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SI8503-C-IMR

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36
Si85xx
Preliminary Rev. 0.4 31
10. Recommended PCB Land Pattern (20-Pin SOIC)
Figure 26 illustrates the PCB land pattern details for the 20-pin SOIC package. Table 17 lists the values for the
dimensions shown in the illustration.
Figure 26. 20-Pin SOIC PCB Land Pattern
Table 17. 20-Pin SOIC PCB Land Pattern Dimensions
Dimension mm
C1 9.40
E1.27
X1 0.60
Y1 1.90
Notes:
1. This Land Pattern Design is based on IPC-7351 design guidelines for
Density Level B (Median Land Protrusion).
2. All feature sizes shown are at Maximum Material Condition (MMC) and a
card fabrication tolerance of 0.05 mm is assumed.
Si85xx
32 Preliminary Rev. 0.4
11. Top Marking (QFN)
Figure 27. QFN Top Marking
Table 18. Top Marking Explanation
Line 1 Marking: Device Part Number Si85XX:
Where XX = 01, 02, 03, 11, 12, 13, 17, 18, 19
Line 2 Marking: RTTTTT = Mfg Code Manufacturing code from assembly house
“R” indicates revision
Line 3 Marking: Circle Bottom-Left Justified Pin 1 Identifier
YY = Year
WW = Work Week
Corresponds to the year and work week of the assembly
build date.
Si85XX
RTTTTT
YYWW
Si85xx
Preliminary Rev. 0.4 33
12. Top Marking (SOIC)
Figure 28. SOIC Top Marking
Table 19. Top Marking Explanation
Line 1 Marking: Device Part Number Si85XX-IS
Where XX = 01, 02, 03, 11, 12, 13, 17, 18, 19
Line 2 Marking: YY = Year
WW = Work Week
Assigned by the Assembly House. Corresponds to the
year and work week of the mold date.
RTTTTT = Mfg Code Manufacturing code from assembly house
“R” indicates revision
Line 3 Marking: Circle = 1.5 mm Diameter
(Center Justified)
“e3” Pb-Free Symbol
Country of Origin
ISO Code Abbreviation
TW = Taiwan
Si85XX-IS
YYWWRTTTTT
TW
e3
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36

SI8503-C-IMR

Mfr. #:
Buy SI8503-C-IMR
Manufacturer:
Silicon Labs
Description:
SENSOR CURRENT XFMR 20A AC
Lifecycle:
New from this manufacturer.
Delivery:
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