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P89LPC9241FDH,112

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48P49-P51P52-P54P55-P57P58-P60P61-P63P64-P66P67-P69P70-P72P73-P75
P89LPC92X1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2.1 — 27 August 2012 67 of 75
NXP Semiconductors
P89LPC9201/9211/922A1/9241/9251
8-bit microcontroller with 8-bit ADC
(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
Fig 36. ADC characteristics
002aae372
255
254
253
252
(2)
(1)
256253 254 255
7123456
7
6
5
4
3
2
1
0
1 LSB
(ideal)
code
out
V
DDA
− V
SSA
256
offset
error
E
O
gain
error
E
G
offset error
E
O
V
IA
(LSB
ideal
)
1 LSB =
P89LPC92X1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2.1 — 27 August 2012 68 of 75
NXP Semiconductors
P89LPC9201/9211/922A1/9241/9251
8-bit microcontroller with 8-bit ADC
13. Package outline
Fig 37. TSSOP20 package outline (SOT360-1)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.5
0.2
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1 MO-153
99-12-27
03-02-19
w M
b
p
D
Z
e
0.25
110
20
11
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
y
0 2.5 5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
A
max.
1.1
P89LPC92X1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2.1 — 27 August 2012 69 of 75
NXP Semiconductors
P89LPC9201/9211/922A1/9241/9251
8-bit microcontroller with 8-bit ADC
Fig 38. DIP20 package outline (SOT146-1)
UNIT
A
max.
1 2
b
1
cD E e M
H
L
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT146-1
99-12-27
03-02-13
A
min.
A
max.
b
Z
max.
w
M
E
e
1
1.73
1.30
0.53
0.38
0.36
0.23
26.92
26.54
6.40
6.22
3.60
3.05
0.2542.54 7.62
8.25
7.80
10.0
8.3
24.2 0.51 3.2
0.068
0.051
0.021
0.015
0.014
0.009
1.060
1.045
0.25
0.24
0.14
0.12
0.010.1 0.3
0.32
0.31
0.39
0.33
0.0780.17 0.02 0.13
SC-603MS-001
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w M
b
1
e
D
A
2
Z
20
1
11
10
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
(1)
(1) (1)
DIP20: plastic dual in-line package; 20 leads (300 mil)
SOT146-1
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P39P40-P42P43-P45P46-P48P49-P51P52-P54P55-P57P58-P60P61-P63P64-P66P67-P69P70-P72P73-P75

P89LPC9241FDH,112

Mfr. #:
Buy P89LPC9241FDH,112
Manufacturer:
NXP Semiconductors
Description:
Microcontrollers - MCU 8-bit Microcontrollers - MCU MCU 8-Bit CISC 4KB Flash2.5V/3.3V 20Pin
Lifecycle:
New from this manufacturer.
Delivery:
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