LM2931, NCV2931 Series
http://onsemi.com
19
PACKAGE DIMENSIONS
TO220 5LEAD
CASE 314D04
ISSUE H
Q
12345
U
K
D
G
A
B1
5 PL
J
H
L
E
C
M
Q
M
0.356 (0.014) T
SEATING
PLANE
T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.572 0.613 14.529 15.570
B 0.390 0.415 9.906 10.541
C 0.170 0.180 4.318 4.572
D 0.025 0.038 0.635 0.965
E 0.048 0.055 1.219 1.397
G 0.067 BSC 1.702 BSC
H 0.087 0.112 2.210 2.845
J 0.015 0.025 0.381 0.635
K 0.977 1.045 24.810 26.543
L 0.320 0.365 8.128 9.271
Q 0.140 0.153 3.556 3.886
U 0.105 0.117 2.667 2.972
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION D DOES NOT INCLUDE
INTERCONNECT BAR (DAMBAR) PROTRUSION.
DIMENSION D INCLUDING PROTRUSION SHALL
NOT EXCEED 10.92 (0.043) MAXIMUM.
B1 0.375 0.415 9.525 10.541
B
DETAIL A-A
B1
B
DETAIL AA
SOT223
ST SUFFIX
CASE 318H01
ISSUE O
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSION E1 DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.23 PER
SIDE.
4. DIMENSIONS b AND b2 DO NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS
OF THE b AND b2 DIMENSIONS AT MAXIMUM
MATERIAL CONDITION.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSIONS D AND E1 ARE TO BE DETERMINED
AT DATUM PLANE H.
DIM MIN MAX
MILLIMETERS
A --- 1.80
A1 0.02 0.11
b 0.60 0.88
b1 0.60 0.80
b2 2.90 3.10
b3 2.90 3.05
c 0.24 0.35
c1 0.24 0.30
D 6.30 6.70
E 6.70 7.30
E1 3.30 3.70
e
2.30
e1
4.60
L 0.25
---
T 0 10
T
__
c1
E
H
M
0.2 C
C
A
S
B
B
B
A
A
M
0.1 C
S
A
S
B
E1
B
D
4
3
2
1
e
e1
M
0.1 C
S
A
S
B
b2
b
A
0.08
A1
c
b1
(b)
(b2)
b3
SECTION BBL
SECTION AA
LM2931, NCV2931 Series
http://onsemi.com
20
PACKAGE DIMENSIONS
DPAK
DT SUFFIX
CASE 369C01
ISSUE D
b
D
E
b3
L3
L4
b2
e
M
0.005 (0.13) C
c2
A
c
C
Z
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
D 0.235 0.245 5.97 6.22
E 0.250 0.265 6.35 6.73
A 0.086 0.094 2.18 2.38
b 0.025 0.035 0.63 0.89
c2 0.018 0.024 0.46 0.61
b2 0.030 0.045 0.76 1.14
c 0.018 0.024 0.46 0.61
e 0.090 BSC 2.29 BSC
b3 0.180 0.215 4.57 5.46
L4 −−− 0.040 −−− 1.01
L 0.055 0.070 1.40 1.78
L3 0.035 0.050 0.89 1.27
Z 0.155 −−− 3.93 −−−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
12 3
4
5.80
0.228
2.58
0.102
1.60
0.063
6.20
0.244
3.00
0.118
6.17
0.243
ǒ
mm
inches
Ǔ
SCALE 3:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
H 0.370 0.410 9.40 10.41
A1 0.000 0.005 0.00 0.13
L1 0.108 REF 2.74 REF
L2 0.020 BSC 0.51 BSC
A1
H
DETAIL A
SEATING
PLANE
A
B
C
L1
L
H
L2
GAUGE
PLANE
DETAIL A
ROTATED 90 CW5
LM2931, NCV2931 Series
http://onsemi.com
21
PACKAGE DIMENSIONS
SOIC8 NB
CASE 75107
ISSUE AK
SEATING
PLANE
1
4
58
N
J
X 45
_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 75101 THRU 75106 ARE OBSOLETE. NEW
STANDARD IS 75107.
A
B
S
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050
M 0 8 0 8
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
X
Y
G
M
Y
M
0.25 (0.010)
Z
Y
M
0.25 (0.010) Z
S
X
S
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒ
mm
inches
Ǔ
SCALE 6:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*

LM2931ACTV

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC REG LIN POS ADJ 100MA TO220-5
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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