©2011 Silicon Storage Technology, Inc. DS25028A 08/11
13
16 Mbit / 32 Mbit Multi-Purpose Flash Plus
SST39VF1601 / SST39VF3201
SST39VF1602 / SST39VF3202
Not Recommended for New Designs
A
Microchip Technology Company
Table 8: System Interface Information for SST39VF160x/320x
Address Data Data
1BH 0027H V
DD
Min (Program/Erase)
DQ
7
-DQ
4
: Volts, DQ
3
-DQ
0
: 100 millivolts
1CH 0036H V
DD
Max (Program/Erase)
DQ
7
-DQ
4
: Volts, DQ
3
-DQ
0
: 100 millivolts
1DH 0000H V
PP
min. (00H = no V
PP
pin)
1EH 0000H V
PP
max. (00H = no V
PP
pin)
1FH 0003H Typical time out for Word-Program 2
N
µs (2
3
= 8 µs)
20H 0000H Typical time out for min. size buffer program 2
N
µs (00H = not supported)
21H 0004H Typical time out for individual Sector/Block-Erase 2
N
ms (2
4
=16ms)
22H 0005H Typical time out for Chip-Erase 2
N
ms (2
5
=32ms)
23H 0001H Maximum time out for Word-Program 2
N
times typical (2
1
x2
3
=1s)
24H 0000H Maximum time out for buffer program 2
N
times typical
25H 0001H Maximum time out for individual Sector/Block-Erase 2
N
times typical (2
1
x2
4
=32
ms)
26H 0001H Maximum time out for Chip-Erase 2
N
times typical (2
1
x2
5
=64ms)
T8.3 25028
Table 9: Device Geometry Information for SST39VF1601/1602
Address Data Data
27H 0015H Device size = 2
N
Bytes (15H = 21; 2
21
= 2 MByte)
28H 0001H Flash Device Interface description; 0001H = x16-only asynchronous interface
29H 0000H
2AH 0000H Maximum number of byte in multi-byte write = 2
N
(00H = not supported)
2BH 0000H
2CH 0002H Number of Erase Sector/Block sizes supported by device
2DH 00FFH Sector Information (y+1=Number of sectors; z x 256B = sector size)
2EH 0001H y = 511+1=512sectors (01FF = 511
2FH 0010H
30H 0000H z = 16 x 256 Bytes = 4 KByte/sector (0010H = 16)
31H 001FH Block Information (y+1=Number of blocks; z x 256B = block size)
32H 0000H y = 31+1=32blocks(001F = 31)
33H 0000H
34H 0001H z = 256 x 256 Bytes = 64 KByte/block (0100H = 256)
T9.0 25028
©2011 Silicon Storage Technology, Inc. DS25028A 08/11
14
16 Mbit / 32 Mbit Multi-Purpose Flash Plus
SST39VF1601 / SST39VF3201
SST39VF1602 / SST39VF3202
Not Recommended for New Designs
A
Microchip Technology Company
Table 10:Device Geometry Information for SST39VF3201/3202
Address Data Data
27H 0016H Device size = 2
N
Bytes (16H = 22; 2
22
= 4 MByte)
28H 0001H Flash Device Interface description; 0001H = x16-only asynchronous interface
29H 0000H
2AH 0000H Maximum number of byte in multi-byte write = 2
N
(00H = not supported)
2BH 0000H
2CH 0002H Number of Erase Sector/Block sizes supported by device
2DH 00FFH Sector Information (y+1=Number of sectors; z x 256B = sector size)
2EH 0003H y = 1023+1=1024 (03FFH = 1023)
2FH 0010H
30H 0000H z = 16 x 256 Bytes = 4 KBytes/sector (0010H = 16)
31H 003FH Block Information (y+1=Number of blocks; z x 256B = block size)
32H 0000H y = 63+1=64blocks(003FH = 63)
33H 0000H
34H 0001H z = 256 x 256 Bytes = 64 KBytes/block (0100H = 256)
T10.2 25028
©2011 Silicon Storage Technology, Inc. DS25028A 08/11
15
16 Mbit / 32 Mbit Multi-Purpose Flash Plus
SST39VF1601 / SST39VF3201
SST39VF1602 / SST39VF3202
Not Recommended for New Designs
A
Microchip Technology Company
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute
Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these conditions or conditions greater than those defined in the
operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating con-
ditions may affect device reliability.)
Temperature Under Bias ............................................. -55°C to +125°C
Storage Temperature ................................................ -65°C to +150°C
D. C. Voltage on Any Pin to Ground Potential ............................-0.5V to V
DD
+0.5V
Transient Voltage (<20 ns) on Any Pin to Ground Potential ..................-2.0V to V
DD
+2.0V
Voltage on A
9
Pin to Ground Potential .....................................-0.5V to 13.2V
Package Power Dissipation Capability (T
A
= 25°C) .................................. 1.0W
Surface Mount Solder Reflow Temperature
1
...........................260°C for 10 seconds
1. Excluding certain with-Pb 32-PLCC units, all packages are 260°C capable in both non-Pb and with-Pb solder versions.
Certain with-Pb 32-PLCC package types are capable of 240°C for 10 seconds; please consult the factory for the latest
information.
Output Short Circuit Current
2
.................................................. 50mA
2. Outputs shorted for no more than one second. No more than one output shorted at a time.
Table 11:Operating Range
Range Ambient Temp V
DD
Commercial 0°C to +70°C 2.7-3.6V
Industrial -40°C to +85°C 2.7-3.6V
T11.1 25028
Table 12:AC Conditions of Test
1
1. See Figures 18 and 19
Input Rise/Fall Time Output Load
5ns C
L
=30pF
T12.1 25028

SST39VF3201-70-4C-B3KE-T

Mfr. #:
Manufacturer:
Microchip Technology
Description:
NOR Flash 32M (2Mx16) 70ns 2.7-3.6V Commercial
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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