© Semiconductor Components Industries, LLC, 2015
August, 2015 − Rev. 4
1 Publication Order Number:
KAI−0330/D
KAI-0330
648 (H) x 484 (V) Interline
CCD Image Sensor
Description
The KAI−0330 Image Sensor is a high performance, low cost,
progressive scan 648 (H) × 484 (V) (1/2 optical format) Interline
CCD Image Sensor designed specifically for demanding machine
vision, surveillance, and computer input imaging applications.
Available in both single- and dual-output configurations, frame
rates up to 120 Hz are available, providing the ability to design an
image capture device that is up to 4× faster than traditional CCD
image sensors. In addition, 9 mm square pixels with micolenses and
anti-blooming structure provide high sensitivity and excellent
specular reflection blooming control. Coupled with the additional
benefits of electronic shutter, rapid clearing of horizontal lines for
faster sub-region readout, and availability in color and monochrome
configurations, this sensor is an ideal choice for challenging imaging
applications.
Table 1. GENERAL SPECIFICATIONS
Parameter Typical Value
Architecture Interline CDD; Progressive Scan
Total Number of Pixels 680 (H) × 496 (V)
Number of Effective Pixels 648 (H) × 484 (V)
Number of Active Pixels 648 (H) × 484 (V)
Pixel Size
9.0 mm(H) × 9.0 mm (V)
Active Image Size 5.832 mm (H) × 4.356 mm (V),
7.28 mm (Diagonal),
1/2 Optical Format
Aspect Ratio 4:3
Number of Outputs 1 or 2
Saturation Signal 30.000 e
Output Sensitivity
11.5 mV/e
Quantum Efficiency
−ABA (490 nm)
−CBA (620 nm, 530 nm, 460 nm)
36%
25%, 26%, 32%
Total Sensor Noise 0.5 mV rms
Dynamic Range 57 dB
Dark Current < 0.5 nA/cm
2
Dark Current Doubling Temperature 8°C
Charge Transfer Efficiency 0.99999
Smear 0.01%
Image Lag Negligible
Maximum Data Rate 30 MHz
Package 20-Pin CERDIP
Cover Glass Clear Glass
NOTE: All Parameters are specified at T = 40°C unless otherwise noted.
Features
Front Illuminated Interline Architecture
Progressive Scan
Electronic Shutter
Integral RGB Color Filter Array (Optional
)
On-Chip Dark Reference Pixels
Low Dark Current
Dual Output Shift Registers
Anti-Blooming Protection
Negligible Lag
Low Smear
Applications
Machine Vision
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Figure 1. KAI−0330 Interline
CCD Image Sensor
See detailed ordering and shipping information on page 2 o
f
this data sheet.
ORDERING INFORMATION
KAI−0330
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2
ORDERING INFORMATION
Table 2. ORDERING INFORMATION − KAI−0330 IMAGE SENSOR
Part Number Description Marking Code
KAI−0330−AAA−CP−BA−Dual Output Monochrome, No Microlens, CERDIP Package (Sidebrazed),
Taped Clear Cover Glass (No Coatings), Standard Grade,
Dual Output
KAI−0330D
Serial Number
KAI−0330−AAA−CP−AE−Dual Output Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Taped Clear Cover Glass (No Coatings), Engineering Grade,
Dual Output
KAI−0330−ABA−CB−AA−Single Output Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass (No Coatings), Standard Grade, Single Output
KAI−0330SM
Serial Number
KAI−0330−ABA−CB−BA−Dual Output Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass (No Coatings), Standard Grade, Dual Output
KAI−0330DM
Serial Number
KAI−0330−ABA−CB−AE−Dual Output Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass (No Coatings), Engineering Grade, Dual Output
KAI−0330−CBA−CB−BA−Dual Output Color (Bayer RGB), Telecentric Microlens, CERDIP Package
(Sidebrazed), Clear Cover Glass (No Coatings), Standard Grade,
Dual Output
KAI−0330DCM
Serial Number
KAI−0330−CBA−CB−AE−Dual Output Color (Bayer RGB), Telecentric Microlens, CERDIP Package
(Sidebrazed), Clear Cover Glass (No Coatings), Engineering Grade,
Dual Output
Table 3. ORDERING INFORMATION − EVALUATION SUPPORT
Part Number Description
KAI−0330−12−30−A−GEVK Evaluation Board (Complete Kit)
See the ON Semiconductor Device Nomenclature document (TND310/D) for a full description of the naming convention
used for image sensors. For reference documentation, including information on evaluation kits, please visit our web site at
www.onsemi.com
.
KAI−0330
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3
DEVICE DESCRIPTION
Architecture
Figure 2. Functional Block Diagram
fV1
fV2
fV2
fV1
fR
Horizontal Register A
10 dummies 4 dummies
Horizontal Register B
H1A
H2
H1B
WELL
G
G
R
B
Color Filter Pattern
8 Dark Lines at Top of Image
4 Dark Lines at Bottom of Image
8 Dark Columns
24 Dark Columns
KAI−0330
Active Image Area
648 (H) × 484 (V)
9.0 × 9.0 mm Pixels
V
RD
V
DD
V
OUTA
V
SS
/OG
V
DD
V
OUTB
V
SS
/OG
V
SUB
The KAI−0330 consists of 648 × 484 photodiodes, 680
vertical (parallel) CCD shift registers (VCCDs), and dual
496 pixel horizontal (serial) CCD shift registers (HCCDs)
with independent output structures. The device can be
operated in either single or dual line mode. The advanced,
progressive-scan architecture of the device allows the entire
image area to be read out in a single scan. The active pixels
are surrounded by an additional 32 columns and 12 rows of
light-shielded dark reference pixels.
Image Acquisition
An electronic representation of an image is formed when
incident photons falling on the sensor plane create
electron-hole pairs within the individual silicon
photodiodes. These photoelectrons are collected locally by
the formation of potential wells at each photosite. Below
photodiode saturation, the number of photoelectrons
collected at each pixel is linearly dependent on light level
and exposure time and non-linearly dependent on
wavelength. When the photodiode’s charge capacity is
reached, excess electrons are discharged into the substrate to
prevent blooming.
Charge Transport
The accumulated or integrated charge from each
photodiode is transported to the output by a three-step
process. The charge is first transported from the photodiodes
to the VCCDs by applying a large positive voltage to the
phase-one vertical clock (fV1). This reads out every row, or
line, of photodiodes into the VCCDs.
The charge is then transported from the VCCDs to the
HCCDs line by line. Finally, the HCCDs transport these
rows of charge packets to the output structures pixel by
pixel. On each falling edge of the horizontal clock, fH2,
these charge packets are dumped over the output gate (OG,
Figure 3) onto the floating diffusion (FDA and FDB,
Figure 3).
Both the horizontal and vertical shift registers use
traditional two-phase complementary clocking for charge
transport. Transfer to the HCCDs begins when fV2 is
clocked high and then low (while holding fH1A high)
causing charge to be transferred from fV1 to fV2 and
subsequently into the A HCCD. The A register can now be
read out in single line mode. If it is desired to operate the
device in a dual line readout mode for higher frame rates, this
line is transferred into the B HCCD by clocking fH1A to
a low state, and fH1B to a high state while holding fH2 low.
After fH1A is returned to a high state, the next line can be
transferred into the A HCCD. After this clocking sequence,
both HCCDs are read out in parallel.
The charge capacity of the horizontal CCDs is slightly
more than twice that of the vertical CCDs. This feature
allows the user to perform two-to-one line aggregation in the
charge domain during V-to-H transfer. This device is also
equipped with a fast dump feature that allows the user to
selectively dump complete lines (or rows) of pixels at a time.
This dump, or line clear, is also accomplished during the
V-to-H transfer time by clocking the fast dump gate.

KAI-0330-ABA-CB-AA-SINGLE

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Image Sensor Monochrome CCD 648x484Pixels 20-Pin CDIP UNTBX
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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