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NX3L1T53GM,125

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24
NX3L1T53 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 8 — 23 January 2013 16 of 24
NXP Semiconductors
NX3L1T53
Low-ohmic single-pole double-throw analog switch
a. Test circuit
b. Input and output pulse definitions
V
I
may be connected to S or E.
Fig 22. Test circuit for measuring crosstalk voltage between digital inputs and switch
V
001aah452
R
L
S
E
Z
Y0
V
IL
or V
IH
Y1
V
CC
V
I
V
O
logic
input
0.5V
CC
R
L
C
L
0.5V
CC
G
V
ct
onoff
logic input
(S, E)
off
V
O
001aah453
Fig 23. Test circuit for measuring crosstalk
S
E
Z
Y0
V
IL
or V
IH
V
CC
0.5V
CC
V
IH
dB
001aah463
Y1
GND
1
2
R
L
f
i
0.5V
CC
R
L
NX3L1T53 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 8 — 23 January 2013 17 of 24
NXP Semiconductors
NX3L1T53
Low-ohmic single-pole double-throw analog switch
a. Test circuit
b. Input and output pulse definitions
Q
inj
= V
O
C
L
.
V
O
= output voltage variation.
R
gen
= generator resistance.
V
gen
= generator voltage.
V
I
may be connected to S or E.
Fig 24. Test circuit for measuring charge injection
001aad398
S
Z
Y0
Y1
R
L
C
L
V
CC
GND
R
gen
V
gen
switch
1
2
V
I
V
O
E
V
IL
G
001aah451
ΔV
O
off offon
V
O
logic input
(S, E)
NX3L1T53 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 8 — 23 January 2013 18 of 24
NXP Semiconductors
NX3L1T53
Low-ohmic single-pole double-throw analog switch
13. Package outline
Fig 25. Package outline SOT833-1 (XSON8)
terminal 1
index area
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT833-1 - - -
MO-252
- - -
SOT833-1
07-11-14
07-12-07
DIMENSIONS (mm are the original dimensions)
XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm
D
E
e
1
e
A
1
b
L
L
1
e
1
e
1
0 1 2 mm
scale
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
UNIT
mm
0.25
0.17
2.0
1.9
0.35
0.27
A
1
max
b E
1.05
0.95
D
ee
1
L
0.40
0.32
L
1
0.50.6
A
(1)
max
0.5 0.04
1
8
2
7
3
6
4
5
8×
(2)
4×
(2)
A
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24

NX3L1T53GM,125

Mfr. #:
Buy NX3L1T53GM,125
Manufacturer:
NXP Semiconductors
Description:
Analog Switch ICs 1SW SPDT 4.3V 60MHz
Lifecycle:
New from this manufacturer.
Delivery:
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