LTC4315
10
4315f
If V
CC2
i s t i e d l o w, o u t p u t R TA s a r e d i s a b l e d i n d e p e n d e n t o f
the state of the ACC pin. Using a combination of the ACC pin
and the V
CC2
voltage, the input and output side RTAs can
be controlled independently. The RTAs are also internally
disabled during power up, V
CC2
transitions described in
the Operation section and during a bus stuck low event.
The RTAs when activated pull the bus up to
0.9 • V
CC
and 0.9 • V
CC2
on the input and output sides of
the SDA and SCL pins. Independent supply voltages V
CC
and V
CC2
maximize acceleration range on both inputs and
outputs by allowing the RTA turn-off voltage to be set inde-
pendently on the two sides. In order to prevent bus overdrive
by the RTA, the bus supplies on the input and output sides
of the LTC4315 must be greater than or equal to 0.9 • V
CC
and 0.9 • V
CC2
respectively. An example is shown in Figure 3
where the input bus voltage is greater than V
CC
. During a
rising edge, the input bus rise rate will be accelerated by
the RTA up to a voltage of 2.97V after which the bus rise
rate will reduce to a value that is determined by the bus
current and bus capacitance. The RTA turn-off voltage is
less than the bus supply and the bus is not over driven.
This can also be accomplished by tying V
CC
to the input
bus supply and V
CC2
to the output bus supply as shown
in Figure 4. In this case the input and output busses are
accelerated to 2.97V and 2.25V respectively
APPLICATIONS INFORMATION
PULL-UP RESISTOR VALUE SELECTION
To guarantee that the RTAs are activated during a rising
edge, the bus must rise on its own with a positive slew
rate of at least 0.4V/µs. To achieve this, choose a maximum
R
BUS
using the formula:
R
BUS
V
DD,BUS(MIN)
V
RTA(TH)
(
)
0.4
V
µs
•C
BUS
(1)
R
BUS
is the bus pull-up resistor, V
DD,BUS(MIN)
is the
minimum bus pull-up supply voltage, V
RTA(TH)
is the
maximum voltage at which the RTA turns on and C
BUS
is
the equivalent bus capacitance. R
BUS
must also be large
enough to guarantee that:
R
BUS
V
DD,BUS(MAX)
0.4V
(
)
4mA
(2)
This criterion ensures that the maximum bus current is
less than 4mA.
Figure 3. Level Shift Application Where the SDAIN, SCLIN Bus
Pull-Up Supply Voltages are Higher Than the Supply Voltages of
the LTC4315
Figure 4. Level Shift Application Where the LTC4315 V
CC
and
V
CC2
Pins are Connected to the Bus Pull-Up Supply Voltages
LTC4315
GND
V
CC
V
CC2
4315 F03
READY
SCLOUT
SDAOUT
FAULT
DISCEN
ENABLE
SCL1
SDA1
R2
10k
R5
10k
R6
10k
R4
10k
R3
10k
R1
10k
C1
0.01µF
3.3V
READY
SCL2
SDA2
FAULT
5V
SCLIN
SDAIN
ACC
LTC4315
GND
V
CC
V
CC2
4315 F04
READY
SCLOUT
SDAOUT
FAULT
DISCEN
ENABLE
SCLIN
SDAIN
ACC
SCL1
SDA1
R2
10k
R5
10k
R6
10k
R4
10k
R3
10k
R1
10k
C1
0.01µF
3.3V
READY
SCL2
SDA2
FAULT
2.5V
C2
0.01µF
LTC4315
11
4315f
APPLICATIONS INFORMATION
INPUT TO OUTPUT OFFSET VOLTAGE
While propagating a logic low voltage on its SDA and SCL
pins, the LTC4315 introduces a positive offset voltage
between the input and output. When a logic low voltage
≥200mV is driven on any of the LTC4315’s data or clock
pins, the LTC4315 regulates the voltage on the oppo-
site side to a slightly higher value. This is illustrated in
Equation 3, which uses SDA as an example:
V
SDAOUT
= V
SDAIN
+ 50mV + 15
V
DD,BUS
R
BUS
(3)
In Equation 3, V
DD,BUS
is the output bus supply voltage
and R
BUS
is the SDAOUT bus pull-up resistance.
For driven logic low voltages < 200mV Equation 3 does
not apply as the saturation voltage of the open collector
output transistor results in a higher offset. However, for
any input logic low below 220mV, the output is guaranteed
to be below a V
OL
of 400mV for bus pull-up currents up
to 4mA. See the Typical Performance section for offset
variation as a function of the driven logic low voltage and
bus pull-up current.
FALLING EDGE CHARACTERISTICS
The LTC4315 introduces a propagation delay on falling
edges due to the finite response time and finite current
sink capability of its buffers. In addition the LTC4315 also
slew limits the falling edge to an edge rate of 45V/µs.
The slew limited falling edge eliminates fast transitions
on the busses and minimizes transmission line effects
in systems. Refer to the Typical Performance section for
the propagation delay and fall times as a function of the
bus capacitance.
STUCK BUS DISCONNECT AND RECOVERY
During an output bus stuck low condition (SCLOUT or
SDAOUT stuck low for at least 45ms) if DISCEN is tied
high, the LTC4315 attempts to unstick the bus by first
breaking the connection between the input and output. The
LTC4315 then asserts FAUL T low and after 40µs, gener-
ates up to sixteen 5.5KHz clock pulses on the SCLOUT
pin. Should the stuck bus release high during this period,
clock generation is stopped, a stop bit is generated and the
FAUL T flag is cleared. This process is shown in Figure 5
for the case where SDAOUT starts out stuck low and then
recovers. As seen from the figure, the LTC4315 pulls FAUL T
and READY low and breaks the connection between the
input and output sides, when a stuck low condition on
SDA is detected. Clock pulses are then issued on SCLOUT
to attempt to unstick the SDAOUT bus. When SDAOUT
recovers, clock pulsing is stopped, a stop bit is generated
on the output and FAUL T and READY are released high. If
DISCEN is low and a stuck bus event occurs, the FAUL T
flag is driven low but the input and output sides stay con-
n e c t e d a n d n o c l o c k i n g o r s t o p b i t g e n e r a t i o n o c c u r s . W h e n
powering up into a stuck low condition, a connection is
never made between the input and the output, as a stop
bit or bus idle condition is never detected. After a timeout
period of 45ms, the FAUL T flag is asserted low and the
behavior is the same as described previously.
Figure 5. Bus Waveforms During SDAOUT Stuck Low
and Recovery Event
4315 F05
FAULT
5V/DIV
SCLOUT
5V/DIV
READY
5V/DIV
SDAIN
5V/DIV
SDAOUT
5V/DIV
1ms/DIV
AUTOMATIC CLOCKING
DISCONNECT
AT TIMEOUT
STUCK LOW > 45ms
RECOVERS
HIGH
DRIVEN
LOW
STOP BIT
GENERATED
LTC4315
12
4315f
APPLICATIONS INFORMATION
LIVE INSERTION, CAPACITANCE BUFFERING AND
LEVEL TRANSLATION APPLICATION
Figures 6 illustrates an application of the LTC4315 that
takes advantage of the LTC4315’s Hot Swap, capacitance
buffering and level translation features. If the I/O cards
were plugged directly into the backplane without LTC4315
buffers, all of the backplane and card capacitances would
directly add together, making rise time requirements dif-
ficult to meet. Placing an LTC4315 on the edge of each
card isolates the card capacitance from the backplane.
For a given I/O card, the LTC4315 drives the capacitance
of everything on the card and devices on the backplane
must drive only the small capacitance of the LTC4315
which is <10pF.
Figure 6. LTC4315 in an I
2
C Hot Swap Application with a Staggered Connector
R7
10k
R5
10k
R6
10k
LTC4315
GND
V
CC
V
CC2
ACC
SCLOUT
SDAOUT
DISCEN
READY
FAULT
SCLIN
SDAIN
ENABLE
C2
0.01µF
CARD 1_SCL
CARD 1_SDA
CARD N_SCL
CARD N_SDA
C1
0.01µF
R10
10k
4315 F06
R8
10k
I/O PERIPHERAL CARD N
I/O PERIPHERAL CARD 1
CARD
CONNECTOR
BACKPLANE
CONNECTOR
R9
10k
LTC4315
GND
V
CC
V
CC2
ACC
SCLOUT
SDAOUT
DISCEN
READY
FAULT
SCLIN
SDAIN
ENABLE
C4
0.01µF
C3
0.01µF
sss
R3
10k
R4
10k
R1
10k
R2
10k
READY
FAULT
SCL
SDA
ENABLE 1
5V
3.3V
ENABLE N
sss

LTC4315IMS#TRPBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Interface - Signal Buffers, Repeaters 2-Wire Bus Buffer with High Noise Margin w/ FAULT and SBDR Disable
Lifecycle:
New from this manufacturer.
Delivery:
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