LTC2450-1
13
24501fc
APPLICATIONS INFORMATION
24501 F12
D
15
D
14
D
13
D
12
D
2
D
1
D
0
SD0
clk
1
clk
2
clk
3
clk
4
clk
15
clk
16
clk
17
SCK
CONVERT CONVERT
SLEEP
DATA OUTPUT
CS = LOW
Figure 12. 2-Wire, Idle-High (CPOL = 1) Serial Clock, Operation Example
24501 F13
D
15
D
14
D
13
D
12
D
2
D
1
D
0
SD0
CS = LOW
clk
1
clk
2
clk
3
clk
14
clk
4
clk
15
clk
16
SCK
CONVERT CONVERTDATA OUTPUT
Figure 13. 2-Wire, Idle-Low (CPOL = 0) Serial Clock Operation Example
2-Wire Operation
The 2-wire operation modes, while reducing the number
of required control signals, should be used only if the
LTC2450-1 low power sleep capability is not required. In
addition the option to abort serial data transfers is no longer
available. Hardwire CS to GND for 2-wire operation.
Figure 12 shows a 2-wire operation sequence which uses
an idle-high (CPOL = 1) serial clock signal. The conversion
status can be monitored at the SDO output. Following a
conversion cycle, the ADC enters SLEEP state and the
SDO output transitions from HIGH to LOW. Subsequently
16 clock pulses are applied to the SCK input in order
to serially shift the 16 bit result. Finally, the 17th clock
pulse is applied to the SCK input in order to trigger a new
conversion cycle.
Figure 13 shows a 2-wire operation sequence which uses
an idle-low (CPOL = 0) serial clock signal. The conversion
status cannot be monitored at the SDO output. Following
a conversion cycle, the LTC2450-1 bypasses the SLEEP
state and immediately enters the DATA OUTPUT state. At
this moment the SDO pin outputs the most signifi cant bit
(D15) of the conversion result. The user must use external
timing in order to determine the end of conversion and
result availability. Subsequently 16 clock pulses are applied
to SCK in order to serially shift the 16-bit result. The 16th
clock falling edge triggers a new conversion cycle.
PRESERVING THE CONVERTER ACCURACY
The LTC2450-1 is designed to reduce as much as possible
the conversion result sensitivity to device decoupling,
PCB layout, antialiasing circuits, line and frequency
perturbations. Nevertheless, in order to preserve the
very high accuracy capability of this part, some simple
precautions are desirable.
LTC2450-1
14
24501fc
APPLICATIONS INFORMATION
Digital Signal Levels
The LTC2450-1’s digital interface is easy to use. Its digital
inputs (SCK and CS) accept standard CMOS logic levels
and the internal hysteresis receivers can tolerate edge
rates as slow as 100μs. However, some considerations
are required to take advantage of the exceptional accuracy
and low supply current of this converter.
The digital output signal SDO is less of a concern because
it is not active during the conversion cycle.
While a digital input signal is in the range 0.5V to V
CC
–0.5V, the CMOS input receiver may draw additional
current from the power supply. Due to the nature of CMOS
logic, a slow transition within this voltage range may cause
an increase in the power supply current drawn by the
converter, particularly in the low power operation mode
within the SLEEP state. Thus, for low power consumption
it is highly desirable to provide relatively fast edges for the
two digital input pins SCK and CS, and to keep the digital
input logic levels at V
CC
or GND.
At the same time, during the CONVERT state, undershoot
and/or overshoot of fast digital signals connected to the
LTC2450-1 pins may affect the conversion result. Under-
shoot and overshoot can occur because of an impedance
mismatch at the converter pin combined with very fast
transition times. This problem becomes particularly diffi cult
when shared control lines are used and multiple refl ec-
tions may occur. The solution is to carefully terminate all
transmission lines close to their characteristic impedance.
Parallel termination is seldom an acceptable option in low
power systems so a series resistor between 27Ω and 56Ω
placed near the driver may eliminate this problem. The
actual resistor value depends upon the trace impedance
and connection topology. An alternate solution is to reduce
the edge rate of the control signals, keeping in mind the
concerns regarding slow edges mentioned above.
Particular attention should be given to confi gurations in
which a continuous clock signal is applied to SCK pin dur-
ing the CONVERT state. While LTC2450-1 will ignore this
signal from a logic point of view the signal edges may create
unexpected errors depending upon the relation between
its frequency and the internal oscillator frequency. In such
a situation it is benefi cial to use edge rates of about 10ns
and to limit potential undershoot to less than 0.3V below
GND and overshoot to less than 0.3V above V
CC
.
Noisy external circuitry can potentially impact the output
under 2-wire operation. In particular, it is possible to get
the LTC2450-1 into an unknown state if an SCK pulse is
missed or noise triggers an extra SCK pulse. In this situ-
ation, it is impossible to distinguish SDO = 1 (indicating
conversion in progress) from valid “1” data bits. As such,
CPOL = 1 is recommended for the 2-wire mode. The user
should look for SDO = 0 before reading data, and look
for SDO = 1 after reading data. If SDO does not return a
“0” within the maximum conversion time (or return a “1”
after a full data read), generate 16 SCK pulses to force a
new conversion.
Driving V
CC
and GND
The V
CC
and GND pins of the LTC2450-1 converter are
directly connected to the positive and negative reference
voltages, respectively. A simplifi ed equivalent circuit is
shown in Figure 14.
The power supply current passing through the parasitic
layout resistance associated with these common pins will
modify the ADC reference voltage and thus negatively affect
the converter accuracy. It is thus important to keep the
V
CC
and GND lines quiet, and to connect these supplies
through very low impedance traces.
In relation to the V
CC
and GND pins, the LTC2450-1 com-
bines internal high frequency decoupling with damping
Figure 14. LTC2450-1 Analog Pins Equivalent Circuit
V
CC
I
LEAK
R
SW
(TYP)
15k
C
EQ
(TYP)
0.35pF
INTERNAL SWITCHING FREQUENCY = 4 MHz
R
SW
(TYP)
15k
R
SW
(TYP)
15k
V
IN
I
LEAK
I
LEAK
GND
I
LEAK
V
CC
V
CC
V
CC
24501 F14
LTC2450-1
15
24501fc
APPLICATIONS INFORMATION
Figure 15. LTC2450-1 Input Drive Equivalent Circuit
elements which reduce the ADC performance sensitivity to
PCB layout and external components. Nevertheless, the very
high accuracy of this converter is best preserved by careful
low and high frequency power supply decoupling.
A 0.1μF, high quality, ceramic capacitor in parallel with a
10μF ceramic capacitor should be connected between the
V
CC
and GND pins, as close as possible to the package.
The 0.1μF capacitor should be placed closest to the ADC
package. It is also desirable to avoid any via in the circuit
path starting from the converter V
CC
pin, passing through
these two decoupling capacitors and returning to the
converter GND pin. The area encompassed by this circuit
path, as well as the path length, should be minimized.
Very low impedance ground and power planes and star
connections at both V
CC
and GND pins are preferable. The
V
CC
pin should have two distinct connections: the fi rst to the
decoupling capacitors described above and the second to
the power supply voltage. The GND pin should have three
distinct connections: the fi rst to the decoupling capacitors
described above, the second to the ground return for the
input signal source and the third to the ground return for
the power supply voltage source.
Driving V
IN
The V
IN
input drive requirements can be best analyzed
using the equivalent circuit of Figure 15. The input signal
V
SIG
is connected to the ADC input pin V
IN
through an
equivalent source resistance R
S
. This resistor includes
both the actual generator source resistance and any
additional optional resistor connected to the V
IN
pin. An
optional input capacitor C
IN
is also connected to the ADC
V
IN
pin. This capacitor is placed in parallel with the ADC
input parasitic capacitance C
PAR
. Depending upon the PCB
layout C
PAR
has typical values between 2pF and 15pF. In
addition, the equivalent circuit of Figure 15 includes the
converter equivalent internal resistor R
SW
and sampling
capacitor C
EQ
.
There are some immediate trade-offs in R
S
and C
IN
without
needing a full circuit analysis. Increasing R
S
and C
IN
can
give the following benefi ts:
1) Due to the LTC2450-1’s input sampling algorithm, the
input current drawn by V
IN
during the conversion cycle
is 50nA. A high R
S
C
IN
attenuates the high frequency
components of the input current, and R
S
values up to
1kΩ result in <1LSB error.
2) The bandwidth from V
SIG
is reduced at V
IN
.This band-
width reduction isolates the ADC from high frequency
signals, and as such provides simple antialiasing and
input noise reduction.
3) Noise generated by the ADC is attenuated before it goes
back to the signal source.
4) A large C
IN
gives a better AC ground at V
IN
, helping
reduce refl ections back to the signal source.
5) Increasing R
S
protects the ADC by limiting the current
during an outside-the-rails fault condition. R
S
can be
easily sized such as to protect against even extreme
fault conditions.
There is a limit to how large R
S
• C
IN
should be for a given
application. Increasing R
S
beyond a given point increases
the voltage drop across R
S
due to the input current, to
the point that signifi cant measurement errors exist. Ad-
ditionally, for some applications, increasing the R
S
• C
IN
product too much may unacceptably attenuate the signal
at frequencies of interest.
C
EQ
0.35pF
(TYP)
R
SW
15k
(TYP)
I
LEAK
I
LEAK
V
CC
R
S
C
IN
V
SIG
C
PAR
V
CC
I
CONV
24501 F15
V
IN
+

LTC2450CDC-1#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC 16-bit 60Hz Delta Sigma ADC in 2x2 DFN
Lifecycle:
New from this manufacturer.
Delivery:
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