PCF8564A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 3 — 26 August 2013 42 of 48
NXP Semiconductors
PCF8564A
Real time clock and calendar
20. Abbreviations
21. References
[1] AN10439 — Wafer Level Chip Size Package
[2] AN10706 — Handling bare die
[3] IEC 60134 — Rating systems for electronic tubes and valves and analogous
semiconductor devices
[4] IEC 61340-5 — Protection of electronic devices from electrostatic phenomena
[5] JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body
Model (HBM)
[6] JESD22-A115 — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model
(MM)
[7] JESD78 — IC Latch-Up Test
[8] JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive
(ESDS) Devices
[9] UM10204 — I
2
C-bus specification and user manual
[10] UM10301 — User Manual for NXP Real Time Clocks PCF85x3, PCA8565 and
PCF2123, PCA2125
[11] UM10569 — Store and transport requirements
Table 38. Abbreviations
Acronym Description
BCD Binary Coded Decimal
CMOS Complementary Metal Oxide Semiconductor
FFC Film Frame Carrier
HBM Human Body Model
I
2
C Inter-Integrated Circuit
IC Integrated Circuit
LSB Least Significant Bit
MM Machine Model
MOS Metal Oxide Semiconductor
MSB Most Significant Bit
MSL Moisture Sensitivity Level
PCB Printed-Circuit Board
POR Power-On Reset
ROM Read Only Memory
RTC Real Time Clock
SCL Serial CLock line
SDA Serial DAta line
