LTC3879
27
3879f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
3.00 p 0.10
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 p 0.05
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-4)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 p 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 p 0.10
(4-SIDES)
0.75 p 0.05
R = 0.115
TYP
0.25 p 0.05
1
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 s 45o CHAMFER
15 16
2
0.50 BSC
0.200 REF
2.10 p 0.05
3.50 p 0.05
0.70 p0.05
0.00 – 0.05
(UD16 VAR A) QFN 1207 REV A
0.25 p0.05
0.50 BSC
PACKAGE OUTLINE
UD Package
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1700 Rev A)
Exposed Pad Variation AA
