JUNE 2001 – REVISED JANUARY 2007
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
TISP4xxxH3/M3BJ Series for LCAS Protection
MECHANICAL DATA
Recommended Printed Wiring Footprint
Device Symbolization Code
Devices will be coded as below. As the device parameters are symmetrical, terminal 1 is not identified.
SMB Pad Size
MDXX BIA
2.54
(.100)
2.40
(.095)
2.16
(.085)
DIMENSIONS ARE:
MILLIMETERS
(INCHES)
Device
Symbolization
Code
TISP4125H3BJ 4125H3
TISP4219H3BJ 4219H3
TISP4125M3BJ 4125M3
TISP4219M3BJ 4219M3
“TISP” is a trademark of Bourns, Ltd., a Bourns Company, and is Registered in U.S. Patent and Trademark Office.
“Bourns” is a registered trademark of Bourns, Inc. in the U.S. and other countries.
