LTC2637
25
2637fb
TYPICAL APPLICATION
2637 TA02
LTC2637MS-LMI12
DAC A
DAC B
DAC C
DAC D
DAC H
DAC G
DAC F
DAC E
REF
SDA
SCL
CA0
CA1
CA2
V
CC
0.1µF
0.1µF
M9
M3
M1
P1
P3
P9
8
9
10
1
2
3
LT1991
V
CC
V
EE
REF
OUT
6
V
OUT
= ±5V
0.1µF
0.1µF
5
4
7
–15V
15V
5V
1
15
14
13
12
10
7
6
GND
16
11
2
3
4
5
8
9
+
0.1µF
0.1µF
15V
–15V
1/2 LT1469
DAC A
8
4
1
30k
LT1634-1.25
LT1634-1.25
–15V
I
2
C
BUS
OUTA
6061
15
64
63
62
59
2
58
+
OUTB
R
FBA
R
VOSA
19
GND
I
OUT1A
I
OUT2A
3
2
30k
–15V
DAC B
V
DD
R
OFSA
R
IN1
R
COM1
REFA
DAC D
+
OUTD
DAC C
+
OUTC
+
1/2 LT1469
0.1µF
0.1µF
15V
–15V
8
4
5
6
7
0.1µF
5V
30k
–15V
30k
–15V
LTC2755
LTC6240
+
LT1634-1.25
LT1634-1.25
LTC2637 DACs Adjust LTC2755-16 Offsets, Amplifi ed with LT1991 PGA to ±5V
LTC2637
26
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PACKAGE DESCRIPTION
3.00 p0.10
(2 SIDES)
4.00 p0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 p 0.10
BOTTOM VIEW—EXPOSED PAD
1.70 p 0.10
0.75 p0.05
R = 0.115
TYP
R = 0.05
TYP
3.00 REF
1.70 p 0.05
17
148
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DE14) DFN 0806 REV B
PIN 1 NOTCH
R = 0.20 OR
0.35 s 45o
CHAMFER
3.00 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.20 p0.05
0.70 p0.05
3.60 p0.05
PACKAGE
OUTLINE
0.25 p 0.05
0.25 p 0.05
0.50 BSC
3.30 p0.05
3.30 p0.10
0.50 BSC
DE Package
14-Lead (4mm × 3mm) Plastic DFN
(Reference LTC DWG # 05-08-1708 Rev B)
MS Package
16-Lead (4mm × 5mm) Plastic MSOP
(Reference LTC DWG # 05-08-1669 Rev Ø)
MSOP (MS16) 1107 REV Ø
0.53 p 0.152
(.021 p .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
1615 14131211 10
12345678
9
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0
o – 6o TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 p 0.127
(.035 p .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 p 0.038
(.0120 p .0015)
TYP
0.50
(.0197)
BSC
4.039
p 0.102
(.159 p .004)
(NOTE 3)
0.1016 p 0.0508
(.004 p .002)
3.00 p 0.102
(.118 p .004)
(NOTE 4)
0.280 p 0.076
(.011 p .003)
REF
4.90 p 0.152
(.193 p .006)
LTC2637
27
2637fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
REVISION HISTORY
REV DATE DESCRIPTION PAGE NUMBER
A 10/09 Update LTC2637-12 Maximum Limits 5, 6, 8
B 06/10 Added details to Note 3
Revised Typical Application circuit
Added Typical Application drawing and revised Related Parts
10
25
28

LTC2637HMS-HMX10#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Digital to Analog Converters - DAC 10-Bit I2C Octal DAC (4.096V ref, Reset to Mid-Scale, Ext. Ref)
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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