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ADMV1009AEZ

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P23
ADMV1009 Data Sheet
Rev. B | Page 4 of 23
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage
VDRF
6 V
VDLO 6 V
VGLO −2 V to 0 V
VGRF −2 V to 0 V
VGMIX −2 V to 0 V
Maximum Junction Temperature 175°C
Lifetime at Maximum Junction Temperature
>1 million hours
Maximum Power Dissipation 2.9 W
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Moisture Sensitivity Level (MSL) Rating MSL3
Input Power
LO
15 dBm
IF 15 dBm
Lead Temperature Range (Soldering 60 sec) 260°C
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM) 750 V
Field Induced Charged Device Model
(FICDM)
750 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θ
JA
is thermal resistance, junction to ambient (°C/W), and θ
JC
is
thermal resistance, junction to case (°C/W).
Table 3.
Package Type θ
JA
1
θ
JC
1
Unit
E-32-1
33.4
31
°C/W
1
See JEDEC standard JESD51-2 for additional information on optimal thermal
impedance (printed circuit board (PCB) within 3 × 3 vias)
ESD CAUTION
Data Sheet ADMV1009
Rev. B | Page 5 of 23
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
24 NIC
23
NIC
22 NIC
21 NIC
20
NIC
19
LOIN
18 GND
17 NIC
1
2
3
4
5
6
7
8
NIC
PIN1
INDICATOR
GND
RFOUT
NIC
NIC
NIC
VGRF
NIC
9
10
11
12
13
14
15
16
NIC
GND
IF2
NIC
NIC
IF1
GND
NIC
32
31
30
29
28
27
26
25
NIC
VDRF
NIC
VGMX
NIC
VDLO
VGLO
NIC
TOP VIEW
(Not to Scale)
ADMV1009
15770-002
NOTES
1.
NIC = NOT INTERNALLY CONNECTED. IT IS
RECOMMENDED TO GROUND THESE PINS
ON THE PCB.
2.
EXPOSED PAD. EXPOSED PAD MUST BE
CONNECTED TO GND. GOOD RF AND THERMAL
GROUNDING IS RECOMMENDED.
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 4 to 6, 8, 9, 12, 13, 16,
17, 20 to 25, 28, 30, 32
NIC Not Internally Connected. It is recommended to ground these pins on the PCB.
2, 10, 15, 18 GND Ground. These pins are grounded internally and must also be grounded on the PCB.
3
RFOUT
RF Output. This pin is ac-coupled internally and matched to 50 Ω, single-ended.
7 VGRF
Power Supply Voltage for the Gate of the RF Amplifier. Refer to the Applications Information
section for the required external components and biasing.
11, 14 IF2, IF1
Differential IF Inputs. These pins are matched to 50 Ω and are ac-coupled. No external dc block is
required.
19 LOIN Local Oscillator Input. This pin is ac-coupled and matched to 50 Ω.
26 VGLO
Power Supply Voltage for the Gate of the LO Amplifier. Refer to the Applications Information
section for the required external components and biasing.
27 VDLO
Power Supply Voltage for the LO Amplifier. Refer to the Applications Information section for the
required external components and biasing.
29 VGMIX
Power Supply Voltage for the Mixer. This pin is a high impedance port. Refer to the Applications
Information section for the required external components and biasing.
31 VDRF
Power Supply Voltage for the RF Amplifier. Refer to the Applications Information section for the
required external components and biasing.
EPAD
Exposed pad. The exposed pad must be connected to GND. Good RF and thermal grounding is
recommended.
ADMV1009 Data Sheet
Rev. B | Page 6 of 23
TYPICAL PERFORMANCE CHARACTERISTICS
IF FREQUENCY = 2.8 GHz
VDRF = 5 V, V D L O = 5 V, I D L O = 60 mA, IDRF = 250 mA, LO = −4 dBm ≤ LO ≤ +4 dBm, −40°C ≤ T
A
≤ +85°C, data taken with
Mini-Circuits NCS1-422+, RF transformer as upper sideband, unless otherwise noted.
25
0
5
10
15
20
12.0 12.5 13.0
13.5 14.0 14.5 15.0 15.5 16.0
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
15770-003
Figure 3. Conversion Gain vs. RF Frequency at Various Temperatures
80
0
10
30
50
70
20
40
60
12.0 12.5 13.0 13.5 14.0 14.5 15.0 15.5 16.0
SIDEBAND REJECTION (dBc)
RF FREQUENCY (GHz)
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
15770-004
Figure 4. Sideband Rejection vs. RF Frequency at Various Temperatures
50
0
5
15
25
40
10
20
30
45
35
12.0 12.5 13.0 13.5 14.0 14.5 15.0 15.5 16.0
OUTPUT IP3 (dBm)
RF FREQUENCY (GHz)
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
15770-005
Figure 5. Output IP3 vs. RF Frequency at Various Temperatures
25
0
5
10
15
20
12.0 12.5 13.0 13.5 14.0
14.5 15.0 15.5 16.0
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
+4dBm
0dBm
–4dBm
15770-006
Figure 6. Conversion Gain vs. RF Frequency at Various LO Powers
80
0
10
30
50
70
20
40
60
12.0 12.5 13.0 13.5 14.0 14.5 15.0 15.5 16.0
SIDEBAND REJECTION (dBc)
RF FREQUENCY (GHz)
+4dBm
0dBm
–4dBm
15770-007
Figure 7. Sideband Rejection vs. RF Frequency at Various LO Powers
50
0
5
15
25
40
10
20
30
45
35
12.0 12.5 13.0 13.5 14.0 14.5 15.0
15.5 16.0
OUTPUT IP3 (dBm)
RF FREQUENCY (GHz)
+4dBm
0dBm
–4dBm
15770-008
Figure 8. Output IP3 vs. RF Frequency at Various LO Powers
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P23

ADMV1009AEZ

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Manufacturer:
Analog Devices Inc.
Description:
Up-Down Converters 13/15GHz GaAs UpConverter
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