13©2016 Integrated Device Technology, Inc Revision B January 27, 2016
8735-31 Data Sheet
Layout Guideline
The schematic of the 8735-31 layout example is shown in Figure 5A.
The 8735-31 recommended PCB board layout for this example is
shown in Figure 5B. This layout example is used as a general
guideline. The layout in the actual system will depend on the
selected component types, the density of the components, the
density of the traces, and the stacking of the P.C. board.
Figure 5A. 8735-31 LVPECL Zero Delay Buffer Schematic Example
CLK_SEL
C4
0.1uF
C2
0.1uF
Zo = 50 Ohm
3.3V PECL Driver
SEL0
(155.52 MHz)
R7
10
R6
50
C1
0.1uF
Output
Termination
Example
Zo = 50 Ohm
R3
50
VCCO=3.3V
SEL2
(U1-17)
(77.76 MHz)
SEL2
SEL1
VCCO
RU4
1K
SEL[3:0] = 0101,
Divide by 2
Bypass capacitor located near the power pins
C16
10u
(U1-9)
R10
50
(U1-32)
RU6
1K
VCC
SEL0
3.3V
VCC
(U1-16)
VCC
SEL1
CLK_SEL
C6
0.1uF
(U1-25)
C5
0.1uF
(U1-24)
R4
50
RU7
SP
RU3
1K
SP = Space (i.e. not intstalled)
R5
50
RU5
SP
PLL_SEL
U1
8735-31
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
32
31
30
29
28
27
26
25
SEL0
SEL1
CLK0
nCLK0
CLK1
nCLK1
CLK_SEL
MR
VCC
nFB_IN
FB_IN
SEL2
VEE
nQ0
Q0
VCCO
VCCO
nQ1
Q1
nQ2
Q2
nQ3
Q3
VCCO
VCC
PLL_SEL
VCCA
SEL3
VEE
Q4
nQ4
VCCO
PLL_SEL
RD3
SP
R9
50
SEL3
R8
50
C11
0.01u
RD2
1K
Zo = 50 Ohm
RD4
SP
VCCO
VCC=3.3V
R1
50
RD7
1K
SEL3
LVPECL_input
+
-
VCCA
C7
0.1uF
RU2
SP
RD5
1K
Zo = 50 Ohm
VCC
R2
50
RD6
SP
14©2016 Integrated Device Technology, Inc Revision B January 27, 2016
8735-31 Data Sheet
The following component footprints are used in this layout
example. All the resistors and capacitors are size 0603.
Power and Grounding
Place the decoupling capacitors C1, C6, C2, C4, C5, and C7, as
close as possible to the power pins. If space allows, placement of
the decoupling capacitor on the component side is preferred. This
can reduce unwanted inductance between the decoupling
capacitor and the power pin caused by the via.
Maximize the power and ground pad sizes and number of vias
capacitors. This can reduce the inductance between the power
and ground planes and the component power and ground pins.
The RC filter consisting of R7, C11, and C16 should be placed as
close to the V
CCA
pin as possible.
Clock Traces and Termination
Poor signal integrity can degrade the system performance or
cause system failure. In synchronous high-speed digital systems,
the clock signal is less tolerant to poor signal integrity than other
signals. Any ringing on the rising or falling edge or excessive ring
back can cause system failure. The shape of the trace and the
trace delay might be restricted by the available space on the
board and the component location. While routing the traces, the
clock signal traces should be routed first and should be locked
prior to routing other signal traces.
The differential 50 output traces should have the
same length.
Avoid sharp angles on the clock trace. Sharp angle
turns cause the characteristic impedance to change on
the transmission lines.
Keep the clock traces on the same layer. Whenever
possible, avoid placing vias on the clock traces.
Placement of vias on the traces can affect the trace
characteristic impedance and hence degrade signal
integrity.
To prevent cross talk, avoid routing other signal traces in
parallel with the clock traces. If running parallel traces is
unavoidable, allow a separation of at least three trace
widths between the differential clock trace and the other
signal trace.
Make sure no other signal traces are routed between
the clock trace pair.
The matching termination resistors should be located
as close to the receiver input pins as possible.
Figure 5B. PCB Board Layout for 8735-31
GND
C7
C16
VCCA
VIA
U1
VCC
C4
50 Ohm
Traces
C1
C6
VCCO
R7
C5
C2
Pin 1
C11
15©2016 Integrated Device Technology, Inc Revision B January 27, 2016
8735-31 Data Sheet
Power Considerations
This section provides information on power dissipation and junction temperature for the 8735-31.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the 8735-31 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
CC_MAX
= 3.465V * 150mA = 519.75mW
Power (outputs)
MAX
= 30mW/Loaded output pair
If all outputs are loaded, the total power is 5 * 30mW = 150mW
Total Power_
MAX
= (3.465V, with all outputs switching) = 519.75mW + 150mW = 669.75mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device.
The maximum recommended junction temperature for HiPerClockS devices is 125°C.
The equation for Tj is as follows: Tj =
JA
* Pd_total + T
A
Tj = Junction Temperature
JA
= Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A
= Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
JA
must be used. Assuming no air flow
and a multi-layer board, the appropriate value is 42.1°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.670W * 42.1°C/W = 98.2°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type
of board (multi-layer).
Table 7. Thermal Resistance
JA
for 32 Lead LQFP, Forced Convection
JA
vs. Air Flow
Linear Feet per Minute 0200500
Single-Layer PCB, JEDEC Standard Test Boards 67.8°C/W 55.9°C/W 50.1°C/W
Multi-Layer PCB, JEDEC Standard Test Boards 47.9°C/W 42.1°C/W 39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.

8735AY-31LF

Mfr. #:
Manufacturer:
IDT
Description:
Clock Generators & Support Products 5 LVPECL OUT DIVIDER
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet