22
FN8232.8
August 12, 2010
Application Section
Crystal Oscillator and Temperature Compensation
Intersil has now integrated the oscillator compensation
circuity on-chip, to eliminate the need for external
components and adjust for crystal drift over-temperature and
enable very high accuracy time keeping (<5ppm drift).
The Intersil RTC family uses an oscillator circuit with on-chip
crystal compensation network, including adjustable
load-capacitance. The only external component required is
the crystal. The compensation network is optimized for
operation with certain crystal parameters which are common
in many of the surface mount or tuning-fork crystals available
today. Table 8 summarizes these parameters.
Table 9 contains some crystal manufacturers and part numbers
that meet the requirements for the Intersil RTC products.
The turnover temperature in Table 8 describes the
temperature where the apex of the of the drift vs temperature
curve occurs. This curve is parabolic with the drift increasing
as (T - T0)
2
. For an Epson MC-405 device, for example, the
turnover temperature is typically +25°C, and a peak drift of
>110ppm occurs at the temperature extremes of -40°C and
+85°C. It is possible to address this variable drift by adjusting
the load capacitance of the crystal, which will result in
predictable change to the crystal frequency. The Intersil RTC
family allows this adjustment over temperature since the
devices include on-chip load capacitor trimming. This control
is handled by the Analog Trimming Register, or ATR, which
has 6-bits of control. The load capacitance range covered by
the ATR circuit is approximately 3.25pF to 18.75pF, in
0.25pF increments. Note that actual capacitance would also
include about 2pF of package related capacitance. In-circuit
tests with commercially available crystals demonstrate that
this range of capacitance allows frequency control from
+116ppm to -37ppm, using a 12.5pF load crystal.
In addition to the analog compensation afforded by the
adjustable load capacitance, a digital compensation feature
is available for the Intersil RTC family. There are 3-bits
known as the Digital Trimming Register or DTR, and they
operate by adding or skipping pulses in the clock signal. The
range provided is ±30ppm in increments of 10ppm. The
default setting is 0ppm. The DTR control can be used for
coarse adjustments of frequency drift over-temperature or
for crystal initial accuracy correction.
A final application for the ATR control is in-circuit calibration for
high accuracy applications, along with a temperature sensor
chip. Once the RTC circuit is powered up with battery backup,
and frequency drift is measured. The ATR control is then
adjusted to a setting, which minimizes drift. Once adjusted at a
particular temperature, it is possible to adjust at other discrete
temperatures for minimal overall drift, and store the resulting
settings in the EEPROM. Extremely low overall temperature
drift is possible with this method. The Intersil evaluation board
contains the circuitry necessary to implement this control.
Layout Considerations
The crystal input at X1 has a very high impedance and will pick
up high frequency signals from other circuits on the board.
Since the X2 pin is tied to the other side of the crystal, it is also
a sensitive node. These signals can couple into the oscillator
0
SLAVE
ADDRESS
WORD
ADDRESS 1
A
C
K
A
C
K
S
T
A
R
T
S
T
O
P
SLAVE
ADDRESS
DATA
A
C
K
1
S
T
A
R
T
SDA BUS
SIGNALS FROM
THE SLAVE
SIGNALS FROM
THE MASTER
A
C
K
WORD
ADDRESS 0
1111
1111
0000000
FIGURE 25. RANDOM ADDRESS READ SEQUENCE
DATA
(2)
S
T
O
P
SLAVE
ADDRESS
DATA
(n)
A
C
K
A
C
K
SDA BUS
SIGNALS FROM
THE SLAVE
SIGNALS
FROM
THE MASTER
1
DATA
(n - 1)
A
C
K
A
C
K
(n IS ANY INTEGER GREATER THAN 1)
DATA
(1)
FIGURE 26. SEQUENTIAL READ SEQUENCE
ISL12027, ISL12027A
23
FN8232.8
August 12, 2010
circuit and produce double clocking or mis-clocking, seriously
affecting the accuracy of the RTC. Care needs to be taken in
layout of the RTC circuit to avoid noise pickup. Figure 27 shows
a suggested layout for the ISL12027 or ISL12026 devices.
The X1 and X2 connections to the crystal are to be kept as
short as possible. A thick ground trace around the crystal is
advised to minimize noise intrusion, but ground near the X1
and X2 pins should be avoided as it will add to the load
capacitance at those pins. Keep in mind these guidelines for
other PCB layers in the vicinity of the RTC device. A small
decoupling capacitor at the V
DD
pin of the chip is mandatory,
with a solid connection to ground (see Figure 27).
Oscillator Measurements
When a proper crystal is selected and the layout guidelines
above are observed, the oscillator should start up in most
circuits in less than one second. Some circuits may take slightly
longer, but start-up should definitely occur in less than 5s.
When testing RTC circuits, the most common impulse is to
apply a scope probe to the circuit at the X2 pin (oscillator
output) and observe the waveform. DO NOT DO THIS!
Although in some cases you may see a usable waveform, due
to the parasitics (usually 10pF to ground) applied with the
scope probe, there will be no useful information in that
waveform other than the fact that the circuit is oscillating. The
X2 output is sensitive to capacitive impedance so the voltage
levels and the frequency will be affected by the parasitic
elements in the scope probe. Applying a scope probe can
possibly cause a faulty oscillator to start-up, hiding other issues
(although in the Intersil RTC’s, the internal circuitry assures
startup when using the proper crystal and layout).
The best way to analyze the RTC circuit is to power it up and
read the real time clock as time advances. Alternatively the
frequency can be checked by setting an alarm for each minute.
Using the pulse interrupt mode setting, the once-per-minute
interrupt functions as an indication of proper oscillation.
Backup Battery Operation
Many types of batteries can be used with the Intersil RTC
products. 3.0V or 3.6V Lithium batteries are appropriate, and
sizes are available that can power a Intersil RTC device for
up to 10 years. Another option is to use a supercapacitor for
applications where V
DD
may disappear intermittently for
short periods of time. Depending on the value of
TABLE 8. CRYSTAL PARAMETERS REQUIRED FOR INTERSIL RTC’S
PARAMETER MIN TYP MAX UNITS NOTES
Frequency 32.768 kHz
Frequency Tolerance ±100 ppm Down to 20ppm if desired
Turnover Temperature 20 25 30 °C Typically the value used for most crystals
Operating Temperature Range -40 85 °C
Parallel Load Capacitance 12.5 pF
Equivalent Series Resistance 50 k
Ω For best oscillator performance
TABLE 9. CRYSTAL MANUFACTURERS
MANUFACTURER PART NUMBER TEMP RANGE (°C) +25°C FREQUENCY TOLERANCE (ppm)
Citizen CM201, CM202, CM200S -40 to +85 ±20
Epson MC-405, MC-406 -40 to +85 ±20
Raltron RSM-200S-A or B -40 to +85 ±20
SaRonix 32S12A or B -40 to +85 ±20
Ecliptek ECPSM29T-32.768K -10 to +60 ±20
ECS ECX-306/ECX-306I -10 to +60 ±20
Fox FSM-327 -40 to +85 ±20
FIGURE 27. SUGGESTED LAYOUT FOR INTERSIL RTC IN SO-8
C
1
01µF
U
1
ISL12027
XTAL1
32.768kH
Z
10k
R
1
ISL12027, ISL12027A
24
FN8232.8
August 12, 2010
supercapacitor used, backup time can last from a few days
to two weeks (with >1F). A simple silicon or Schottky barrier
diode can be used in series with V
DD
to charge the
supercapacitor, which is connected to the V
BAT
pin. Try to
use Schottky diodes with very low leakages, <1µA
desirable.
Do not use the diode to charge a battery (especially lithium
batteries!).
Note that whether a battery or supercap is used, if the V
BAT
voltage drops below the data sheet minimum of 1.8V and the
V
DD
power cycles to 0V then back to V
DD
voltage, then the
RESET
output may stay low and the I
2
C communications will
not operate. The V
BAT
and V
DD
power will need to be cycled
to 0V together to allow normal operation again.
There are two possible modes for battery backup operation,
Standard and Legacy mode. In Standard mode, there are no
operational concerns when switching over to battery backup
since all other devices functions are disabled. Battery drain
is minimal in Standard mode, and return to Normal V
DD
powered operations predictable. In Legacy modes the V
BAT
pin can power the chip if the voltage is above V
DD
and
V
TRIP
.
This makes it possible to generate alarms and
communicate with the device under battery backup, but the
supply current drain is much higher than the Standard mode
and backup time is reduced. During initial power-up, the
default mode is the Legacy mode.
I
2
C Communications During Battery Backup and
LVR Operation
Operation in Battery Backup mode and LVR is affected by
the BSW and SBIB bits as described earlier. These bits allow
flexible operation of the serial bus and EEPROM in battery
backup mode, but certain operational details need to be
clear before utilizing the different modes. The most
significant detail is that once V
DD
goes below V
RESET
, then
I
2
C communications cease regardless of whether the device
is programmed for I
2
C operation in battery backup mode.
Table 10 describes 4 different modes possible with using the
BSW and SBIB bits, and how they are affect LVR and battery
backup operation.
Mode A - In this mode, selection bits indicate a low V
DD
switchover combined with I
2
C operation in battery backup
mode. In actuality the V
DD
will go below V
RESET
before
switching to battery backup, which will disable I
2
C
ANYTIME the device goes into battery backup mode.
Regardless of the battery voltage, the I
2
C will work down
to the V
RESET
voltage (see Figure 29).
Mode B - In this mode, the selection bits indicate
switchover to battery backup at V
DD
<V
BAT
, and I
2
C
communications in battery backup. In order to
communicate in battery backup mode, the V
RESET
voltage
must be less than the V
BAT
voltage AND V
DD
must be
greater than V
RESET
. Also, pull-ups on the I
2
C bus pins
must go to V
BAT
to communicate. This mode is the same
as the normal operating mode of the X1228 device.
Mode C - In this mode, the selection bits indicate a low
V
DD
switchover combined with no communications in
battery backup. Operation is actually identical to Mode A
with I
2
C communications down to V
DD
= V
RESET
, then no
communications (see Figure 28).
Mode D - In this mode, the selection bits indicate
switchover to battery backup at V
DD
< V
BAT
, and no I
2
C
communications in battery backup. This mode is unique in
that there is I
2
C communication as long as V
DD
is higher
than V
RESET
or V
BAT
, whichever is greater. This mode is
the safest for guaranteeing I
2
C communications only when
there is a Valid V
DD
(see Figure 29).
FIGURE 28. SUPERCAPACITOR CHARGING CIRCUIT
V
DD
V
BAT
V
SS
SUPERCAPACITOR
2.7V TO 5.5V
ISL12027, ISL12027A

ISL12027AIB27Z-T

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Real Time Clock REAL TIME CLK/CLNDR W/EEPROM 2 63VSET
Lifecycle:
New from this manufacturer.
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