CY62167DV30 MoBL
®
Document Number: 38-05328 Rev. *M Page 16 of 18
Acronyms Document Conventions
Units of Measure
Acronym Description
CMOS Complementary Metal Oxide Semiconductor
I/O Input/Output
SRAM Static Random Access Memory
TSOP Thin Small Outline Package
VFBGA Very Fine-Pitch Ball Grid Array
Symbol Unit of Measure
°C degrees Celsius
MHz megahertz
A microampere
mA milliampere
ns nanosecond
ohm
pF picofarad
V volt
W watt
CY62167DV30 MoBL
®
Document Number: 38-05328 Rev. *M Page 17 of 18
Document History Page
Document Title: CY62167DV30 MoBL
®
, 16-Mbit (1 M × 16) Static RAM
Document Number: 38-05328
Revision ECN
Orig. of
Change
Submission
Date
Description of Change
** 118408 GUG 09/30/02 New data sheet.
*A 123692 DPM 02/11/03 Changed status from Advanced to Preliminary.
Added package diagram
*B 126555 DPM 04/25/03 Minor change: Changed Sunset Owner from DPM to HRT
*C 127841 XRJ 09/10/03 Added 48 TSOP I package
*D 205701 AJU See ECN Changed BYTE
pin usage description for 48 TSOPI package
*E 238050 KKV/AJU See ECN Replaced 48-ball VFBGA package diagram; Modified Package Name in
Ordering Information table from BV48A to BV48B
*F 304054 PCI See ECN Added 45-ns Speed Bin in AC, DC and Ordering Information tables
Added Footnote #12 on page #4
Added Pb-free packages on page # 10
*G 492895 VKN See ECN Modified datasheet to explain x8 configurability.
Removed L power bin from the product offering
Updated Ordering Information Table
*H 2896036 AJU 03/19/10 Removed 45-ns. Removed inactive parts from Ordering Information.
Updated Packaging Information
Updated links in Sales, Solutions, and Legal Information.
*I 3067267 RAME 11/08/10 Updated datasheet as per new template
Added Ordering Code Definitions.
Added Acronyms and Units of Measure.
Updated all table notes to footnote.
Package diagram updated 51-85178 from ** to *A
*J 3329789 RAME 07/27/11 Removed references to AN1064 SRAM system guidelines.
Updated template according to current CY standards.
*K 4108382 AJU 08/29/2013 Updated Pin Configurations:
Removed the note “Ball H6 for the FBGA package can be used to upgrade to
a 32M density” and its reference in Figure 1.
Updated Package Diagrams:
spec 51-85178 – Changed revision from *A to *C.
Updated in new template.
*L 4192919 VINI 11/15/2013 No technical updates.
Completing Sunset Review.
*M 4574377 VINI 11/19/2014 Added related documentation hyperlink in page 1.
Document Number: 38-05328 Rev. *M Revised November 19, 2014 Page 18 of 18
MoBL is a registered trademark and More Battery Life is a trademark of Cypress Semiconductor Corporation. All product and company names mentioned in this document may be the trademarks of
their respective holders.
CY62167DV30 MoBL
®
© Cypress Semiconductor Corporation, 2002-2014. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
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CY62167DV30LL-55ZXI

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
SRAM 16Mb 3V 55ns 1M x 16 LP SRAM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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