NCV8508
http://onsemi.com
16
qJA vs Copper Spreader Area
0
20
40
60
80
100
120
0 100 200 300 400 500 600 700 800
qJA (°C/W)
COPPER AREA (mm
2
)
Figure 29. D
2
PAK 7lead qJA as a Function of the
Pad Copper Area Including Traces, Board Material
1 oz
2 oz
0.01
0.1
1
10
100
0.000001 0.00001 0.0001 0.001
0.01
0.1
1 10 100 1000
Time (sec)
Cu Area 118 mm
2
Cu Area 626 mm
2
R(t) (°C/W)
Figure 30. D
2
PAK 7Lead Single Pulse Heating Curve
0.01
0.1
10
100
0.000001 0.00001 0.0001 0.001 0.01
0.1
1 10 100 1000
Pulse Duration (sec)
1
R(t) (°C/W)
Single
50% Duty Cycle
20%
10%
5%
1%
Cu Area 626 mm
2
, 1 oz Cu
Figure 31. D
2
PAK 7Lead Thermal Duty Cycle Curves on 1” Spreader Test Board
NCV8508
http://onsemi.com
17
Junction
R
1
C
1
C
2
R
2
C
3
R
3
C
n
R
n
Time constants are not simple RC products. Amplitudes
of mathematical solution are not the resistance values.
Ambient
(thermal ground)
Figure 32. Grounded Capacitor Thermal Network (“Cauer” Ladder)
Junction
R
1
C
1
C
2
R
2
C
3
R
3
C
n
R
n
Each rung is exactly characterized by its RCproduct
time constant; amplitudes are the resistances.
Ambient
(thermal ground)
Figure 33. NonGrounded Capacitor Thermal Ladder (“Foster” Ladder)
NCV8508
http://onsemi.com
18
Recommend Thermal Data for SOIC8 EP Package
Parameter Test Conditions Typical Value Units
Pad is soldered to PCB copper minpad board (Note 10) 1”pad board (Note 11)
JunctiontoLead (psiJL, Y
JL
)
64 54 °C/W
JunctiontoLead (psiJPad, Y
Jp
)
14 11 °C/W
JunctiontoAmbient (R
q
JA
, q
JA
)
122 84 °C/W
10.1 oz. copper, 54 mm
2
copper area, 0.062” thick FR4.
11. 1 oz. copper, 717 mm
2
copper area, 0.062” thick FR4.
8SOIC EP Half Symmetry
Copper Pad Layout
25 x 25mm
Bottom view
With mold compound
Top view
Without and without mold compound
Figure 34. Internal Construction of the Package and PCB Layout for Multiple Pad Area

NCV8508D2T50G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC REG LINEAR 5V 250MA D2PAK-7
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union