PACKAGE DIMENSIONS
MPC9443
REVISION 6 3/14/16 13 ©2016 Integrated Device Technology, Inc.
MPC9443 Data Sheet 2.5V, 3.3V LVCMOS CLOCK FANOUT BUFFER
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5m, 1994.
CONTROLLING DIMENSION: MILLIMETER.
DATUM PLAN AB IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
DATUMS T, U, AND Z TO BE DETERMINED AT
DATAUM PLANE AB.
DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE AC.
DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE AB.
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350.
MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
A
A1
Z
0.200 AB T-U
4X
Z0.200 AC T-U
4X
B
B1
1
12
13
24
25
36
3748
S1
S
V
V1
DETAIL Y
9
T
U
Z
P
AE AE
T, U, Z
DETAIL Y
TOP & BOTTOM
W
K
AA
E
C
H
0.250
R
DETAIL AD
GAUGE PLANE
AD
G
0.080 AC
AB
AC
BASE METAL
N
J
F
D
T- U
M
0.080 ZAC
SECTION AE-AE
MIN
1.400
0.170
1.350
0.170
0.050
0.090
0.500
0.090
0.150
MAX
1.600
0.270
1.450
0.230
0.150
0.200
0.700
0.160
0.250
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
L
R
S
S1
V
V1
W
AA
MILLIMETERS
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.500 BSC
12˚ REF
0.250 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
CASE 932-03
ISSUE F
48-LEAD LQFP PACKAGE
MPC9443
REVISION 6 3/14/16 14 ©2016 Integrated Device Technology, Inc.
MPC9443 Data Sheet 2.5V, 3.3V LVCMOS CLOCK FANOUT BUFFER
Revision History Sheet
Rev Table Page Description of Change Date
6 1 NRND – Not Recommend for New Designs 12/20/12
6 2 Updated Pin 37 from V
CC
to V
CCA
. Typographical error introduced during datasheet
migration from Motorola to Freescale.
8/23/13
6 1 Removed NRND. 5/5/15
6 Product Discontinuation Notice - Last time buy expires September 7, 2016.
PDN N-16-02
3/14/16
MPC9443 Data Sheet 2.5V, 3.3V LVCMOS CLOCK FANOUT BUFFER
DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document,
including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined in the independent state and are not
guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the
suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any
license under intellectual property rights of IDT or any third parties.
IDT’s products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to signifi-
cantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are registered trademarks of IDT. Other trademarks and service marks used herein, including protected names, logos and designs, are the property of IDT or their respective third
party owners.
Copyright 2016. All rights reserved.
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MPC9443AER2

Mfr. #:
Manufacturer:
IDT
Description:
Clock Drivers & Distribution FSL 1-16 LVCMOS Fanout Buffer
Lifecycle:
New from this manufacturer.
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