DocID018534 Rev 5 13/19
STGIPS14K60T Applications information
19
4 Applications information
Figure 10. Typical application circuit
AM09321v2
Applications information STGIPS14K60T
14/19 DocID018534 Rev 5
4.1 Recommendations
Input signal HIN is active high logic. A 85 k (typ.) pull down resistor is built-in for each
high side input. If an external RC filter is used, for noise immunity, pay attention to the
variation of the input signal level.
Input signal /LIN is active low logic. A 720 k (typ.) pull-up resistor, connected to an
internal 5 V regulator through a diode, is built-in for each low side input.
To prevent the input signals oscillation, the wiring of each input should be as short as
possible.
By integrating an application specific type HVIC inside the module, direct coupling to
MCU terminals without any opto-coupler is possible.
Each capacitor should be located as nearby the pins of IPM as possible.
Low inductance shunt resistors should be used for phase leg current sensing.
Electrolytic bus capacitors should be mounted as close to the module bus terminals as
possible. Additional high frequency ceramic capacitor mounted close to the module
pins will further improve performance.
The SD signal should be pulled up to 5 V / 3.3 V with an external resistor.
Note: For further details, refer to AN3338.
Table 14. Recommended operating conditions
Symbol Parameter Conditions
Value
Unit
Min. Typ. Max.
V
PN
Supply Voltage Applied between P-Nu, Nv, Nw 300 400 V
V
CC
Control supply voltage Applied between V
CC
-GND 13.5 15 18 V
V
BS
High side bias voltage
Applied between V
BOOTi
-OUT
i
for
i = U, V, W
13 18 V
t
dead
Blanking time to
prevent Arm-short
For each input signal 1 µs
f
PWM
PWM input signal
-40°C < T
c
< 100°C
-40°C < T
j
< 125°C
20 kHz
T
C
Case operation
temperature
100 °C
DocID018534 Rev 5 15/19
STGIPS14K60T Package information
19
5 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Please refer to dedicated technical note TN0107 for mounting instructions.
5.1 SDIP-25L package information
Figure 11. SDIP-25L package outline
B

STGIPS14K60T

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
IGBT Modules SLLIMM IPM 3-Phase 14A 600V Rugged IGBT
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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