TFA9872_SDS
High Efficiency Class-D Audio Amplifier with Speaker-as-Microphone
TFA9872_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product short data sheet Rev. 1 — 12 April 2017
COMPANY PUBLIC 23 / 32
+
-
speaker
SDACTRL (I
2
C)
AUDIO IN (TDM)
SPKBST (TDM)
OUTA
OUTB
SCL
DATAIN
FS
BCK
DATAO
RST
INT
TFA9872
aaa-021844
C
VDDP
33 µF
VBST
VDDP
1.8 V
C
VDDD
100 nF
V
D
D
D
/
V
D
D
E
1 µH
VB
A
T
IN
B
1 nF
22 µF
C
VBAT
L
BST
C
BST
R
FVBAT
5.1 Ω
1 µF
C
FVBAT
l
2
C
SPK
l
2
S
BASEBAND
PROCESSOR
PDM
SaM (PDM)
PDMCLK
PDMDAT
TEST2
TRSTN
TEST1
GNDD
GNDP
GNDB
ADS2
ADS1
AUXSAMN
AUXSAMP
F
AUX1
F
AUX2
+
-
speaker
100 pF
C
AUX1
C
AUX2
100 pF
33 nF
C
AUX3
R
AUX1
R
AUX2
The configuration shown also supports speaker playback
Figure 10. Typical SaM application
NXP Semiconductors
TFA9872_SDS
High Efficiency Class-D Audio Amplifier with Speaker-as-Microphone
TFA9872_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2017. All rights reserved.
Product short data sheet Rev. 1 — 12 April 2017
COMPANY PUBLIC 24 / 32
13 Package outline
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT1459-2 - - -
sot1459-2_po
16-02-25
16-03-01
Unit
mm
max
nom
min
0.29 3.16 2.49
2.4 0.05 0.03
A
Dimensions (mm are the original dimensions)
WLCSP42: wafer level chip-scale package; 42 bumps; 3.13 x 2.46 x 0.50 mm SOT1459-2
A
1
A
2
0.325
0.275
0.26 3.13 2.46 0.4
b D E e e
1
2.0
e
2
v w
0.02
0.23 3.10 2.43
0.365 0.365 0.215
Z
D1
Z
D2
Z
E2
0.245
Z
E1
y
0.300
0.23
0.17
0.20
0.54
0.46
0.50
0
scale
3 mm
detail X
X
C
y
654321
e
2
A
ball A1
index area
ball A1
index area
B
E
A
D
A
A
2
A
1
b
AC
B
Ø v
CØ w
e
1
e
e
Z
D2
Z
E2
Z
E1
Z
D1
B
C
D
E
F
G
Figure 11. Package outline TFA9872AUK/N1 (WLSCP42)

TFA9872CUK/N1Z

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Audio Amplifiers TFA9872CUK/WLCSP42//N1/REEL 7 Q1 DP CIRCUIT ELEME
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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