AD7851
–18–
REV. B
REFERENCE SECTION
For specified performance, it is recommended that when using
an external reference this reference should be between 4 V and
the analog supply AV
DD
. The connections for the relevant refer-
ence pins are shown in the typical connection diagrams. If the
internal reference is being used, the REF
IN
/REF
OUT
pin should
have a 100 nF capacitor connected to AGND very close to the
REF
IN
/REF
OUT
pin. These connections are shown in Figure 18.
If the internal reference is required for use external to the ADC,
it should be buffered at the REF
IN
/REF
OUT
pin and a 100 nF
capacitor connected from this pin to AGND. The typical noise
performance for the internal reference with 5 V supplies is
150 nV/Hz @ 1 kHz and dc noise is 100 µV p-p.
REF
IN
/REF
OUT
AD7851
ANALOG
SUPPLY
5V
AV
DD
DV
DD
0.01F
0.1F
10F
C
REF1
C
REF2
0.01F
0.1F
470nF
0.1F
10
Figure 18. Relevant Connections When Using
Internal Reference
The other option is that the REF
IN
/REF
OUT
pin be overdriven
by connecting it to an external reference. This is possible due to
the series resistance from the REF
IN
/REF
OUT
pin to the internal
reference. This external reference can have a range that includes
AV
DD
. When using AV
DD
as the reference source, the 100 nF
capacitor from the REF
IN
/REF
OUT
pin to AGND should be as
close as possible to the REF
IN
/REF
OUT
pin, and also the C
REF1
pin should be connected to AV
DD
to keep this pin at the same
level as the reference. The connections for this arrangement are
shown in Figure 19. When using AV
DD
it may be necessary to
add a resistor in series with the AV
DD
supply. This will have the
effect of filtering the noise associated with the AV
DD
supply.
REF
IN
/REF
OUT
AD7851
ANALOG
SUPPLY
5V
AV
DD
DV
DD
0.01F
0.1F
10F
C
REF1
C
REF2
0.01F
0.01F
470nF
0.1F
10
10
Figure 19. Relevant Connections When Using AV
DD
as the Reference
AD7851 PERFORMANCE CURVES
Figure 20 shows a typical FFT plot for the AD7851 at 333 kHz
sample rate and 10 kHz input frequency.
FREQUENCY (kHz)
0
–20
–120
0 10020
SNR (dB)
40 60 80
–40
–60
–80
–100
AV
DD
= DV
DD
= 5V
f
SAMPLE
= 333kHz
f
IN
= 10kHz
SNR = 79.5dB
THD = –95.2
Figure 20. FFT Plot
Figure 21 shows the SNR versus frequency for a 5 V supply and
a 4.096 external reference (5 V reference is typically 1 dB better
performance).
INPUT FREQUENCY
(
kHz
)
79
75
0 16620 50 120 140
78
77
76
S(N+D) RATIO (dB)
10 80 100
Figure 21. SNR vs. Frequency
Figure 22 shows the power supply rejection ratio versus fre-
quency for the part. The power supply rejection ratio is defined
as the ratio of the power in ADC output at frequency f to the
power of a full-scale sine wave.
PSRR (dB) = 10 log (Pf/Pfs)
Pf is the power at frequency f in ADC output, Pfs is the power
of a full-scale sine wave. Here a 100 mV peak-to-peak sine wave
is coupled onto the AV
DD
supply while the digital supply is left
unaltered.
–19–
REV. B
AD7851
INPUT FREQUENCY (kHz)
–72
–74
–90
0.91 10013.4 25.7 38.3 50.3
–76
–78
–80
–88
PSRR (dB)
–82
–84
–86
63.5 74.8 87.4
AV
DD
= DV
DD
= 5.0V
100mV pk-pk SINEWAVE ON AV
DD
REF
IN
= 4.098 EXT REFERENCE
Figure 22. PSRR vs. Frequency
POWER-DOWN OPTIONS
The AD7851 provides flexible power management to allow the
user to achieve the best power performance for a given throughput
rate. The power management options are selected by programming
the power management bits, PMGT1 and PMGT0, in the con-
trol register and by use of the SLEEP pin. Table VI summarizes
the power-down options that are available and how they can be
selected by using either software, hardware, or a combination of
both. The AD7851 can be fully or partially powered down. When
fully powered down, all the on-chip circuitry is powered down
and I
DD
is 1 µA typ. If a partial power-down is selected, then all
the on-chip circuitry except the reference is powered down and I
DD
is 400 µA typ. The choice of full or partial power-down does not
give any significant improvement in throughput with a power-down
between conversions. (This is discussed in the Power-Up Times
section which follows.) But a partial power-down does allow the
on-chip reference to be used externally even though the rest of the
AD7851 circuitry is powered down. It also allows the AD7851 to
be powered up faster after a long power-down period when using
the on-chip reference. (See the Using the Internal (On-Chip) Ref-
erence section which follows.)
When using the SLEEP pin, the power management bits
PMGT1 and PMGT0 should be set to 0 (default status on
power-up). Bringing the SLEEP pin logic high ensures normal
operation, and the part does not power down at any stage. This
may be necessary if the part is being used at high throughput
rates when it is not possible to power down between conver-
sions. If the user wishes to power down between conversions at
lower throughput rates (that is, <100 kSPS for the AD7851) to
achieve better power performances, then the SLEEP pin should
be tied logic low.
If the power-down options are to be selected in software only,
then the SLEEP pin should be tied logic high. By setting the
power management bits PMGT1 and PMGT0 as shown in
Table VI, a full power-down, full power-up, full power-down
between conversions, and a partial power-down between con-
versions can be selected.
A combination of hardware and software selection can also be
used to achieve the desired effect.
Table VI. Power Management Options
PMGT1 PMGT0 SLEEP
Bit Bit Pin Comment
000Full power-down between
conversions (HW/SW)
001Full power-up (HW/SW)
01XFull power-down between
conversions (SW)
10XFull power-down (SW)
11XPartial power-down between
conversions (SW)
SW = Software selection, HW = Hardware selection.
0V TO V
REF
INPUT
DIN AT DGND
=> NO WRITING
TO DEVICE
3-WIRE MODE
SELECTED
CURRENT, I = 12mA TYP
AV
DD
DV
DD
AIN(+)
AIN(–)
AMODE
C
REF1
C
REF2
SLEEP
DIN
DOUT
SYNC
SM1
SM2
CONVST
AGND
DGND
CLKIN
SCLK
REF
IN
/REF
OUT
POLARITY
AD7851
ANALOG
(5V)
0.01F 0.1F
10F
DV
DD
UNIPOLAR RANGE
0.01F
SERIAL MODE
SELECTION BITS
MASTER
CLOCK
INPUT
CONVERSION
START INPUT
SERIAL DATA OUTPUT
0.1F
CAL
INTERNAL
REFERENCE
6MHz/7MHz
OSCILLATOR
SERIAL CLOCK OUTPUT
285kHz/333kHz PULSE
GENERATOR
OPTIONAL
EXTERNAL
REFERENCE
0.01F
0.1F
470nF
AUTO CAL ON
POWER-UP
REF198
AUTO POWER-
DOWN AFTER
CONVERSION
LOW POWER
C/P
Figure 23. Typical Low Power Circuit
AD7851
–20–
REV. B
POWER-UP TIMES
Using an External Reference
When the AD7851 is powered up, the part is powered up
from one of two conditions: first, when the power supplies
are initially powered up and; secondly, when the parts are
powered up from either a hardware or software power-down
(see previous section).
When AV
DD
and DV
DD
are powered up, the AD7851 enters a
mode whereby the CONVST signal initiates a timeout followed
by a self-calibration. The total time taken for this timeout and
calibration is approximately 35 ms (see the Automatic Calibra-
tion on Power-On section). During power-up, the functionality
of the SLEEP pin is disabled, that is, the part will not power
down until the end of the calibration if SLEEP is tied logic low.
The power-up calibration mode can be disabled if the user
writes to the control register before a CONVST signal is applied. If
the timeout and self-calibration are disabled, then the user
must take into account the time required by the AD7851 to
power up before a self-calibration is carried out. This power-up
time is the time taken for the AD7851 to power up when
power is first applied (300 µs typ), or the time it takes the exter-
nal reference to settle to the 14-bit level—whichever is longer.
The AD7851 powers up from a full hardware or software
power-down in 5 µs typ. This limits the throughput which the
part is capable of to 120 kSPS for the K Grade and 126 kSPS
for the A Grade when powering down between conversions.
Figure 24 shows how power-down between conversions is
implemented using the CONVST pin. The user first selects
the power-down between conversions option by using the
SLEEP pin and the power management bits, PMGT1 and
PMGT0, in the control register (see previous section). In this
mode, the AD7851 automatically enters a full power-down at
the end of a conversion, that is, when BUSY goes low. The
falling edge of the next CONVST pulse causes the part to
power up. Assuming the external reference is left powered up,
the AD7851 should be ready for normal operation 5 µs after
this falling edge. The rising edge of CONVST initiates a con-
version so the CONVST pulse should be at least 5 µs wide.
The part automatically powers down on completion of the
conversion. Where the software convert start is used, the part
may be powered up in software before a conversion is initiated.
5s 3.25s
t
CONVERT
POWER-UP
TIME
NORMAL
OPERATION
FULL
POWER-DOWN
POWER-UP
TIME
START CONVERSION ON RISING EDGE
POWER UP ON FALLING EDGE
CONVST
BUSY
Figure 24. Using the
CONVST
Pin to Power Up for
a Conversion
Using the Internal (On-Chip) Reference
As in the case of an external reference, the AD7851 can power
up from one of two conditions: power up after the supplies are
connected or power up from a hardware/software power-down.
When using the on-chip reference and powering up when AV
DD
and DV
DD
are first connected, it is recommended that the
power-up calibration mode be disabled as explained previously.
When using the on-chip reference, the power-up time is effec-
tively the time it takes to charge up the external capacitor on the
REF
IN
/REF
OUT
pin. This time is given by the equation
t
UP
= 9 × R × C
where R 150K and C = external capacitor.
The recommended value of the external capacitor is 100 nF;
this gives a power-up time of approximately 135 ms before a
calibration is initiated and normal operation should commence.
When C
REF
is fully charged, the power-up time from a hardware or
software power-down reduces to 5 µs. This is because an internal
switch opens to provide a high impedance discharge path for the
reference capacitor during power-down—see Figure 25. An added
advantage of the low charge leakage from the reference capacitor
during power-down is that even though the reference is being pow-
ered down between conversions, the reference capacitor holds the
reference voltage to within 0.5 LSBs with throughput rates of 100
samples/second and over with a full power-down between conver-
sions. A high input impedance op amp, such as the AD707, should
be used to buffer this reference capacitor if it is being used exter-
nally. Note, if the AD7851 is left in its powered-down state for
more than 100 ms, the charge on C
REF
will start to leak away and
the power-up time will increase. If this long power-up time is a
problem, the user can use a partial power-down for the last conver-
sion so the reference remains powered up.
AD7851
REF
IN
/REF
OUT
EXTERNAL
CAPACITOR
SWITCH OPENS
DURING POWER-DOWN
BUF
ON-CHIP
REFERENCE
TO OTHER
CIRCUITRY
Figure 25. On-Chip Reference During Power-Down
POWER VS. THROUGHPUT RATE
The main advantage of a full power-down after a conversion is
that it significantly reduces the power consumption of the part
at lower throughput rates. When using this mode of operation,
the AD7851 is only powered up for the duration of the conver-
sion. If the power-up time of the AD7851 is taken to be 5 µs
and it is assumed that the current during power up is 12 mA
typ, then power consumption as a function of throughput can
easily be calculated. The AD7851 has a conversion time of
3.25 µs with a 6 MHz external clock. This means the AD7851
consumes 12 mA typ for 8.25 µs in every conversion cycle if the
parts are powered down at the end of a conversion. The graph
in Figure 26 shows the power consumption of the AD7851 as a
function of throughput. Table VII lists the power consump-
tion for various throughput rates.

AD7851ARSZ-REEL

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 14B 333kSPS Serial Sampling
Lifecycle:
New from this manufacturer.
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