MAX8537/MAX8538/MAX8539
Dual-Synchronous Buck Controllers for Point-of-
Load, Tracking, and DDR Memory Power Supplies
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2) Keep separate the power ground plane (connected
to the sources of the low-side MOSFETs, pin 24,
input capacitor ground, output capacitor ground,
and VL decoupling capacitor ground) and the signal
ground plane (connected to GND pin and the rest of
the circuit ground returns). Place the input decou-
pling ceramic capacitor as directly and close to the
high-side MOSFET drain and the low-side MOSFET
source as possible. Place the RC snubber circuit as
close to the low-side MOSFET as possible.
3) Keep the high-current paths as short as possible.
4) Connect the drains of the MOSFETs to a large land
area to help cool the devices and further improve
efficiency and long-term reliability.
5) Ensure all feedback connections are short and
direct. Place the feedback resistors as close to the
IC as possible.
6) Route high-speed switching nodes away from sensi-
tive analog areas (FB, COMP).
7) Refer to the evaluation kit for a sample board layout.
Chip Information
TRANSISTOR COUNT: 5504
PROCESS: BiCMOS
