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Junction
R
1
C
1
C
2
R
2
C
3
R
3
C
n
R
n
Time constants are not simple RC products. Amplitudes
of mathematical solution are not the resistance values.
Ambient
(thermal ground)
Figure 26. Grounded Capacitor Thermal Network (“Cauer” Ladder)
Junction
R
1
C
1
C
2
R
2
C
3
R
3
C
n
R
n
Each rung is exactly characterized by its RCproduct
time constant; amplitudes are the resistances.
Ambient
(thermal ground)
Figure 27. NonGrounded Capacitor Thermal Ladder (“Foster” Ladder)
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Recommend Thermal Data for D
2
PAK7 Package
Parameter Test Conditions Typical Value Units
minpad board (Note 8) 1”pad board (Note 9)
JunctiontoLead (psiJL, Y
JL
)
6.0 6.0 °C/W
JunctiontoAmbient (R
q
JA
, q
JA
)
78 44 °C/W
8. 1 oz. copper, 118 mm
2
copper area, 0.062” thick FR4.
9. 1 oz. copper, 626 mm
2
copper area, 0.062” thick FR4.
Package construction
Without mold compound
Various copper areas used
for heat spreading
Active Area (red) times 2
(only showing 1/2 symmetry)
Figure 28. PCB Layout and Package Construction for Simulation
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Table 2. D
2
PAK 7Lead Thermal RC Network Models
118 mm
2
626 mm
2
118 mm
2
626 mm
2
Cu Area
Cauer Network Foster Network
C’s C’s Units Tau Tau units
1 1.45E06 1.45E06 Ws/C 1.00E07 1.00E07 sec
2 5.55E06 5.58E06 Ws/C 1.00E06 1.00E06 sec
3 1.57E05 1.59E05 Ws/C 1.00E05 1.00E05 sec
4 5.11E05 5.22E05 Ws/C 0.000 0.000 sec
5 3.48E04 5.94E04 Ws/C 0.001 0.002 sec
6 1.07E02 6.62E02 Ws/C 0.006 0.029 sec
7 2.65E02 1.55E01 Ws/C 0.020 0.080 sec
8 0.524 0.413 Ws/C 1.43 2.63 sec
9 0.490 2.441 Ws/C 6.52 3.6 sec
10 0.843 0.410 Ws/C 104.512 95.974 sec
R’s R’s R’s R’s
1 0.089 0.089 C/W 5.25E02 5.25E02 C/W
2 0.210 0.208 C/W 1.14E01 1.14E01 C/W
3 0.637 0.624 C/W 3.59E01 3.59E01 C/W
4 1.899 2.107 C/W 1.5 1.9 C/W
5 1.883 2.454 C/W 2.6 3.0 C/W
6 1.398 0.952 C/W 0.1 0.1 C/W
7 0.315 0.360 C/W 1.7 0.9 C/W
8 14.348 7.042 C/W 0.1 0.1 C/W
9 5.621 20.823 C/W 7.2 4.6 C/W
10 51.986 9.649 C/W 64.8 33.3 C/W
NOTE: Bold face items in the Cauer network above, represent the package without the external thermal system. The Bold face items in
the Foster network are computed by the square root of time constant R(t) = 166 * sqrt(time(sec)). The constant is derived based
on the active area of the device with silicon and epoxy at the interface of the heat generation.
The Cauer networks generally have physical significance and may be divided between nodes to separate thermal behavior
due to one portion of the network from another. The Foster networks, though when sorted by time constant (as above) bear
a rough correlation with the Cauer networks, are really only convenient mathematical models. Cauer networks can be easily
implemented using circuit simulating tools, whereas Foster networks may be more easily implemented using mathematical
tools (for instance, in a spreadsheet program), according to the following formula:
R(t) +
n
S
i + 1
R
i
ǒ
1e
tń tau
i
Ǔ

NCV8508D2T50G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC REG LINEAR 5V 250MA D2PAK-7
Lifecycle:
New from this manufacturer.
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