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HMC260ALC3BTR

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
HMC260ALC3B Data Sheet
Rev. 0 | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
RF Input Power 25 dBm
LO Input Power 27 dBm
IF Input Power 25 dBm
IF Source/Sink Current 3 mA
Peak Reflow Temperature 260°C
Continuous Power Dissipation, P
DISS
(T
A
= 85°C, Derate 5 mW/°C Above 85°C)
260 mW
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Lead Temperature Range −65°C to +150°C
Electrostatic Discharge (ESD) Sensitivity
Human Body Model 500 V
Field Induced Charged Device Model 1000 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θ
JA
is the natural convection junction to ambient thermal resistance
measured in a one cubic foot sealed enclosure. θ
JC
is the junction to
case thermal resistance.
Table 3. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
E-12-4
1
120 200 °C/W
1
See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
ESD CAUTION
Data Sheet HMC260ALC3B
Rev. 0 | Page 5 of 16
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
GND
7
GND
PACKAGE
BASE
8
RF
9
GND
10
NIC
11
NIC
12
NIC
4
GND
13884-002
2
LO
3
GND
5
IF
6
GND
HMC260ALC3B
TOP VIEW
(Not to Scale)
NOTES
1. NIC = NOT INTERNALLY CONNECTED. THESE
PINS CAN BE CONNECTED TO RF/DC GROUND.
PERFORMANCE IS NOT AFFECTED.
2
. EXPOSED PAD. THE EXPOSED PAD MUST BE
CONNECTED TO RF/DC GROUND.
Figure 2.
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 3, 4, 6, 7, 9 GND Ground. These pins and package bottoms connect to RF/dc ground.
2 LO Local Oscillator Port. This pin is ac-coupled and matched to 50 Ω.
5 IF
Intermediate Frequency Port. This pin is dc-coupled. For applications, not requiring operation to dc, dc
block this port externally using a series capacitor of a value chosen to pass the necessary IF frequency
range. For operation to dc, this pin must not source or sink more than 3 mA of current or die malfunction
and possible die failure may result. See Figure 5 for the interface schematic.
8 RF Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω.
10 to 12 NIC Not Internally Connected. These pins can be connected to RF/dc ground. Device performance is not affected.
EPAD Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS
G
ND
13884-003
Figure 3. GND Interface Schematic
LO
13884-004
Figure 4. LO Interface Schematic
IF
13884-005
Figure 5. IF Interface Schematic
RF
13884-006
Figure 6. RF Interface Schematic
HMC260ALC3B Data Sheet
Rev. 0 | Page 6 of 16
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE
Downconverter performance at IF = 1000 MHz, upper sideband (low-side LO).
0
–20
9.5
26.5
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
–15
–10
–5
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
13884-007
Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 13 dBm
30
0
INPUT IP3 (dBm)
9.5
26.5
RF FREQUENCY (GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
5
10
15
20
25
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
13884-008
Figure 8. Input IP3 vs. RF Frequency at Various Temperatures,
LO = 13 dBm
20
15
10
5
0
NOISE FIGURE (dB)
9.5
26.5
RF FREQUENCY (GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
T
A
= +85°C
T
A
= +25°C
T
A
= –40°C
13884-009
Figure 9. Noise Figure vs. RF Frequency at Various Temperatures,
LO = 13 dBm
0
–20
9.5
26.5
CONVERSION GAIN (dB)
RF FREQUENCY (GHz)
–15
–10
–5
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
13884-010
Figure 10. Conversion Gain vs. RF Frequency at Various LO Power Levels,
T
A
= 25°C
30
0
INPUT IP3 (dBm)
9.5
26.5
RF FREQUENCY (GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
5
10
15
20
25
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
13884-011
Figure 11. Input IP3 vs. RF Frequency at Various LO Power Levels,
T
A
= 25°C
20
15
10
5
0
NOISE FIGURE (dB)
9.5
26.5
RF FREQUENCY (GHz)
10.5
11.5
12.5
13.5
14.5
15.5
16.5
17.5
18.5
19.5
20.5
21.5
22.5
23.5
24.5
25.5
LO = 9dBm
LO = 11dBm
LO = 13dBm
LO = 15dBm
13884-012
Figure 12. Noise Figure vs. RF Frequency at Various LO Power Levels, T
A
= 25°C
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

HMC260ALC3BTR

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Buy HMC260ALC3BTR
Manufacturer:
Analog Devices Inc.
Description:
RF Mixer Mixer
Lifecycle:
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