LM2931, NCV2931 Series
http://onsemi.com
23
PACKAGE DIMENSIONS
D
2
PAK
D2T SUFFIX
CASE 936A−02
ISSUE C
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
5 REF
A
123
K
B
S
H
D
G
C
E
M
L
P
N
R
V
U
TERMINAL 6
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A
AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 6.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED 0.025
(0.635) MAXIMUM.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
0.386 0.403 9.804 10.236
INCHES
B 0.356 0.368 9.042 9.347
C 0.170 0.180 4.318 4.572
D 0.026 0.036 0.660 0.914
E 0.045 0.055 1.143 1.397
G 0.067 BSC 1.702 BSC
H 0.539 0.579 13.691 14.707
K 0.050 REF 1.270 REF
L 0.000 0.010 0.000 0.254
M 0.088 0.102 2.235 2.591
N 0.018 0.026 0.457 0.660
P 0.058 0.078 1.473 1.981
R 5 REF
S 0.116 REF 2.946 REF
U 0.200 MIN 5.080 MIN
V 0.250 MIN 6.350 MIN
__
45
M
0.010 (0.254) T
−T−
OPTIONAL
CHAMFER
8.38
0.33
1.016
0.04
16.02
0.63
10.66
0.42
3.05
0.12
1.702
0.067
SCALE 3:1
ǒ
mm
inches
Ǔ
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