8Mb
SMART 3 BOOT BLOCK FLASH MEMORY
09005aef81136a91 Micron Technology, Inc., reserves the right to change products or specifications without notice.
Q10.fm - Rev. E 6/04 EN
28 ©2001 Micron Technology, Inc. All rights reserved.
Figure 15: 48-Pin Plastic TSOP I
(12mm x 20mm)
NOTE:
1. All dimensions in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is .01” per side.
1.20 MAX
0.15
+0.03
-0.02
0.20 ±0.05
SEE DETAIL A
0.50 TYP
18.40 ±0.08
20.00 ±0.25
12.00 ±0.08
DETAIL A
0.50 ±0.01
0.80
0.10
+0.10
-0.05
0.10
0.25
GAGE
PLANE
0.25
PIN #1 INDEX
PLATED LEAD FINISH: 90% Sn, 10% Pb OR 100%Sn
PLASTIC PACKAGE MATERIAL: NOVOLAC EPOXY
PACKAGE WIDTH AND LENGTH DO NOT
INCLUDE MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE.
8Mb
SMART 3 BOOT BLOCK FLASH MEMORY
09005aef81136a91 Micron Technology, Inc., reserves the right to change products or specifications without notice.
Q10.fm - Rev. E 6/04 EN
29 ©2001 Micron Technology, Inc. All rights reserved.
®
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
Figure 16: 44-Pin Plastic SOP1
(500 mil)
NOTE:
1. Not recommended for new designs.
2. All dimensions in millimeters.
3. Package width and length do not include mold protrusion; allowable mold protrusion is .01” per side.
Data Sheet Designation
Production: This data sheet contains minimum and maximum limits specified over the complete power supply
and temperature range for production devices. Although considered final, these specifications are
subject to change, as further product development and data characterization sometimes occur.
0.40 ±0.08
0.45 (TYP)
+0.05
-0.07
0.15
+0.03
-0.02
(0.10)
16.04 ±0.30
PIN #1 ID
SEE DETAIL A
GAGE
PLANE
0.80
(TYP)
1.72
(TYP)
28.02 ±0.08
0.25
12.60 ±0.08
.076
2.80 MAX
1.27 (TYP)
8Mb
SMART 3 BOOT BLOCK FLASH MEMORY
09005aef81136a91 Micron Technology, Inc., reserves the right to change products or specifications without notice.
Q10.fm - Rev. E 6/04 EN
30 ©2001 Micron Technology, Inc. All rights reserved.
Revision History
Rev. E, Pub.6/04. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6/04
•Update to I
CC6 value
40-pin TSOP and 48-pin TSOP package drawings have been updated
Rev. D, Pub.3/04 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3/04
Added lead-free packaging options
Rev. 3, Pub. 10/01 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10/01
Updated input capacitance spec
Changed access time to 90ns
Rev. 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3/01
Changed to 0.18µm process
12V V
PP no longer supported
10V
VHH 12V
•V
OH VCC - 0.2V
t
RWH changed to 1µs from 800ns
t
AH changed to 10ns from 0ns
AC test output load CL changed to 50pF
Typical main BLOCK ERASE time changed to 1.5s from 1s
Typical main BLOCK WRITE time (byte mode) changed to 1s from 0.5s
Typical main BLOCK WRITE time (word mode) changed to 1s from 0.5s
MT28F800B3 only available in WG and SG packages
MT28F008B3 only available in VG package
Added 80ns access time for commercial and extended temperature ranges

MT28F008B3VP-9 B TR

Mfr. #:
Manufacturer:
Micron
Description:
IC FLASH 8M PARALLEL 40TSOP I
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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