MAX5927A/MAX5929A–MAX5929D
Layout Considerations
To take full tracking advantage of the switch response
time to an output fault condition, it is important to keep
all traces as short as possible and to maximize the
high-current trace dimensions to reduce the effect of
undesirable parasitic inductance. Place the
MAX5927A/MAX5929A–MAX5929D close to the card’s
connector. Use a ground plane to minimize impedance
and inductance. Minimize the current-sense resistor
trace length (<10mm), and ensure accurate current
sensing with Kelvin connections (Figure 13).
When the output is short circuited, the voltage drop
across the external MOSFET becomes large. Hence, the
power dissipation across the switch increases, as does
the die temperature. An efficient way to achieve good
power dissipation on a surface-mount package is to lay
out two copper pads directly under the MOSFET pack-
age on both sides of the board. Connect the two pads
to the ground plane through vias, and use enlarged
copper mounting pads on the topside of the board.
Low-Voltage, Quad, Hot-Swap
Controllers/Power Sequencers
22
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