CS5361
10 DS467F2
DC ELECTRICAL CHARACTERISTICS
GND = 0 V, all voltages with respect to ground. MCLK=12.288 MHz; Master Mode.
Notes: 8. Power Down Mode is defined as RST = Low with all clocks and data lines held static.
9. Valid with the recommended capacitor values on FILT+ and VQ as shown in the Typical Connection
Diagram.
DIGITAL CHARACTERISTICS
THERMAL CHARACTERISTICS
Parameter Symbol Min Typ Max Unit
Power Supply Current VA = 5 V
(Normal Operation) VL,VD = 5 V
VL,VD = 3.3 V
I
A
I
D
I
D
-
-
-
17.5
22
14.5
21.5
27.5
17
mA
mA
mA
Power Supply Current VA = 5 V
(Power-Down Mode) (Note 8) VL,VD = 5 V
I
A
I
D
-
-
100
100
-
-
µA
µA
Power Consumption
(Normal Operation) VA, VD, VL = 5 V
VA = 5 V, VL, VD = 3.3 V
(Power-Down Mode)
-
-
-
-
-
-
198
135
1
243
161
-
mW
mW
mW
Power Supply Rejection Ratio (1 kHz) (Note 9) PSRR - 65 - dB
V
Q
Nominal Voltage
Output Impedance
Maximum allowable DC current source/sink
-
-
-
2.5
25
0.01
-
-
-
V
kΩ
mA
Filt+ Nominal Voltage
Output Impedance
Maximum allowable DC current source/sink
-
-
-
5
15
0.01
-
-
-
V
kΩ
mA
Parameter Symbol Min Typ Max Units
High-Level Input Voltage (% of VL) V
IH
70% - - V
Low-Level Input Voltage (% of VL) V
IL
--30%V
High-Level Output Voltage at I
o
= 100 µA(% of VL)V
OH
70% - - V
Low-Level Output Voltage at I
o
= 100 µA(% of VL)V
OL
--15%V
OVFL
Current Sink
I
ovfl
--4.0mA
Input Leakage Current (all pins except SCLK and LRCK) I
in
-10 - 10 µA
Input Leakage Current (SCLK and LRCK) I
in
-25 - 25 µA
Parameter Symbol Min Typ Max Unit
Allowable Junction Temperature - - 135 °C
Junction to Ambient Thermal Impedance
(Multi-layer PCB) TSSOP
(Multi-layer PCB) SOIC
(Single-layer PCB) TSSOP
(Single-layer PCB) SOIC
θ
JA-TM
θ
JA-SM
θ
JA-TS
θ
JA-SS
-
-
-
-
70
60
105
80
-
-
-
-
°C/W
°C/W
°C/W
°C/W
