HMC260ALC3B Data Sheet
Rev. 0 | Page 16 of 16
OUTLINE DIMENSIONS
03-02-2017-A
KG-004837
0.50
BSC
0.32
BSC
BOTTOM VIEW
TOP VIEW
SIDE VIEW
0.08
BSC
1
4
6
7
9
10 12
3
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.36
0.30
0.24
P
I
N
1
EXPOSED
PAD
PIN 1
INDICATOR
3.05
2.90 SQ
2.75
2.10 BSC
1.00 REF
1.60
1.50 SQ
1.40
0.90
0.80
0.70
SEATING
PLANE
Figure 42. 12-Terminal Ceramic Leadless Chip Carrier (LCC)
(E-12-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range MSL Rating
2
Package Description Package Option
HMC260ALC3B −40°C to +85°C MSL3 12-Terminal LCC E-12-4
HMC260ALC3BTR −40°C to +85°C MSL3 12-Terminal LCC E-12-4
HMC260ALC3BTR-R5 −40°C to +85°C MSL3 12-Terminal LCC E-12-4
EV1HMC260ALC3B Evaluation PCB
1
All models are RoHS compliant devices.
2
The peak reflow temperature is 260°C. See Table 2 in the Absolute Maximum Ratings section.
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D13884-0-1/18(0)
