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LTC1609
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Dynamic Performance
FFT (Fast Fourier Transform) test techniques are used to
test the ADC’s frequency response, distortion and noise
at the rated throughput. By applying a low distortion sine
wave and analyzing the digital output using an FFT
algorithm, the ADC’s spectral content can be examined
for frequencies outside the fundamental. Figure 6 shows
a typical LTC1609 FFT plot which yields a SINAD of
87.2dB and THD of –100dB.
Signal-to-Noise Ratio
The Signal-to-Noise and Distortion Ratio (SINAD) is the
ratio between the RMS amplitude of the fundamental input
frequency to the RMS amplitude of all other frequency
components at the A/D output. The output is band limited
to frequencies from above DC and below half the sampling
frequency. Figure 6 shows a typical SINAD of 87.2dB with
a 200kHz sampling rate and a 1kHz input.
where V
1
is the RMS amplitude of the fundamental fre-
quency and V
2
through V
N
are the amplitudes of the
second through Nth harmonics.
Internal Voltage Reference
The LTC1609 has an on-chip, temperature compensated,
curvature corrected, bandgap reference, which is factory
trimmed to 2.50V. The full-scale range of the ADC scales
with V
REF
. The output of the reference is connected to the
input of a unity-gain buffer through a 4k resistor (see
Figure 7). The input to the buffer or the output of the
reference is available at REF. The internal reference can be
overdriven with an external reference if more accuracy is
needed. The buffer output drives the internal DAC and is
available at CAP. The CAP pin can be used to drive a steady
DC load of less than 2mA. Driving an AC load is not
recommended because it can cause the performance of
the converter to degrade.
For minimum code transition noise the REF pin and the
CAP pin should each be decoupled with a capacitor to
filter wideband noise from the reference and the buffer
(2.2µF tantalum).
Figure 6. LTC1609 Nonaveraged 4096 Point FFT Plot
S
S
+
1609 F07
INTERNAL
CAPACITOR
DAC
BANDGAP
REFERENCE
V
ANA
4k
2.2µF
CAP
(2.5V)
2.2µF
REF
(2.5V)
6
7
Figure 7. Internal or External Reference Source
FREQUENCY (kHz)
0
–60
–40
0
75
1609 F06
–80
–100
25 50 100
–120
–130
–20
MAGNITUDE (dB)
f
SAMPLE
= 200kHz
f
IN
= 1kHz
SINAD = 87.2dB
THD = –100.1dB
Total Harmonic Distortion
Total Harmonic Distortion (THD) is the ratio of the RMS
sum of all harmonics of the input signal to the fundamental
itself. The out-of-band harmonics alias into the frequency
band between DC and half the sampling frequency. THD is
expressed as:
THD
VVV V
V
N
=
++ +
20
2
2
3
2
4
22
1
log
...
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LTC1609
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Power Shutdown
When the PWRD pin is tied high, power consumption
drops to a typical value of 50µW from a specified maxi-
mum of 100mW. In the power shutdown mode, the result
from the previous conversion is still available in the
internal shift register, assuming the data had not been
clocked out before going into power shutdown.
The internal reference buffer and the reference are shut
down, so the power-up recovery time will be dependent
upon how fast the bypass capacitors on these pins can be
charged. If the internal reference is used, the 4k resistor in
series with the output and the external bypass capacitor,
typically 2.2µF, will be the main time constant for the
power-up recovery time. If an external reference is used,
the reference buffer output will be able to ramp from 0V to
2.5V in 1ms, while charging a typical bypass capacitor of
2.2µF. The recovery time will be less if the bypass capaci-
tor has not completely discharged.
DIGITAL INTERFACE
Internal Conversion Clock
The ADC has an internal clock that is trimmed to achieve
a typical conversion time of 2.7µs. No external adjust-
ments are required and, with the typical acquisition time of
1.5µs, throughput performance of 200ksps is assured.
Timing and Control
Conversion start and data read are controlled by two
digital inputs: CS and R/C. To start a conversion and put
the sample-and-hold into the hold mode bring CS and
R/C low for no less than 40ns. Once initiated it cannot be
restarted until the conversion is complete. Converter
status is indicated by the BUSY output and this is low while
the conversion is in progress.
The conversion result is clocked out serially on the DATA
pin. It can be synchronized by using the internal data clock
or by using an external clock provided by the user. Tying
the EXT/INT pin high puts the LTC1609 in the external
clock mode and the DATACLK pin is a digital input. Tying
the EXT/INT pin low puts the part in the internal clock mode
and the DATACLK pin becomes a digital output.
Internal Clock Mode
With the EXT/INT pin tied low, the LTC1609 provides the
data clock on the DATACLK pin. The timing diagram is
shown in Figure 8. Typically, CS is tied low and the R/C
pin is used to start a conversion. During the conversion
a 16-bit word will be shifted out MSB-first on the DATA
pin. This word represents the result from the previous
conversion. The DATACLK pin outputs 16 clock pulses
used to synchronize the data. The output data is valid on
both the rising and falling edges of the clock. After the
LSB bit has been clocked out, the DATA pin will take on
the state of the TAG pin at the start of the conversion. The
DATACLK pin goes low until the next conversion is
requested. The data clock is derived from the internal
conversion clock. To avoid errors from occurring during
the current conver
sion, minimize the loading on the
DATACLK pin and the DATA pin. For the best conversion
results the external clock mode is recommended.
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Figure 8. Serial Data Timing Using Internal Clock (CS, EXT/INT and TAG Tied Low)
t
2
t
10
t
1
t
11
t
3
B14 B13 B2 B1 B0
1609 F08
B15
(MSB)
BUSY
DATA
DATACLK
R/C
2 3 14 15 161
t
8
t
9
15
LTC1609
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External Clock Mode
With the EXT/INT pin tied high, the DATACLK pin becomes
a digital input and the LTC1609 can accept an externally
supplied data clock. There are several ways in which the
conversion results can be clocked out. The data can be
clocked out during or after a conversion with a continuous
or discontinuous data clock. Figures 9 to 12 show the
timing diagram for each of these methods.
External Discontinuous Data Clock Data Read
After the Conversion
Figure 9 shows how the result from the current conver-
sion can be read out after the conversion has been
completed. The externally supplied data clock is running
discontinuously. R/C is used to initiate a conversion with
CS tied low. The conversion starts on the falling edge of
R/C. R/C should be returned high within 1.2µs to prevent
the transition from disturbing the conversion. After the
conversion has been completed (BUSY returning high), a
pulse on the SYNC pin will be generated on the rising edge
of DATACLK #0. The SYNC output can be captured on the
falling edge of DATACLK #0 or on the rising edge of
DATACLK #1. After the rising edge of DATACLK #1, the
SYNC output will go low and the MSB will be clocked out
on the DATA pin. This bit can be latched on the falling edge
of DATACLK #1 or on the rising edge of DATACLK #2. The
LSB will be valid on the falling edge of DATACLK #16 or the
rising edge of DATACLK #17. After the rising edge of
DATACLK #17 the DATA pin will take on the value of the
TAG pin that occurred at the rising edge of DATACLK #1.
A minimum of 17 clock pulses are required if the data is
captured on falling clock edges.
Using the highest frequency permitted for DATACLK
(20MHz), shifting the data out after the conversion will
not degrade the 200kHz throughput. This method mini-
mizes the possible external disturbances that can occur
while a conversion is in progress and will yield the best
performance.
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Figure 9. Conversion and Read Timing Using an External Discontinuous Data Clock
(EXT/INT Tied High, CS Tied Low). Read Conversion Result After the Conversion
0123 151617
TAG0TAG
DATA
SYNC
BUSY
R/C
EXTERNAL
DATACLK
TAG1 TAG2 TAG3 TAG15
B1B14 B13
B15
(MSB)
B0 TAG0 TAG1 TAG2
TAG16 TAG17 TAG18 TAG19
1606 F09
t
23
t
24
t
18
t
17
t
3
t
2
t
21
t
1
t
13
t
14
t
12
t
12

LTC1609ISW#PBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Analog to Digital Converters - ADC 16-B, 200ksps, Serial Smpl ADC
Lifecycle:
New from this manufacturer.
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