2003 Apr 14 37
Philips Semiconductors Product specification
LCD row/column driver for
dot matrix graphic displays
PCF8578
Table 15 Bonding pad locations (dimensions in µm); all x/y coordinates are referenced to centre of chip, see Fig.28
PAD NUMBER SYMBOL x y
PINS
VSO56 LQFP64
1 SDA 174 2241 1 7
2 SCL −30 2241 2 8
3
SYNC −234 2241 3 9
4 CLK −468 2241 4 10
5V
SS
−726 2241 5 11
6 TEST −1014 2241 6 12
7 SA0 −1308 2241 7 13
8 OSC −1308 1917 8 16
9V
DD
−1308 1113 9 20
10 V
2
−1308 873 10 21
11 V
3
−1308 663 11 22
12 V
4
−1308 459 12 23
13 V
5
−1308 255 13 24
14 V
LCD
−1308 51 14 25
15 C39 −1308 −1149 17 29
16 C38 −1308 −1353 18 30
17 C37 −1308 −1557 19 31
18 C36 −1308 −1773 20 32
19 C35 −1308 −1995 21 33
20 C34 −1308 −2241 22 34
21 C33 −1014 −2241 23 35
22 C32 −726 −2241 24 37
23 R31/C31 −468 −2241 25 38
24 R30/C30 −234 −2241 26 39
25 R29/C29 −30 −2241 27 40
26 R28/C28 174 −2241 28 41
27 R27/C27 468 −2241 29 42
28 R26/C26 672 −2241 30 43
29 R25/C25 876 −2241 31 44
30 R24/C24 1080 −2241 32 45
31 R23/C23 1308 −2241 33 46
32 R22/C22 1308 −1977 34 48
33 R21/C21 1308 −1731 35 49
34 R20/C20 1308 −1515 36 50
35 R19/C19 1308 −1305 37 51
36 R18/C18 1308 −1101 38 52
37 R17/C17 1308 −897 39 53
38 R16/C16 1308 −693 40 54
