4
Package Outline Drawings
HCPL-9000, HCPL-9030 and HCPL-9031 Standard DIP Packages
HCPL-9000, HCPL-9030 and HCPL-9031 Gull Wing Surface Mount Option 300
5678
4321
DIMENSIONS: INCHES (MILLIMETERS)
MIN
MAX
0.120 (3.048)
0.150 (3.810)
0.240 (6.096)
0.260 (6.604)
0.015 (0.381)
0.035 (0.889)
0.55 (1.397)
0.65 (1.651)
0.008 (0.203)
0.015 (0.381)
°
3°
8°
0.030 (0.762)
0.045 (1.143)
0.015 (0.380)
0.023 (0.584)
0.045 (1.143)
0.065 (1.651)
0.090 (2.286)
0.110 (2.794)
0.360 (9.000)
0.400 (10.160)
0.290 (7.366)
0.310 (7.874)
0.300 (7.620)
0.370 (9.398)
0.030 (0.762)
0.045 (1.143)
0.360 (9.000)
0.400 (10.160)
0.240 (6.096)
0.260 (6.604)
8 7 6 5
4321
0.045 (1.143)
0.065 (1.651)
0.120 (3.048)
0.150 (3.810)
0.047 (1.194)
0.070 (1.778)
0.040 (1.016)
0.047 (1.194)
0.370 (9.398)
0.390 (9.906)
0.190
(4.826)
0.015 (0.381)
0.025 (0.635)
0.025 (0.632)
0.035 (0.892)
0.030 (0.760)
0.056 (1.400)
0.015 (0.385)
0.035 (0.885)
0.290 (7.370)
0.310 (7.870)
0.370 (9.400)
0.390 (9.900)
PAD LOCATION (for reference only)
TYP.
12
° NOM.
0.008 (0.203)
0.013 (0.330)
0.100
(2.540)
BSC
DIMENSIONS INCHES (MILLIMETERS)
LEAD COPLANARITY = 0.004 INCHES (0.10 mm)
MIN
MAX
5
HCPL-0900, HCPL-0930 and HCPL-0931 Small Outline SO-8 Package
HCPL-900J, HCPL-901J and HCPL-902J Wide Body SOIC-16 Package
1
Pin 1 indent
8
7° TYP
0.394 (10.007)
0.419 (10.643)
0.397 (10.084)
0.413 (10.490)
0.013 (0.330)
0.020 (0.508)
0.040 (1.016)
0.060 (1.524)
0.080 (2.032)
0.100 (2.54)
0.092 (2.337)
0.105 (2.670)
0.004 (0.1016)
0.012 (0.300)
0.016 (0.40)
0.050 (1.27)
0.287 (7.290)
0.300 (7.620)
7° TYP
0.007 (0.200)
0.013 (0.330)
DIMENSIONS: INCHES (MILLIMETERS)
MIN
MAX
8 7
6 5
4
3
2
1
0.228 (5.80)
0.244 (6.20)
0.189 (4.80)
0.197 (5.00)
0.150 (3.80)
0.157 (4.00)
0.013 (0.33)
0.020 (0.51)
0.040 (1.016)
0.060 (1.524)
0.004 (0.10)
0.010 (0.25)
0.054 (1.37)
0.069 (1.75)
0.016 (0.40)
0.050 (1.27)
0.008 (0.19)
0.010 (0.25)
0.010 (0.25)
0.020 (0.50)
x 45°
DIMENSIONS: INCHES (MILLIMETERS)
MIN
MAX
6
HCPL-090J, HCPL-091J and HCPL-092J Narrow Body SOIC-16 Package
Package Characteristics
Parameter Symbol Min. Typ. Max. Units Test Conditions
Capacitance (Input-Output)
[1]
C
I-O
pF f = 1 MHz
Single Channel 1.1
Dual Channel 2.0
Quad Channel 4.0
Thermal Resistance θ
JCT
°C/W Thermocouple located at
8-Pin PDIP 54 center underside of package
8-Pin SOIC 144
16-Pin SOIC Narrow Body 41
16-Pin SOIC Wide Body 28
Package Power Dissipation P
PD
mW
8-Pin PDIP 150
8-Pin SOIC 150
16-Pin SOIC Narrow Body 150
16-Pin SOIC Wide Body 150
Notes:
1. Single and dual channels device are considered two-terminal devices: pins 1-4 shorted and pins 5-8 shorted. Quad channel devices are con-
sidered two-terminal devices: pins 1-8 shorted and pins 9-16 shorted.
This product has been tested for electrostatic sensitivity to the limits stated in the specications. However, Avago recommends that all inte-
grated circuits be handled with appropriate care to avoid damage. Damage caused by inappropriate handling or storage could range from
performance degradation to complete failure.
1
Pin 1 indent
8
0.228 (5.791)
0.244 (6.197)
0.386 (9.802)
0.394 (9.999)
0.152 (3.861)
0.157 (3.988)
0.013 (0.330)
0.020 (0.508)
0.040 (1.016)
0.060 (1.524)
0.040 (1.020)
0.050 (1.270)
0.054 (1.372)
0.072 (1.800)
0.004 (0.102)
0.012 (0.300)
0.016 (0.406)
0.050 (1.270)
0.007 (0.200)
0.013 (0.330)
DIMENSIONS: INCHES (MILLIMETERS)
MIN
MAX

HCPL-090J-500E

Mfr. #:
Manufacturer:
Broadcom / Avago
Description:
Digital Isolators Digital Isolator 100MBd
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union