CY23FP12
Document Number: 38-07246 Rev. *K Page 10 of 19
DC Electrical Specifications
Parameter Description Test Conditions Min Typ Max Unit
V
IL
Input LOW voltage
[3]
0.3 × V
DD
V
V
IH
Input HIGH voltage
[3]
0.7 × V
DD
––V
I
IL
Input LOW current
[3]
V
IN
= 0 V 50 A
I
IH
Input HIGH current
[3]
V
IN
= V
DD
––50A
V
OL
Output LOW voltage
[4]
V
DDA
/V
DDB
= 3.3 V,
I
OL
= 16 mA (standard drive)
V
DDA
/V
DDB
= 3.3 V,
I
OL
= 20 mA (high drive)
V
DDA
/V
DDB
= 2.5 V,
I
OL
= 16 mA (high drive)
––0.5V
V
OH
Output HIGH voltage
[4]
V
DDA
/V
DDB
= 3.3 V,
I
OH
= –16 mA (standard drive)
V
DDA
/V
DDB
= 3.3 V,
I
OH
= –20 mA (high drive)
V
DDA
/V
DDB
= 2.5 V,
I
OH
= –16 mA (high drive)
V
DD
– 0.5 V
I
DDS
Power-down supply current REF = 0 MHz 12 50 A
I
DD
Supply current V
DDA
= V
DDB
= 2.5 V,
Unloaded outputs at 166 MHz
–4065mA
V
DDA
= V
DDB
= 2.5 V,
Loaded outputs at 166 MHz,
C
L
= 15 pF
–65100
V
DDA
= V
DDB
= 3.3 V,
Unloaded outputs at 166 MHz
–5080
V
DDA
= V
DDB
= 3.3 V,
Loaded outputs at166 MHz,
C
L
= 15 pF
100 120
Thermal Resistance
Parameter
[5]
Description Test Conditions 28-pin SSOP Unit
θ
JA
Thermal resistance
(junction to ambient)
Test conditions follow standard test methods and
procedures for measuring thermal impedance, in
accordance with EIA/JESD51.
65 °C/W
θ
JC
Thermal resistance
(junction to case)
30 °C/W
Notes
3. Applies to both REF Clock and FBK.
4. Parameter is guaranteed by design and characterization. Not 100% tested in production.
5. These parameters are guaranteed by design and are not tested.
CY23FP12
Document Number: 38-07246 Rev. *K Page 11 of 19
Switching Characteristics
Parameter
[6]
Description Test Conditions Min Typ Max Unit
f
REF
Reference frequency
[7]
Commercial temperature 10 200 MHz
Industrial temperature 10 166.7
ER
REF
Reference edge rate 1 V/ns
DC
REF
Reference duty cycle 25 75 %
f
OUT
Output frequency
[8]
C
L
= 15 pF,
Commercial temperature
10 200 MHz
C
L
= 15 pF, Industrial temperature 10 166.7
C
L
= 30 pF,
Commercial temperature
10 100
C
L
= 30 pF, Industrial temperature 10 83.3
DC
OUT
Output duty cycle
[6]
V
DDA/B
= 3.3 V, measured at V
DD
/2 45 50 55 %
V
DDA/B
= 2.5 V, measured at V
DD
/2 40 50 60
t
3
Rise time
[6]
V
DDA/B
= 3.3 V, 0.8 V to 2.0 V,
C
L
= 30 pF (standard drive and high
drive)
1.6 ns
V
DDA/B
= 3.3 V, 0.8 V,10 V to 2.0 V,
C
L
= 15 pF (standard drive and high
drive)
0.8
V
DDA/B
= 2.5 V, 0.6 V to 1.8 V,
C
L
= 30 pF (high drive only)
2.0
V
DDA/B
= 2.5 V, 0.6 V to 1.8 V,
C
L
= 15 pF (high drive only)
1.0
t
4
Fall time
[6]
V
DDA/B
= 3.3 V, 0.8 V to 2.0 V,
C
L
= 30 pF (standard drive and high
drive)
1.6 ns
V
DDA/B
= 3.3 V, 0.8 V to 2.0 V,
C
L
= 15 pF (standard drive and high
drive)
0.8
V
DDA/B
= 2.5 V, 0.6 V to 1.8 V,
C
L
= 30 pF (high drive only)
1.6
V
DDA/B
= 2.5 V, 0.6 V to 1.8 V,
C
L
= 15 pF (high drive only)
0.8
Notes
6. All parameters are specified with loaded outputs.
7. When the device is configured as a non-PLL fanout buffer (PLL Power-down enabled), the reference frequency can be lower than 10 MHz. With auto power-down
disabled and PLL power-down enabled, the reference frequency can be as low as DC level.
8. When the device is configured as a non-PLL fanout buffer (PLL Power-down enabled), the output frequency can be lower than 10 MHz. With auto power-down disabled
and PLL power-down enabled, the output frequency can be as low as DC level.
CY23FP12
Document Number: 38-07246 Rev. *K Page 12 of 19
TTB Total timing budget
[9, 10]
,
Bank A and B same frequency
Outputs at 200 MHz, tracking skew
not included
650 ps
Total timing budget,
Bank A and B different frequency
850
t
5
Output to output skew
[11]
All outputs equally loaded 35
[12]
200 ps
Bank to bank skew Same frequency 200
Bank to bank skew Different frequency 400
Bank to bank skew Different voltage, same frequency 400
t
6
Input to output skew
(static phase offset)
[11]
Measured at V
DD
/2, REF to FBK 0 250 ps
t
7
Device-to-device skew
[11]
Measured at V
DD
/2 0 500 ps
t
J
Cycle-to-cycle jitter
[11]
(Peak) Banks A and B at same frequency 110
[13]
200 ps
Cycle-to-cycle jitter
[11]
(Peak) Banks A and B at different
frequencies
400
t
TSK
Tracking skew Input reference clock at < 50 KHz
modulation with ±3.75% spread
200 ps
t
LOCK
PLL lock time
[11]
Stable power supply, valid clock at
REF
1.0 ms
t
LD
Inserted loop delay Max loop delay for PLL Lock (stable
frequency)
7 ns
Max loop delay to meet Tracking
Skew Spec
4 ns
Switching Characteristics (continued)
Parameter
[6]
Description Test Conditions Min Typ Max Unit
Notes
9. Guaranteed by statistical correlation. Tested initially and after any design or process changes that may affect these parameters.
10. TTB is the window between the earliest and the latest output clocks with respect to the input reference clock across variations in output frequency, supply voltage,
operating temperature, input clock edge rate, and process. The measurements are taken with the AC test load specified and include output-output skew, cycle-cycle
jitter, and dynamic phase error.TTB will be equal to or smaller than the maximum specified value at a given frequency.
11. All parameters are specified with loaded outputs.
12. Same frequency, 15 pF load, high drive.
13. Same frequency, 15 pF load, low drive.

CY23FP12OXC-003

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
Phase Locked Loops - PLL 200MHz Field Program Zero Delay Buffer
Lifecycle:
New from this manufacturer.
Delivery:
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