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74LVT374PW,112
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
74L
VT374
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
. 2011. All rights reserved.
Product data sheet
Rev
. 4
— 22 November 201
1
10 of 16
NXP Semiconductors
74L
VT374
3.3 V oct
al D-type flip-flop; 3-st
ate
12. Package
outline
Fig 10.
Package
outline SOT163-1 (SO2
0)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
(1)
eH
E
LL
p
Q
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
2.65
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT163-1
10
20
w
M
b
p
detail X
Z
e
11
1
D
y
0.25
075E04
MS-013
pin 1 index
0.1
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.51
0.49
0.30
0.29
0.05
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
0
5
10 mm
scale
X
θ
A
A
1
A
2
H
E
L
p
Q
E
c
L
v
M
A
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
99-12-27
03-02-19
74L
VT374
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
. 2011. All rights reserved.
Product data sheet
Rev
. 4
— 22 November 201
1
1
1 o
f 16
NXP Semiconductors
74L
VT374
3.3 V oct
al D-type flip-flop; 3-st
ate
Fig 1
1.
Package outline SOT339-1 (SSOP20
)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
eH
E
LL
p
Q
(1)
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
7.4
7.0
5.4
5.2
0.65
7.9
7.6
0.9
0.7
0.9
0.5
8
0
o
o
0.13
1.25
0.2
0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
1.03
0.63
SOT339-1
MO-150
99-12-27
03-02-19
X
w
M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
11
0
20
11
y
0.25
pin 1 index
0
2.5
5 mm
scale
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
A
max.
2
74L
VT374
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
. 2011. All rights reserved.
Product data sheet
Rev
. 4
— 22 November 201
1
12 of 16
NXP Semiconductors
74L
VT374
3.3 V oct
al D-type flip-flop; 3-st
ate
Fig 12.
Package ou
tline SOT360-1 (TSSOP20)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(2)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.5
0.2
8
0
o
o
0.13
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1
MO-153
99-12-27
03-02-19
w
M
b
p
D
Z
e
0.25
11
0
20
11
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v
M
A
X
A
y
0
2.5
5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
A
max.
1.1
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
74LVT374PW,112
Mfr. #:
Buy 74LVT374PW,112
Manufacturer:
NXP Semiconductors
Description:
Flip Flops 3.3V OCT D-TYPE 3-S
Lifecycle:
New from this manufacturer.
Delivery:
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