ADMV1009 Data Sheet
Rev. B | Page 20 of 23
EVALUATION BOARD INFORMATION
The circuit board used in the application must use RF circuit
design techniques. Signal lines must have 50 Ω impedance, and
the package ground leads and exposed pad must be connected
directly to the ground plane, similar to what is shown in Figure 60
and Figure 61. Use a sufficient number of via holes to connect
the top and bottom ground planes. The evaluation circuit board
shown in Figure 59 is available from Analog Devices, Inc., upon
request.
Layout
Solder the exposed pad on the underside of the ADMV1009 to
a low thermal and electrical impedance ground plane. This pad
is typically soldered to an exposed opening in the solder mask
on the evaluation board. Connect these ground vias to all other
ground layers on the evaluation board to maximize heat
dissipation from the device package. Figure 60 shows the PCB
land pattern footprint for the ADMV1009-EVALZ, and Figure 61
shows the solder paste stencil for the ADMV1009-EVALZ
evaluation board.
Power-On Sequence
To set up the ADMV1009-EVALZ , take the following steps:
1. Power up the VGLO with a −1.5 V supply.
2. Power up the VDLO with a 5 V supply.
3. Adjust VGLO from −1.5 V to −0.5 V such that IDLO =
60 mA.
4. Power up VGRF with a −1.5 V supply.
5. Power up VDRF with a 5 V supply.
6. Adjust VGRF from −1.5 V to −0.5 V such that IDLO =
250 mA
7. Power up VGMIX with a −1.5 V supply.
8. Apply an LO signal.
9. Apply an IF signal.
Power Off Sequence
To tur n off the ADMV1009-EVA L Z , take the following steps:
1. Turn off the LO and IF signals.
2. Set VGRF and VGLO to −1.5 V.
3. Set the VDRF and VDLO supplies to 0 V and then turn off
the VDRF and VDLO supplies.
4. Turn off the VGRF and VGLO supplies.
0.138" SQUARE MASK OPENING
0.02 × 45° CHAMFER FOR PIN 1
0.197"
[0.50]
PAD SIZE
0.026" × 0.010"
0.217" SQUARE
0.004" MASK/METAL OVERLAP
0.010" MINIMUM MASK WIDTH
0.010" REF
0.030"
MASK OPENING
0.156"
MASK
OPENING
PIN 1
GROUND PAD
SOLDER MASK
0.146" SQUARE
GROUND PAD
ø.010"
TYPICAL VIA
ø.034"
TYPICAL
VIA SPACING
15770-104
Figure 60. PCB Land Pattern Footprint of the ADMV1009-EVALZ
