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HMC260ALC3BTR

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
10 GHz to 26 GHz, GaAs, MMIC,
Double Balanced Mixer
Data Sheet
HMC260ALC3B
Rev. 0 Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2018 Analog Devices, Inc. All rights reserved.
Technical Support www.analog.com
FEATURES
Passive; no dc bias required
Conversion loss
8 dB typical for 10 GHz to 18 GHz
9 dB typical for 18 GHz to 26 GHz
LO to RF isolation: 40 dB
Input IP3: 19 dBm typical for 18 GHz to 26 GHz
Wide IF bandwidth: dc to 8 GHz
RoHS compliant, 12-terminal, 3 mm × 3 mm, ceramic
LCC package: 9 mm
2
APPLICATIONS
Point to point radios
Point to multipoint radios and very small aperture terminals
(VSATs)
Test equipment and sensors
Military end use
FUNCTIONAL BLOCK DIAGRAM
13884-001
1
GND
7
GND
PACKAGE
BASE
8
RF
9
GND
10
NIC
11
NIC
12
NIC
4
2
LO
3
GND
56
HMC260ALC3B
GND
IF
GND
Figure 1.
GENERAL DESCRIPTION
The HMC260ALC3B is a general-purpose, double balanced,
monolithic microwave integrated circuit (MMIC) mixer housed in
a leadless, Pb-free, RoHS compliant LCC package. The device
can be used as an upconverter or downconverter in the 10 GHz to
26 GHz frequency range. The HMC260ALC3B mixer requires no
external components or matching circuitry.
The HMC260ALC3B provides local oscillator (LO) to radio
frequency (RF) and LO to intermediate frequency (IF)
suppression due to optimized balun structures. The mixer
operates with LO amplitude levels between 9 dBm and 15 dBm.
The HMC260ALC3B eliminates the need for wire bonding,
allowing the use of surface-mount manufacturing techniques.
HMC260ALC3B Data Sheet
Rev. 0 | Page 2 of 16
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution .................................................................................. 4
Pin Configuration and Function Descriptions ............................. 5
Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6
Downconverter Performance ...................................................... 6
Upconverter Performance ............................................................8
Isolation and Return Loss ............................................................9
IF Bandwidth—Downconverter ............................................... 11
IF Bandwidth—Upconverter .................................................... 12
Spurious and Harmonics Performance ................................... 13
Theory of Operation ...................................................................... 14
Applications Information .............................................................. 15
Typical Application Circuit ....................................................... 15
Evaluation PCB Information .................................................... 15
Outline Dimensions ....................................................................... 16
Ordering Guide .......................................................................... 16
REVISION HISTORY
1/2018—Revision 0: Initial Version
Data Sheet HMC260ALC3B
Rev. 0 | Page 3 of 16
SPECIFICATIONS
Ambient temperature (T
A
) = 25°C, IF = 1000 MHz, LO = 13 dBm, upper sideband. All measurements performed as a downconverter on the
evaluation printed circuit board (PCB), unless otherwise noted.
Table 1.
Parameter Symbol Min Typ Max Unit Test Conditions/Comments
FREQUENCY RANGE
RF 10 26 GHz
LO Input 10 26 GHz
IF dc 8 GHz
LO AMPLITUDE 9 13 15 dBm
10 GHz TO 18 GHz PERFORMANCE
Downconverter
Conversion Loss 8 10 dB
Single Sideband Noise Figure SSB NF 8 dB
Input Third-Order Intercept IIP3 13 18 dBm
Input 1 dB Compression Point IP1dB 9.5 dBm
Input Second-Order Intercept IIP2 43 dBm
Upconverter IF
IN
IF
IN
= 1000 MHz
Conversion Loss 7 dB
Input Third-Order Intercept IIP3 18 dBm
Input 1 dB Compression Point IP1dB 7 dBm
Isolation
RF to IF 14 21 dB
LO to RF 40 dB
LO to IF 25 35 dB
18 GHz TO 26 GHz PERFORMANCE
Downconverter
Conversion Loss 9 12 dB
Single Sideband Noise Figure SSB NF 10 dB
Input Third-Order Intercept IIP3 18 23 dBm
Input 1 dB Compression Point IP1dB 13 dBm
Input Second-Order Intercept IIP2 46 dBm
Upconverter IF
IN
IF
IN
= 1000 MHz
Conversion Loss 8 dB
Input Third-Order Intercept IIP3 19 dBm
Input 1 dB Compression Point IP1dB 8.5 dBm
Isolation
RF to IF 25 35 dB
LO to RF 40 dB
LO to IF 30 43 dB
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

HMC260ALC3BTR

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RF Mixer Mixer
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