AD7661
Rev. 0 | Page 9 of 28
Pin No. Mnemonic Type
1
Description
16
D7 or
RDC/SDIN
DI/O
When SER/PAR
is LOW, this output is used as Bit 7 of the parallel port data output bus.
When SER/PAR
is HIGH, this input, part of the serial port, is used as either an external data input or a
read mode selection input depending on the state of EXT/INT
.
When EXT/INT
is HIGH, RDC/SDIN could be used as a data input to daisy-chain the conversion results
from two or more ADCs onto a single SDOUT line. The digital data level on SDIN is output on DATA
with a delay of 16 SCLK periods after the initiation of the read sequence.
When EXT/INT
is LOW, RDC/SDIN is used to select the read mode. When RDC/SDIN is HIGH, the data
is output on SDOUT during conversion. When RDC/SDIN is LOW, the data can be output on SDOUT
only when the conversion is complete.
17 OGND P Input/Output Interface Digital Power Ground.
18 OVDD P Input/Output Interface Digital Power. Nominally at the same supply as the host interface (5 V or 3 V).
19 DVDD P Digital Power. Nominally at 5 V.
20 DGND P Digital Power Ground.
21
D8 or
SDOUT
DO
When SER/PAR
is LOW, this output is used as Bit 8 of the parallel port data output bus.
When SER/PAR
is HIGH, this output, part of the serial port, is used as a serial data output
synchronized to SCLK. Conversion results are stored in an on-chip register. The AD7661 provides the
conversion result, MSB first, from its internal shift register. The DATA format is determined by the
logic level of OB/2C
. In serial mode when EXT/INT is LOW, SDOUT is valid on both edges of SCLK. In
serial mode when EXT/INT is HIGH, if INVSCLK is LOW, SDOUT is updated on the SCLK rising edge and
valid on the next falling edge; if INVSCLK is HIGH, SDOUT is updated on the SCLK falling edge and
valid on the next rising edge.
22
D9 or
SCLK
DI/O
When SER/PAR
is LOW, this output is used as Bit 9 of the parallel port data or SCLK output bus.
When SER/PAR
is HIGH, this pin, part of the serial port, is used as a serial data clock input or output,
depending upon the logic state of the EXT/INT
pin. The active edge where the data SDOUT is
updated depends upon the logic state of the INVSCLK pin.
23
D10 or
SYNC
DO
When SER/PAR
is LOW, this output is used as Bit 10 of the parallel port data output bus.
When SER/PAR is HIGH, this output, part of the serial port, is used as a digital output frame
synchronization for use with the internal data clock (EXT/INT
= logic LOW). When a read sequence is
initiated and INVSYNC is LOW, SYNC is driven HIGH and remains HIGH while the SDOUT output is
valid. When a read sequence is initiated and INVSYNC is HIGH, SYNC is driven LOW and remains LOW
while the SDOUT output is valid.
24
D11 or
RDERROR
DO
When SER/PAR
is LOW, this output is used as Bit 11 of the parallel port data output bus. When
SER/PAR
and EXT/INT are HIGH, this output, part of the serial port, is used as an incomplete read error
flag. In slave mode, when a data read is started and not complete when the following conversion is
complete, the current data is lost and RDERROR is pulsed HIGH.
25–28 D[12:15] DO
Bit 12 to Bit 15 of the Parallel Port Data Output
Bus. These pins are always outputs regardless of the
state of SER/PAR
.
29 BUSY DO
Busy Output. Transitions HIGH when a co
nversion is started and remains HIGH until the conversion is
complete and the data is latched into the on-chip shift register. The falling edge of BUSY could be
used as a data ready clock signal.
30 DGND P Must Be Tied to Digital Ground.
31
RD
DI
Read Data. When CS
and RD are both LOW, the interface parallel or serial output bus is enabled.
32
CS
DI
Chip Select. When CS
and RD are both LOW, the interface parallel or serial output bus is enabled. CS
is also used to gate the external clock.
33 RESET DI
Reset Input. When set to a logic HIGH, this pin resets the AD7661 and the current conversion, if any,
is aborted. If not used, this pin could be tied to
DGND.
34 PD DI
Power-Down Input. When set to a logic HIGH, power c
onsumption is reduced and conversions are
inhibited after the current one is completed.
35
CNVST
DI
Start Conversion. If CNVST
is HIGH when the acquisition phase (t
8
) is complete, the next falling edge
on CNVST
puts the internal sample/hold into the hold state and initiates a conversion. The mode is
most appropriate if low sampling jitter is desired. If CNVST
is LOW when the acquisition phase (t
8
) is
complete, the internal sample/hold is put into the hold state and a conversion is immediately
started.
37 REF AI/O Reference Input Voltage. On-chip reference output voltage.
38 REFGND AI Reference Input Analog Ground.
39 INGND AI Analog Input Ground.
AD7661
Rev. 0 | Page 10 of 28
Pin No. Mnemonic Type
1
Description
43 IN AI Primary Analog Input with a Range of 0 V to 2.5 V.
45 TEMP AO Temperature Sensor Voltage Output.
46 REFBUFIN AI/O Reference Input Voltage. The reference output and the reference buffer input.
47 PDREF DI
This pin allows the choice of internal or external voltage referen
ces. When LOW, the on-chip
reference is turned on. When HIGH, the internal reference is switched off and an external reference
must be used.
48 PDBUF DI
This pin allows the choice of buffering an internal or external reference with the internal buffer.
When LOW, the buffer is selected. When HIGH, t
he buffer is switched off.
1
AI = Analog Input; AI/O = Bidirectional Analog; AO = Analog Output; DI = Digital Input; DI/O = Bidirectional Digital; DO = Digital Output; P = Power.
AD7661
Rev. 0 | Page 11 of 28
DEFINITIONS OF SPECIFICATIONS
Integral Nonlinearity Error (INL)
Linearity error refers to the deviation of each individual code
from a line drawn from negative full scale through positive full
scale. The point used as negative full scale occurs ½ LSB before
the first code transition. Positive full scale is defined as a level
1½ LSB beyond the last code transition. The deviation is
measured from the middle of each code to the true straight line.
Differential Nonlinearity Error (DNL)
In an ideal ADC, code transitions are 1 LSB apart. Differential
nonlinearity is the maximum deviation from this ideal value. It
is often specified in terms of resolution for which no missing
codes are guaranteed.
Full-Scale Error
The last transition (from 011…10 to 011…11 in twos
complement coding) should occur for an analog voltage 1½ LSB
below the nominal full scale (2.49994278 V for the 0 V to 2.5 V
range). The full-scale error is the deviation of the actual level of
the last transition from the ideal level.
Unipolar Zero Error
The first transition should occur at a level ½ LSB above analog
ground (19.073 µV for the 0 V to 2.5 V range). Unipolar zero
error is the deviation of the actual transition from that point.
Spurious-Free Dynamic Range (SFDR)
SFDR is the difference, in decibels (dB), between the rms
amplitude of the input signal and the peak spurious signal.
Effective Number Of Bits (ENOB)
ENOB is a measurement of the resolution with a sine wave
input. It is related to S/(N+D) and is expressed in bits by the
following formula:
ENOB = (S/[N+D]dB – 1.76)/6.02
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of the first five harmonic
components to the rms value of a full-scale input signal, and is
expressed in decibels.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the actual input signal to the
rms sum of all other spectral components below the Nyquist
frequency, excluding harmonics and dc. The value for SNR is
expressed in decibels.
Signal-to-(Noise + Distortion) Ratio (S/[N+D])
S/(N+D) is the ratio of the rms value of the actual input signal
to the rms sum of all other spectral components below the
Nyquist frequency, including harmonics but excluding dc. The
value for S/(N+D) is expressed in decibels.
Aperture Delay
Aperture delay is a measure of the acquisition performance and
is measured from the falling edge of the
CNVST
input to when
the input signal is held for a conversion.
Transient Response
Transient response is the time required for the AD7661 to
achieve its rated accuracy after a full-scale step function is
applied to its input.
Overvoltage Recovery
Overvoltage recovery is the time required for the ADC to
recover to full accuracy after an analog input signal 150% of the
full-scale value is reduced to 50% of the full-scale value.
Reference Voltage Temperature Coefficient
Reference voltage temperature coefficient is derived from the
maximum and minimum reference output voltage (V
REF
)
measured at T
MIN
, T(25°C), and T
MAX
. It is expressed in ppm/°C
using the following equation:
6
10
)()25(
))
)/( ×
×°
=°
MIN
MAX
REF
REFREF
REF
TTV
(V(V
CppmTCV
C
MinMax
where:
V
REF
(Max) = Maximum V
REF
at T
MIN
, T(25°C), or T
MAX
V
REF
(Min) = Minimum V
REF
at T
MIN
, T(25°C), or T
MAX
V
REF
(25°C) = V
REF
at +25°C
T
MAX
= +85°C
T
MIN
= –40°C
Thermal Hysteresis
Thermal hysteresis is defined as the absolute maximum change
of reference output voltage after the device is cycled through
temperature from either
T_HYS+ = +25°C to T
MAX
to +25°C
T_HYS– = +25°C to T
MIN
to +25°C
It is expressed in ppm using the following equation:
6
10
)25(
)_()25(
)( ×
°
°
=
CV
HYSTVCV
ppmV
REF
REFREF
HYS
where:
V
REF
(25°C) = V
REF
at 25°C
V
REF
(T_HYS) = Maximum change of V
REF
at T_HYS+ or
T_HYS.

AD7661ACPZRL

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 16-Bit 100kSPS Unipolar w/ Ref
Lifecycle:
New from this manufacturer.
Delivery:
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