UJA1079A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 31 January 2011 37 of 46
NXP Semiconductors
UJA1079A
LIN core system basis chip
[3] .
[4] t
PD(RX)sym
=t
PD(RX)r
t
PD(RX)f
.
[5] A system reset will be performed if the watchdog is in Window mode and is triggered less than t
trig(wd)1
after the start of the watchdog
period (or in the first half of the watchdog period).
[6] The nominal watchdog period is programmed via the NWP control bits in the WD_and_Status register (see Table 4
); valid in watchdog
Window mode only.
[7] The watchdog will be reset if it is in window mode and is triggered at least t
trig(wd)1
, but not more than t
trig(wd)2
, after the start of the
watchdog period (or in the second half of the watchdog period). A system reset will be performed if the watchdog is triggered more than
t
trig(wd)2
after the start of the watchdog period (watchdog overflows).
δ2 δ4,
t
bus rec()max()
2t
bit
×
--------------------------------
=
Fig 15. Timing test circuit for LIN transceiver
SBC
BAT
DLIN
TXDL
R
LIN
C
LIN
RXDL
C
RXDL
LIN
GND
015aaa20
4
Fig 16. LIN transceiver timing diagram
015aaa133
V
TXDL
LIN bus signal
V
BAT
t
bit
t
bus(rec)(min)
V
th(rec)RX(max)
thresholds of
receiving node A
V
th(dom)RX(max)
V
th(rec)RX(min)
V
th(dom)RX(min)
t
PD(RX)r
t
PD(RX)f
t
PD(RX)r
t
PD(RX)f
t
bus(rec)(max)
t
bit
t
bit
thresholds of
receiving node B
output of receiving
node A
V
RXDL
output of receiving
node B
V
RXDL
t
bus(dom)(max)
t
bus(dom)(min)
UJA1079A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 31 January 2011 38 of 46
NXP Semiconductors
UJA1079A
LIN core system basis chip
11. Test information
11.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q100 - Failure mechanism based stress test qualification for integrated
circuits, and is suitable for use in automotive applications.
Fig 17. SPI timing diagram
015aaa04
5
SCSN
SCK
SDI
SDO X
X X
MSB LSB
MSB LSB
t
v(Q)
floating floating
t
h(D)
t
su(D)
t
clk(L)
t
clk(H)
t
SPILEAD
T
cy(clk)
t
SPILAG
t
WH(S)
UJA1079A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 31 January 2011 39 of 46
NXP Semiconductors
UJA1079A
LIN core system basis chip
12. Package outline
Fig 18. Package outline SOT549-1 (HTSSOP32)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2)
eH
E
LL
p
Zywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
8
0
o
o
0.1
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
SOT549-1
03-04-07
05-11-02
w M
θ
A
A
1
A
2
E
h
D
h
D
L
p
detail X
E
Z
exposed die pad side
e
c
L
X
(A
3
)
0.25
1
16
32
17
y
b
H
E
0.95
0.85
0.30
0.19
D
h
5.1
4.9
E
h
3.6
3.4
0.20
0.09
11.1
10.9
6.2
6.0
8.3
7.9
0.65 1 0.2
0.78
0.48
0.1
0.75
0.50
p
v M
A
A
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
SOT549-
1
A
max.
1.1
0
2.5
5 mm
scale
pin 1 index
MO-153

UJA1079ATW/5V0WD,1

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
CAN Interface IC Hi Spd CAN Transcvr 4.5V-28V 6us
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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