LT3755IMSE-2#TRPBF Datasheet LT3755EMSE-2#PBF, LT3755EMSE-2#TRPBF, LT3755EUD-1#PBF | P22-P24

LT3755/LT3755-1/LT3755-2

37551fd

Typical applicaTions

21W Buck-Boost Mode with 250:1 PWM Dimming and Open LED Protection

LT3755-2

GND

SHDN/UVLO

REF

INTV

499k

100k

0.1Ω

21.5V

50V

2.2µF

8V TO

36V

15µH

M1: VISHAY SILICONIX SI7850DP

M2: VISHAY SILICONIX SI2319DS

Q1: ZETEX FMMT558

Q2: MMBTA42

D1: DIODES INC. PDS560

L1: SUMIDA CDRH127/LD-150

93.1k

392k

1.5k

20.0k

100k

549k

75.0k

0.01µF

4.7µF

CTRL

4.7k

4700pF

37551 TA07a

OPENLED

ISN

ISP

PWMOUT

PWM PWM

SENSE

GATE

100V

2.2µF

28.7k

375kHz

0.02Ω

Buck-Boost Mode LED Current vs Low Input VoltageBuck-Boost Mode Efﬁciency vs Input Voltage

37551 TA07b

EFFICIENCY (%)

INPUT VOLTAGE (V)

0 1510 25 305 20 35 40

100

37551 TA07c

LED CURRENT (A)

INPUT VOLTAGE (V)

8 1110 13 149 12 15 16

0.8

0.95

1.10

0.85

0.9

1.05

LT3755/LT3755-1/LT3755-2

37551fd

package DescripTion

MSE Package

16-Lead Plastic MSOP, Exposed Die Pad

(Reference LTC DWG # 05-08-1667 Rev A)

MSOP (MSE16) 0608 REV A

0.53 p 0.152

(.021 p .006)

SEATING

PLANE

0.18

(.007)

1.10

(.043)

MAX

0.17 –0.27

(.007 – .011)

TYP

0.86

(.034)

REF

0.50

(.0197)

BSC

16151413121110

1 2 3 4 5 6 7 8

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.254

(.010)

0o – 6o TYP

DETAIL “A”

GAUGE PLANE

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

0.889 p 0.127

(.035 p .005)

RECOMMENDED SOLDER PAD LAYOUT

0.305 p 0.038

(.0120 p .0015)

TYP

0.50

(.0197)

BSC

BOTTOM VIEW OF

EXPOSED PAD OPTION

2.845 p 0.102

(.112 p .004)

2.845 p 0.102

(.112 p .004)

4.039 p 0.102

(.159 p .004)

(NOTE 3)

1.651 p 0.102

(.065 p .004)

1.651 p 0.102

(.065 p .004)

0.1016 p 0.0508

(.004 p .002)

3.00 p 0.102

(.118 p .004)

(NOTE 4)

0.280 p 0.076

(.011 p .003)

REF

4.90 p 0.152

(.193 p .006)

MSE Package

16-Lead Plastic MSOP, Exposed Die Pad

(Reference LTC DWG # 05-08-1667 Rev A)

DETAIL “B”

CORNER TAIL IS PART OF

THE LEADFRAME FEATURE.

FOR REFERENCE ONLY

NO MEASUREMENT PURPOSE

0.12 REF

0.35

REF

LT3755/LT3755-1/LT3755-2

37551fd

package DescripTion

UD Package

16-Lead Plastic QFN (3mm × 3mm)

(Reference LTC DWG # 05-08-1691)

3.00 ± 0.10

(4 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.45 ± 0.05

(4 SIDES)

NOTE:

1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

PIN 1

TOP MARK

(NOTE 6)

0.40 ± 0.10

BOTTOM VIEW—EXPOSED PAD

1.45 ± 0.10

(4-SIDES)

0.75 ± 0.05

R = 0.115

TYP

0.25 ± 0.05

PIN 1 NOTCH R = 0.20 TYP

OR 0.25 × 45° CHAMFER

15 16

0.50 BSC

0.200 REF

2.10 ± 0.05

3.50 ± 0.05

0.70 ±0.05

0.00 – 0.05

(UD16) QFN 0904

0.25 ±0.05

0.50 BSC

PACKAGE OUTLINE

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P18 P19-P21 P22-P24 P25-P26

LT3755IMSE-2#TRPBF

Mfr. #:

Buy LT3755IMSE-2#TRPBF

Manufacturer:

Analog Devices / Linear Technology

Description:

LED Lighting Drivers 75V Full-Featured LED Controller

Lifecycle:

New from this manufacturer.

Delivery:

DHL FedEx Ups TNT EMS

Payment:

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LT3755IMSE-2#TRPBF

LT3755IMSE-2#TRPBF

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