Layout and Bypassing
For better noise immunity, bypass each of the voltage-
detector inputs to GND with a 0.1µF capacitor installed
as close to the device as possible. Bypass V
CC
and
DBP to GND with 1µF capacitors installed as close to
the device as possible. V
CC
(when not externally sup-
plied) and DBP are internally generated voltages and
should not be used to supply power to external circuitry.
Configuration Latency Period
A delay of less than 5µs occurs between writing to the
configuration registers and the time when these
changes actually take place, except when changing
one of the voltage-detector thresholds. Changing a
voltage-detector threshold typically takes 150µs. When
changing EEPROM contents, a software reboot or
cycling of power is required for these changes to trans-
fer to volatile memory.
MAX6884/MAX6885
EEPROM-Programmable, Hex
Power-Supply Supervisory Circuits
______________________________________________________________________________________ 31
Typical Operating Circuit
MARGIN
V
CC
*AUXIN
TEMP
SENSOR
*REFIN
WDI
SCL
SDA
LOGIC OUTPUT
SCL
SDA
GND
µP
DC-DC
1
3.3V ALWAYS ON
DBP
LOGIC INPUT
LOGIC INPUT
*MAX6884 ONLY
DC-DC
2
DC-DC
3
DC-DC
4
DC-DC
5
DC-DC
6
IN1 IN2 IN3 IN4 IN5 IN6
12V
A0
MR
UV/OV
WDO
RESET RESET
R
PU
R
PU
12V
5V
3.3V
2.5V
1.8V
1.5V
1.2V
MAX6884
MAX6885
MAX6884/MAX6885
EEPROM-Programmable, Hex
Power-Supply Supervisory Circuits
32 ______________________________________________________________________________________
Pin Configurations
20 19 18 17 16
678910
11
12
13
14
15
5
4
3
2
1
MAX6884
THIN QFN
TOP VIEW
WDO
RESET
UV/OV
GND
WDI
*EXPOSED PAD
*EXPOSED PAD CONNECTED TO GND.
IN5
IN1
IN2
IN3
IN4
IN6
DBP
V
CC
AUXIN
REFIN
A0
SCL
SDA
MR
MARGIN
20 19 18 17 16
678910
11
12
13
14
15
5
4
3
2
1
MAX6885
THIN QFN
WDO
RESET
UV/OV
GND
WDI
*EXPOSED PAD
*EXPOSED PAD CONNECTED TO GND.
IN5
IN1
IN2
IN3
IN4
IN6
DBP
V
CC
N.C.
N.C.
A0
SCL
SDA
MR
MARGIN
Chip Information
PROCESS: BiCMOS
MAX6884/MAX6885
EEPROM-Programmable, Hex
Power-Supply Supervisory Circuits
______________________________________________________________________________________ 33
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information
go to www.maxim-ic.com/packages
.)
QFN THIN.EPS
D2
(ND-1) X e
e
D
C
PIN # 1
I.D.
(NE-1) X e
E/2
E
0.08 C
0.10 C
A
A1
A3
DETAIL A
E2/2
E2
0.10 M C A B
PIN # 1 I.D.
b
0.35x45
D/2
D2/2
L
C
L
C
e e
L
CC
L
k
LL
DETAIL B
L
L1
e
XXXXX
MARKING
G
1
2
21-0140
PACKAGE OUTLINE,
16, 20, 28, 32L THIN QFN, 5x5x0.8mm
-DRAWING NOT TO SCALE-
L

MAX6884ETP+T

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Supervisory Circuits EEPROM-Prog Hex Power-Sup Sequencer
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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