AD9834
Rev. B | Page 6 of 32
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter Ratings
AVDD to AGND −0.3 V to +6 V
DVDD to DGND −0.3 V to +6 V
AVDD to DVDD −0.3 V to +0.3 V
AGND to DGND −0.3 V to +0.3 V
CAP/2.5V +2.75 V
Digital I/O Voltage to DGND −0.3 V to DVDD + 0.3 V
Analog I/O Voltage to AGND −0.3 V to AVDD + 0.3 V
Operating Temperature Range
Industrial (B Version) −40°C to +105°C
Storage Temperature Range −65°C to +150°C
Maximum Junction Temperature 150°C
TSSOP Package
θ
JA
Thermal Impedance 143°C/W
θ
JC
Thermal Impedance 45°C/W
Lead Temperature, Soldering (10 sec) 300°C
IR Reflow, Peak Temperature 220°C
Reflow Soldering (Pb-Free)
Peak Temperature 260°C (+0/–5)
Time at Peak Temperature 10 sec to 40 sec
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
