CY28346
Document #: 38-07331 Rev. *C Page 19 of 20
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
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Package Drawing and Dimensions
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56-lead Shrunk Small Outline Package O56
51-85062-*C
SEATING
PLANE
1
BSC
0°-8°
MAX.
GAUGE PLANE
28
29 56
1.100[0.043]
0.051[0.002]
0.851[0.033]
0.508[0.020]
0.249[0.009]
7.950[0.313]
0.25[0.010]
6.198[0.244]
13.894[0.547]
8.255[0.325]
5.994[0.236]
0.950[0.037]
0.500[0.020]
14.097[0.555]
0.152[0.006]
0.762[0.030]
DIMENSIONS IN MM[INCHES] MIN.
MAX.
0.170[0.006]
0.279[0.011]
0.20[0.008]
0.100[0.003]
0.200[0.008]
REFERENCE JEDEC MO-153
PACKAGE WEIGHT 0.42gms
PART #
Z5624 STANDARD PKG.
ZZ5624 LEAD FREE PKG.
56-Lead Thin Shrunk Small Outline Package, Type II (6 mm x 12 mm) Z56
51-85060-*C
