PCF8564A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 3 — 26 August 2013 37 of 48
NXP Semiconductors
PCF8564A
Real time clock and calendar
[1] Pressure of diamond head: 10 g to 50 g.
Table 34. Pin location of all PCF8564A types
All x/y coordinates represent the position of the center of each pin with respect to the center (x/y = 0)
of the chip; see Figure 27 and Figure 28.
Symbol Pad X (m) Y (m) Description
OSCI 1 523.0 689.4 oscillator input
OSCO 2 523.0 469.4 oscillator output
INT
3 523.0 429.8 open-drain interrupt output (active LOW)
V
SS
4 523.0 684.4 ground (substrate)
SDA 5 524.9 523.8 serial data I/O
SCL 6 524.9 138.6 serial clock input
CLKOUT 7 524.9 162.5 CMOS push-pull clock output
V
DD
8 524.9 443.3 supply
CLKOE 9 524.9 716.3 CLKOUT output enable
Fig 29. Alignment marks of all PCF8564A types
Table 35. Alignment marks of all PCF8564A types
All x/y coordinates represent the position of the REF point (see Figure 29
) with respect to the center
(x/y = 0) of the chip; see Figure 27
and Figure 28.
Alignment markers Size (m) X (m) Y (m)
C1 100 100 465.2 826.3
C2 100 100 523.0 890.0
F90 117 569.9 885.5
Table 36. Gold bump hardness
Type number Min Max Unit
[1]
PCF8564AUG/12HB/1 35 80 HV
5()
5()
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5()
PCF8564A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 3 — 26 August 2013 38 of 48
NXP Semiconductors
PCF8564A
Real time clock and calendar
18. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that
all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent
standards.
PCF8564A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 3 — 26 August 2013 39 of 48
NXP Semiconductors
PCF8564A
Real time clock and calendar
19. Packing information
19.1 Wafer and Film Frame Carrier (FFC) information
Wafer thickness, see Table 37.
Fig 30. Wafer layout of PCF8564A
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PCF8564AU/5BB/1,01

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC RTC CLK/CALENDAR I2C DIE
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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