25
4009fd
LTC4009
LTC4009-1/LTC4009-2
Figure 13. Kelvin Sensing of Charge Current
TO CSP
R
IN
4009 F13
DIRECTION OF CHARGING CURRENT
R
SENSE
TO CSN
R
IN
10. If possible, place all the parts listed above on the same
PCB layer.
11. C
opper fills or pours are good for all power connections
except as noted above in Rule 3. Copper planes on
multiple layers can also be used in parallel. This helps
with thermal management and lowers trace inductance,
which further improves EMI performance.
12.
For best current programming accuracy, provide a
Kelvin connection from R
SENSE
to CSP and CSN. See
Figure 13 for an example.
13. It
is important to minimize parasitic capacitance on
the CSP and CSN pins. The traces connecting these
pins to their respective resistors should be as short
as possible.
applicaTions inForMaTion
