NB3L202K
www.onsemi.com
14
PACKAGE DIMENSIONS
QFN16 3x3, 0.5P
CASE 485AE
ISSUE B
16X
SEATING
PLANE
L
D
E
0.15 C
A
A1
e
D2
E2
b
1
4
58
12
9
16 13
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. OUTLINE MEETS JEDEC DIMENSIONS PER
MO−220, VARIATION VEED−6.
B
A
0.15
C
TOP VIEW
SIDE VIEW
BOTTOM VIEW
PIN 1
LOCATION
0.10 C
0.08 C
(A3)
C
16X
0.10 C
0.05
C
A B
NOTE 3
K
16X
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
A1
A3
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
DETAIL B
DETAIL A
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.50
PITCH
3.30
DIMENSIONS: MILLIMETERS
0.65
16X
0.30
16X
OUTLINE
PACKAGE
RECOMMENDED
1
3.30
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 0.00 0.05
b 0.18 0.30
D 3.00 BSC
D2 1.25 1.55
E 3.00 BSC
E2 1.25 1.55
e 0.50 BSC
L 0.30 0.50
A3 0.20 REF
L1 0.00 0.15
K
NOTE 4
e/2
0.20 −−−
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