NB3L202K
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7
Figure 3. Typical Phase Noise Plot at f
carrier
= 156.25 MHz at an Operating Voltage of 3.3 V, Room Temperature
The above phase noise data was captured using Agilent
E5052A/B. The data displays the input phase noise and
output phase noise used to calculate the additive phase jitter
at a specified integration range. The additive RMS phase
jitter contributed by the device (integrated between 12 kHz
and 20 MHz) is 45.7 fs.
The additive RMS phase jitter performance of the fanout
buffer is highly dependent on the phase noise of the input
source.
To obtain the most accurate additive phase noise
measurement, it is vital that the source phase noise be
notably lower than that of the DUT. If the phase noise of the
source is similar or greater than the device under test output,
the source noise will dominate the additive phase jitter
calculation and lead to an artificially low result for the
additive phase noise measurement within the integration
range.
Additive RMS phase jitter + RMS phase jitter of output
2
* RMS phase jitter of input
2
Ǹ
45.7 fs + 73.7 fs
2
* 57.8 fs
2
Ǹ
NB3L202K
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8
Table 6. ELECTRICAL CHARACTERISTICS − PHASE JITTER PARAMETERS
(V
DD
= V
DD_O
= 3.3 V ±10% or 2.5 V ±5%, T
A
= −40°C to 85°C)
Symbol
Parameter Conditions (Notes 34 and 39) Min Typ Max Unit
t
jphPCIeG1
Additive Phase Jitter
PCIe Gen 1 (Notes 35 and 36) 10 ps (p−p)
t
jphPCIeG2
PCIe Gen 2 Lo Band
10 kHz < f < 1.5 MHz (Notes 35 and 38)
0.3
ps
(rms)
PCIe Gen 2 High Band
1.5 MHz < f < Nyquist (50 MHz)
(Notes 35 and 38)
0.7
ps
(rms)
t
jphPCIeG3
PCIe Gen 3
(PLL BW of 2−4 MHz, CDR = 10 MHz)
(Notes 35 and 38)
0.3
ps
(rms)
t
jphQPI_SMI
QPI & SMI
(100.00 MHz or 133.33 MHz, 4.8 Gb/s,
6.4 Gb/s 12UI) (Notes 37 and 38)
0.3
ps
(rms)
QPI & SMI
(100.00 MHz, 8.0 Gb/s, 12UI) (Notes 37 and 38)
0.1
ps
(rms)
QPI & SMI
(100.00 MHz, 9.6 Gb/s, 12UI) (Notes 37 and 38)
0.1
ps
(rms)
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
34.Applies to all outputs.
35.See http://www.pcisig.com for complete specs
36.Sample size of at least 100K cycles. This figures extrapolates to 108 ps pk−pk @ 1M cycles for a BER of 1−12.
37.Calculated from Intel−supplied Clock Jitter Tool v 1.6.3.
38.For RMS figures, additive jitter is calculated by solving the following equation: (Additive jitter)
2
= (total jitter)
2
- (input jitter)
2
39.Guaranteed by design and characterization, not tested in production
NB3L202K
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9
CLK_IN
V
th
CLK_IN#
V
th
Figure 4. Differential Input Driven
Single−Ended
V
IH
V
IL
V
IHmax
V
ILmax
V
IH
V
th
V
IL
V
IHmin
V
ILmin
V
DD
V
thmax
V
thmin
GND
V
th
CLK_IN
CLK_IN#
V
ILDmax
V
IHDmax
V
IHDtyp
V
ILDtyp
V
IHDmin
V
ILDmin
V
IHCMR
GND
V
ID
= V
IHD
− V
ILD
V
DD
CLK_IN
CLK_IN#
DIF_n#
DIF_n
t
PLH
t
PHL
V
OUTPP
= V
OH
(DIF_n) −
V
OL
(DIF_n)
V
INPP
= V
IH
(CLK_IN) −
V
IL
(CLK_IN)
V
IHD
V
ILD
V
ID
= |V
IHD(IN)
− V
ILD(IN)|
CLK_IN
CLK_IN#
Figure 5. Differential Inputs
Driven Differentially
Figure 6. V
th
Diagram Figure 7. Differential Inputs Driven Differentially
Figure 8. V
IHCMR
Diagram Figure 9. AC Reference Measurement
CLK_IN
CLK_IN#
V
IHCMR
MAX
V
IHCMR
MIN

NB3L202KMNG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Buffer 1:2 HCSL FANOUT BUFFER
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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