3&7#
AD8110/AD8111
–19–
Measuring Crosstalk
Crosstalk is measured by applying a signal to one or more channels
and measuring the relative strength of that signal on a desired
selected channel. The measurement is usually expressed as dB
down from the magnitude of the test signal. The crosstalk is
expressed by:
XT Asel s Atest s=
() ()
()
20
10
log /
where s = jw is the Laplace transform variable, Asel(s) is the
amplitude of the crosstalk-induced signal in the selected channel
and Atest(s) is the amplitude of the test signal. It can be seen
that crosstalk is a function of frequency, but not a function of
the magnitude of the test signal (to first order). In addition, the
crosstalk signal will have a phase relative to the test signal asso-
ciated with it.
A network analyzer is most commonly used to measure crosstalk
over a frequency range of interest. It can provide both magni-
tude and phase information about the crosstalk signal.
As a crosspoint system or device grows larger, the number of
theoretical crosstalk combinations and permutations can become
extremely large. For example, in the case of the 16 8 matrix of
the AD8110/AD8111, we can examine the number of crosstalk
terms that can be considered for a single channel, say IN00 input.
IN00 is programmed to connect to one of the AD8110/AD8111
outputs where the measurement can be made.
We can first measure the crosstalk terms associated with driving
a test signal into each of the other 15 inputs one at a time. We
can then measure the crosstalk terms associated with driving a
parallel test signal into all 15 other inputs taken two at a time in
all possible combinations; and then three at a time, etc., until,
finally, there is only one way to drive a test signal into all 15
other inputs.
Each of these cases is legitimately different from the others and
might yield a unique value depending on the resolution of the
measurement system, but it is hardly practical to measure all
these terms and then to specify them. In addition, this describes
the crosstalk matrix for just one input channel. A similar
crosstalk matrix can be proposed for every other input. In addition,
if the possible combinations and permutations for connecting
inputs to the other (not used for measurement) outputs are
taken into consideration, the numbers rather quickly grow to
astronomical proportions. If a larger crosspoint array of multiple
AD8110/AD8111s is constructed, the numbers grow larger still.
Obviously, some subset of all these cases must be selected to be
used as a guide for a practical measure of crosstalk. One common
method is to measure “all hostile” crosstalk. Su˘s term means
that the crosstalk to the selected channel is measured, while all
other system channels are driven in parallel. In general, this will
yield the worst crosstalk number, but this is not always the case
due to the vector nature of the crosstalk signal.
Other useful crosstalk measurements are those created by one
nearest neighbor or by the two nearest neighbors on either side.
These crosstalk measurements will generally be higher than
those of more distant channels, so they can serve as a worst-case
measure for any other one-channel or two-channel crosstalk
measurements.
Input and Output Crosstalk
The flexible programming capability of the AD8110/AD8111
can be used to diagnose whether crosstalk is occurring more on
the input side or the output side. Some examples are illustrative.
A given input channel (IN07 in the middle for this example) can
be programmed to drive OUT03. The input to IN07 is just
terminated to ground (via 50 or 75 Ω) and no signal is applied.
All the other inputs are driven in parallel with the same test
signal (practically provided by a distribution amplifier), with all
other outputs except OUT03 disabled. Since grounded IN07 is
programmed to drive OUT03, there should be no signal present.
Any signal that is present can be attributed to the other 15 hostile
input signals, because no other outputs are driven. (They are all
disabled.) Thus, this method measures the all-hostile input
contribution to crosstalk into IN07. Of course, the method
can be used for other input channels and combinations of
hostile inputs.
For output crosstalk measurement, a single input channel (IN00
for example) is driven and all outputs other than a given output
(IN03 in the middle) are programmed to connect to IN00.
OUT03 is programmed to connect to IN15 (far away from
IN00), which is terminated to ground. Thus OUT03 should not
have a signal present since it is listening to a quiet input. Any
signal measured at the OUT03 can be attributed to the output
crosstalk of the other seven hostile outputs. Again, this method
can be modified to measure other channels and other crosspoint
matrix combinations.
Effect of Impedances on Crosstalk
The input side crosstalk can be influenced by the output
impedance of the sources that drive the inputs. The lower the
impedance of the drive source, the lower the magnitude of the
crosstalk. The dominant crosstalk mechanism on the input side
is capacitive coupling. The high impedance inputs do not have
significant current flow to create magnetically induced crosstalk.
However, significant current can flow through the input termi-
nation resistors and the loops that drive them. Thus, the PC board
on the input side can contribute to magnetically coupled crosstalk.
From a circuit standpoint, the input crosstalk mechanism looks
like a capacitor coupling to a resistive load. For low frequencies
the magnitude of the crosstalk will be given by:
XT R C s
SM
=
()
×
[]
20
10
log
where R
S
is the source resistance, C
M
is the mutual capacitance
between the test signal circuit and the selected circuit, and s is
the Laplace transform variable.
From the equation it can be observed that this crosstalk mechanism
has a high-pass nature; it can also be minimized by reducing the
coupling capacitance of the input circuits and lowering the output
impedance of the drivers. If the input is driven from a 75 Ω terminated
cable, the input crosstalk can be reduced by buffering this signal with
a low output impedance buffer.
On the output side, the crosstalk can be reduced by driving a
lighter load. Although the AD8110/AD8111 is specified with
excellent differential gain and phase when driving a standard
150 Ω video load, the crosstalk will be higher than the minimum
obtainable due to the high output currents. These currents will
induce crosstalk via the mutual inductance of the output pins
and bond wires of the AD8110/AD8111.
3&7#
AD8110/AD8111
–20–
From a circuit standpoint, this output crosstalk mechanism
looks like a transformer with a mutual inductance between the
windings that drives a load resistor. For low frequencies, the
magnitude of the crosstalk is given by:
XT Mxy s R
L
()
20
10
log /
where Mxy is the mutual inductance of output x to output y,
and R
L
is the load resistance on the measured output. This
crosstalk mechanism can be minimized by keeping the mutual
inductance low and increasing R
L
. The mutual inductance can
be kept low by increasing the spacing of the conductors and
minimizing their parallel length.
PCB Layout
Extreme care must be exercised to minimize additional crosstalk
generated by the system circuit board(s). The areas that must be
carefully detailed are grounding, shielding, signal routing, and
supply bypassing.
The packaging of the AD8110/AD8111 is designed to help keep
the crosstalk to a minimum. Each input is separated from each
other input by an analog ground pin. All of these AGNDs should
be directly connected to the ground plane of the circuit board.
These ground pins provide shielding, low impedance return
paths and physical separation for the inputs. All of these help to
reduce crosstalk.
Each output is separated from its two neighboring outputs by an
analog ground pin in addition to an analog supply pin of one
polarity or the other. Each of these analog supply pins provides
power to the output stages of only the two nearest outputs. These
supply pins and analog grounds provide shielding, physical
separation and a low impedance supply for the outputs. Individual
bypassing of each of these supply pins with a 0.01 μF chip capaci-
tor directly to the ground plane minimizes high frequency output
crosstalk via the mechanism of sharing common impedances.
Each output also has an on-chip compensation capacitor that is
individually tied to the nearby analog ground pins AGND00
through AGND07. This technique reduces crosstalk by prevent-
ing the currents that flow in these paths from sharing a common
impedance on the IC and in the package pins. These AGNDxx
signals should all be directly connected to the ground plane.
The input and output signals will have minimum crosstalk if
they are located between ground planes on layers above and
below, and separated by ground in between. Vias should be
located as close to the IC as possible to carry the inputs and
outputs to the inner layer. The only place the input and output
signals surface is at the input termination resistors and the out-
put series back termination resistors. These signals should also
be separated, to the extent possible, as soon as they emerge from
the IC package.
AD8110/AD8111
REV. B –21–
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-026-BDD
051706-A
0.15
0.05
1.45
1.40
1.35
0.20
0.09
0.08
COPLANARITY
VIEW A
ROTATED 90° CCW
SEATING
PLANE
3.5°
TOP VIEW
(PINS DOWN)
1
21
41
40
60
6180
20
0.50
BSC
LEAD PITCH
0.27
0.22
0.17
1.60
MAX
0.75
0.60
0.45
VIEW A
PIN 1
14.20
14.00 SQ
13.80
12.20
12.00 SQ
11.80
Figure 8. 80-Lead Low Profile Quad Flat Package [LQFP]
(ST-80-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
AD8110ASTZ −40°C to +85°C 80-Lead Low Profile Quad Flat Package [LQFP] ST-80-1
AD8111ASTZ −40°C to +85°C 80-Lead Low Profile Quad Flat Package [LQFP] ST-80-1
1
Z = RoHS-Compliant Part.
REVISION HISTORY
/15—Rev. A to Rev. B
Changes to Crosstalk, All Hostile Parameter and Off Isolation,
Input-Output Parameter................................................................... 2
Changes to Areas of Crosstalk Section ......................................... 18
Deleted Evaluation Board Section and Figure 8; Renumbered
Sequentially ...................................................................................... 20
Deleted Figure 9............................................................................... 21
Moved Outline Dimensions, Ordering Guide, and Revisions
History .............................................................................................. 21
Updated Outline Dimensions ........................................................ 21
Changes to Ordering Guide ........................................................... 21
Deleted Figure 10 and Figure 11 ................................................... 22
Deleted Figure 12 and Figure 13 ................................................... 23
Deleted Figure 14, Controlling the Evaluation Board from a PC
Section, and Figure 15 .................................................................... 24
Deleted Overshoot on PC Printer Ports’ Data Lines Section and
Figure 16 ........................................................................................... 25
2/02—Rev. 0 to Rev. A
Changed MQFP to LQFP .................................................. Universal
Comment Added to Outline Dimensions ................................... 26
©2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C01069-0-/16(B)

AD8110ASTZ

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog & Digital Crosspoint ICs 260 MHz 16 x 8 Buffered
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet